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Lead-free and halogen-free solder paste for electronic industry

A technology for the electronics industry and solder paste, applied in the field of flux chemicals for the electronics industry, can solve problems such as weak welding performance, and achieve the effect of reducing defects and improving wettability

Inactive Publication Date: 2010-06-16
SICHUAN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The purpose of the present invention is to provide a new type of lead-free and halogen-free soldering solder paste, which overcomes the shortcomings of existing halogen-free products with poor soldering performance

Method used

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  • Lead-free and halogen-free solder paste for electronic industry
  • Lead-free and halogen-free solder paste for electronic industry
  • Lead-free and halogen-free solder paste for electronic industry

Examples

Experimental program
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Effect test

Embodiment 1

[0034] In this embodiment, the alloy welding portion is alloy solder powder Sn96.5Ag3.0Cu0.5, its content is 88% (mass percentage), and the content of flux is 12% (mass percentage). The components of the flux and the content of each component are shown in Table 1. The solder powder and flux are thoroughly mixed to prepare a solder paste. The product should be refrigerated at 0-10 degrees Celsius.

Embodiment 2-3

[0036] In this embodiment, the alloy welding portion is alloy solder powder Sn99Ag0.3Cu0.7, its content is 88% (mass percentage), and the content of flux is 12% (mass percentage). The components of the flux and the content of each component are shown in Table 1. The solder powder and flux are thoroughly mixed to prepare a solder paste. The product should be refrigerated at 0-10 degrees Celsius.

Embodiment 4-5

[0038] In this embodiment, the alloy welding portion is alloy solder powder Sn96.5Ag3.8Cu0.7, its content is 88% (mass percentage), and the content of flux is 12% (mass percentage). The components of the flux and the content of each component are shown in Table 1. The solder powder and flux are thoroughly mixed to prepare a solder paste. The product should be refrigerated at 0-10 degrees Celsius.

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Abstract

The invention relates to a chemical soldering flux in the electronic industry, in particular to a solder paste used for arranging electronic elements and the alloy welding powder is lead-free alloy. The technical scheme of the invention is as follows: the lead-free and halogen-free solder paste for electronic industry comprises 85-94wt% of alloy welding powder and 6-15wt% of flux, wherein the flux comprises 20-60wt% of resin, 10-60wt% of solvent, 1-10wt% of rheology control agent, 0.1-40wt% of activator and the balance stabilizer; and the alloy welding powder is lead-free welding powder and is characterized in that the activator contains one or more of shikimic acid with the constitutional formula shown in formula I, shikimate with the constitutional formula shown in formula II and amide of shikimic acid with the constitutional formula shown in formula III. The beneficial effect of the invention is as follows: shikimic acid or a derivative thereof is used as the activator so as to increase the wettability of the halogen-free product so as to reduce bad effects caused by the solderability in production.

Description

technical field [0001] The invention relates to soldering flux chemicals used in the electronic industry, in particular to solder paste for electronic component installation, the alloy solder powder of which is a lead-free alloy. Background technique [0002] The electronics industry needs to install a large number of electronic components on the printed circuit board by soldering. Good and reliable solder joint formation requires wetting, diffusion and metallurgical bonding of molten solder on very clean metal surfaces. However, the possibility of oxidation of printed circuit boards, electronic components, or other metal surfaces that are welded is almost 100% during manufacturing, storage, transportation, and reproduction. Therefore, the treatment of the oxide layer on the surface of the welding material is very critical in the production of the electronics industry. It is often necessary to use a large amount of flux chemicals to clean the oxide layer and pollutants on t...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 黄艳李英卢志云邓小成郑伟民
Owner SICHUAN UNIV
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