Soldering flux and preparation method thereof

Abstract

The invention relates to a flux, in particular to a soldering flux and a preparation method thereof. In the soldering production process of electronic products, a flux containing halide is generally used; and after soldering, more residues are generated, and the residues contain halide ions to gradually cause such problems as reduction of electric insulation performance and short circuit. In order to realize the purpose of the invention, the invention provides the soldering flux; and the soldering flux comprises the following components in percentage by weight: 25-35% of rosin, 55-70% of ethanol, 2-6% of triethanolamine, and 1-3% of aniline. In addition, the invention further provides the preparation method of the soldering flux; and the flux prepared according to the formula and the method contains no halide ions, cannot gradually cause such problems as reduction of electric insulation performance and short circuit, has no need to clean the flux residues on an electronic printed board, is simple in components and preparation process, and is excellent in fluxing effect.

Description

technical field [0001] The invention relates to soldering flux, in particular to a soldering flux and a preparation method thereof. Background technique [0002] Since the metal surface will form a layer of oxide film after contact with air, the higher the temperature, the thicker the oxide layer. This layer of oxide film prevents liquid solder from infiltrating the metal, just as oil on the glass will prevent water from infiltrating the glass. Flux can help and promote the soldering process in the soldering process, and at the same time has a protective effect and can also prevent oxidation reactions. Flux can be divided into solid, liquid and gas. There are mainly several aspects such as "auxiliary heat conduction", "removal of oxides", "reduction of surface tension of welded materials", "removal of oil stains on the surface of welded materials, increase of welding area", and "prevention of re-oxidation". There are two key functions in this aspect: "removing oxides" and...

AI Technical Summary

Problems solved by technology

[0003] In recent decades, in the soldering process of electronic products, resin-based fluxes mainly composed of resins, halide-containing activators, additives and organic solvents are generally used. Although such fluxes have good solderability, The cost is low, but the residue after soldering is high. The residue contains halogen ions, which will gradually cause problems such as electrical insulation performance decline and short circuit. To solve this problem, the resin-based flux residue on the electronic printed board must be treated. Cleaning. This will not only increase production costs, but the cleaning agent used to clean resin-based flux residues is mainly fluorochlorine compounds. This compound is a depleting substance for the atmospheric ozone layer, which is banned and eliminated. Many companies still use it The process belongs to the aforementioned process of using tree finger flux solder and cleaning with cleaning agent, which has low efficiency and high cost