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Method for preparing copper-tungsten contact through electron beam infiltration

An electron beam and copper-tungsten technology, which is applied in the field of electron beam infiltration to prepare copper-tungsten contacts, can solve the problem that there is no application in the field of infiltration, and achieve the effects of avoiding element metallurgy, improving infiltration effect and saving time.

Active Publication Date: 2017-08-01
XIAN ZHIRONG METAL PRINTING SYST CO LTD
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AI Technical Summary

Problems solved by technology

[0004] At present, the technology using electron beam as heat source is mainly used in welding, phase deposition, drilling, additive molding and other fields, and has no application in the field of infiltration.

Method used

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  • Method for preparing copper-tungsten contact through electron beam infiltration
  • Method for preparing copper-tungsten contact through electron beam infiltration
  • Method for preparing copper-tungsten contact through electron beam infiltration

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Embodiment Construction

[0026] The following references are attached figure 1 And attached figure 2 , to further elaborate on various embodiments of the present invention.

[0027] in the attached figure 1 Among them, a method for preparing copper-tungsten contacts by electron beam infiltration includes the following sequential steps:

[0028] Step 1, preparing W-A (wt%) Cu contact material. First of all, it is necessary to set the mass fraction of copper, and express the mass fraction of copper as A, and calculate the content of the sample according to the diameter of the copper-tungsten contact, the height of the copper-tungsten contact, the density of the copper-tungsten contact, the density of the copper wire, and the diameter of the welding wire. The copper mass fraction requires the required copper wire length. We denote the diameter of the copper-tungsten contact, the height of the copper-tungsten contact, the density of the copper-tungsten contact, the density of the copper wire, the dia...

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Abstract

The invention discloses a method for preparing a copper-tungsten contact through electron beam infiltration. The method comprises the following steps in sequence: s1, preparing a contact material; s2, setting heat source parameters according to an electron beam fuse apparatus; s3, preheating a tungsten blank by continuous defocusing of an electron beam in a graphite boat; s4, adjusting an orientation relation between the electron beam and copper wires, and generating energy to convert molten metal copper wires by interaction between the high-speed-motion electron beam and copper wires; s5, moving a working platform at a constant speed; and s6, returning to the step s4 until the infiltration process is finished. The method has the advantages as follows: the electron beam infiltration method is particularly suitable for small-batch copper-tungsten alloy preparation of different mass fraction proportions, and only the copper wire lengths which can satisfy the mass fraction proportions need to be calculated in the manufacturing process; and meanwhile, the vacuum environment equipped in the electron beam apparatus is suitable for preparation of the copper alloy, so that oxidization can be avoided to the maximum degree and the infiltration effect can be improved.

Description

technical field [0001] The invention relates to the field of contact materials, in particular to a method for preparing copper-tungsten contacts by electron beam infiltration. Background technique [0002] Electrical contacts are important contact elements in high-voltage switches and circuit breakers. At present, the more mature high-voltage electrical contact materials are copper-tungsten composite materials. Copper-tungsten contact materials are widely used in various high-voltage switches and circuit breakers because of their good arc erosion resistance, welding resistance and high strength. The traditional preparation methods of copper-tungsten contact materials are powder metallurgy and infiltration method: ① powder metallurgy method: mix a certain amount of tungsten powder and copper powder and then press and sinter to form; ② infiltration method: tungsten powder is pressed in the mold Sintered into a tungsten skeleton blank with a certain porosity, stack it with a c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H1/025H01H1/023H01H11/04B22D23/04H01R43/00
CPCB22D23/04H01H1/023H01H1/025H01H11/04H01R43/00
Inventor 郭光耀卓君周宁王桢
Owner XIAN ZHIRONG METAL PRINTING SYST CO LTD
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