Method for preparing copper-tungsten contact through electron beam infiltration
An electron beam and copper-tungsten technology, which is applied in the field of electron beam infiltration to prepare copper-tungsten contacts, can solve the problem that there is no application in the field of infiltration, and achieve the effects of avoiding element metallurgy, improving infiltration effect and saving time.
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[0026] The following references are attached figure 1 And attached figure 2 , to further elaborate on various embodiments of the present invention.
[0027] in the attached figure 1 Among them, a method for preparing copper-tungsten contacts by electron beam infiltration includes the following sequential steps:
[0028] Step 1, preparing W-A (wt%) Cu contact material. First of all, it is necessary to set the mass fraction of copper, and express the mass fraction of copper as A, and calculate the content of the sample according to the diameter of the copper-tungsten contact, the height of the copper-tungsten contact, the density of the copper-tungsten contact, the density of the copper wire, and the diameter of the welding wire. The copper mass fraction requires the required copper wire length. We denote the diameter of the copper-tungsten contact, the height of the copper-tungsten contact, the density of the copper-tungsten contact, the density of the copper wire, the dia...
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