High performance leadless tin-copper solder for electronic elements

A lead electronic, high-performance technology, applied in the field of lead-free electronic solder, can solve problems such as imperfections, achieve good economy, improve physical properties and welding performance, and low resistivity.

Active Publication Date: 2005-02-23
四川朗峰电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these lead-free solders have effectively overcome the shortcoming of the toxicity of the trad

Method used

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Examples

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Embodiment Construction

[0008] Examples of the present invention are given below. For the convenience of comparison, the components and performance indicators of several existing lead-free solders are given at the same time.

[0009] This product

[0010] This product

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PUM

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Abstract

A high-performance lead-less Sn-Cu solder for the welding on PCB contains Cu (0.66-0.82 wt.%), Ni (0.02-0.03), P (0.001-0.002), Ti (0.0005-0.0009), RE (0.001-0.01), Gu (0.0001-0.0002), Ag (0.01-0.5) and Sn (rest).

Description

technical field [0001] The invention relates to a lead-free electronic solder used in the electronic industry in the field of soldering technology. Background technique [0002] In the electronics industry, traditional Sn63Pb solder is widely used to prepare circuit boards and solder electronic components. Because the lead in the Sn63Pb solder contains toxicity, it is detrimental to environmental protection and unfavorable to human health. For this reason, people have developed a lot of lead-free solders in recent years, such as the Sn96-Cu-Ag-In disclosed in the article "Development of Sn-Cu-Ag-In Lead-Free Solder" published in the first issue of "Zhejiang Metallurgy" in 2002. In lead-free solder, the Sn0.7 (Cu+ Ni) lead-free solder. Although these lead-free solders have effectively overcome the shortcoming of the toxicity of the traditional Sn63Pb solder, and various performance indicators have also been improved, they are not ideal. Contents of the invention [0003...

Claims

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Application Information

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IPC IPC(8): B23K35/24H05K3/34
Inventor 晏勇
Owner 四川朗峰电子材料有限公司
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