This invention discloses an
environmentally friendly cleaning process for
semiconductor ceramic structural components in the field of
semiconductor precision component
surface cleaning technology. The process uses deionized water,
citric acid monohydrate,
oxalic acid dihydrate, aminosulfonic acid, and
sodium gluconate to prepare a weak acid base solution, and adds
polyaspartic acid
silane complex micelles,
betaine tartaric acid corrosion inhibitor complex salts,
alkyl glycoside aqueous solution,
hydrogen peroxide aqueous solution, and
ammonia to prepare a weak acid composite cleaning solution. After pretreatment, reverse purging, replenishment washing, immersion cleaning, rinsing, megasonic bleaching, isopropanol
aqueous solution cleaning, spray rinsing, immersion rinsing, overflow rinsing,
drying, and post-treatment, this process can remove
polishing powder, alkaline deposits, particles, and organic residues from micropores, blind holes, grooves, and sealing surfaces of
ceramic structural components under
fluorine-free conditions, reducing cleaning
corrosion and
ion residues, and improving cleanliness and environmental friendliness.