45results about How to "High surface insulation resistance" patented technology

The invention relates to a halogen-free scaling powder used for a lead-free solder paste and a preparation method thereof. The halogen-free scaling powder used for the lead-free solder paste is characterized by being composed of the following components by weight percent: 25-55% of modified rosin, 3-12% of active agent, 0.1-3% of surface active agent, 2-6% of thixotropic agent, 0.01-3% of antioxidant, 0.1-2% of release agent, 30-50% of solvent and 0.1-5% of oil wetting agent, wherein the scaling powder does not contain halogen; the activity of the scaling powder can be obviously improved through adding organic carboxylic acid and hydroxy carboxylic acid as the active agent, and combining the active agent with the surface active agent; and in addition, the oil wetting agent is used, so that a layer of thin continuous oil membrane is enabled to cover the surface of a welding spot in a whole reflow soldering technological process of the solder paste, thereby playing an oxygen insulating function, and greatly improving the expansibility and the wetting property. The solder paste prepared by the scaling powder provided by the invention and a tin-silver-copper lead-free solder has the advantages of being good in printing performance, clean in demoulding, good in solderability and strong in wettability, having no penetrability corrosion in a bronze mirror after soldering, being high in soldering spot reliability and excellent in mechanical property, and capability of satisfying the high reliability requirements of high-end electronic products.

The invention provides a halogen-free soldering agent for tin bismuth system unleaded tin paste and a preparation method thereof. The halogen-free soldering agent for the tin bismuth system unleaded tin paste consists of 20-47% of rosin, 8-20% of thickening agent, 0.5-12% of antioxidant, 4-15% of organic acid, 0.2-3% of ethylhexyl isocaprylic acid, 6-14% of organic amine, 0.5-8% of surface active agent,4-10% of thixotropic agent and the balance solvent. By optimizing selection of an active system of the soldering agent, the halogen-free soldering agent for the tin bismuth system unleaded tin paste enables the tin paste prepared from the halogen-free soldering agent for the tin bismuth system unleaded tin paste and tin bismuth system unleaded tin powder to not only contain no halogen element such as fluorine, chlorine, bromine, iodine and astatine, but also have good welding ability in soldering, and then generates full and bright soldering spots, does not generate black oxides, and is high in surface insulation resistance after the soldering, and is specially suitable for assembly welding of electronic parts and components, which require low soldering temperature.

The invention discloses a high-performance halogen-free lead-free solder paste and a preparation method thereof. The halogen-free lead-free solder paste includes the following components in mass percentage: 80-90% of tin-based alloy powder, 2-5% of metal salt of hydroxy acid, 1-2% of acidic alkyl phosphate, hydroxyethylene 0.2-1% of diphosphonic acid, 0.5-1.5% of polyaniline, 0.1-0.5% of amine antioxidant, 0.5-2% of rheological additive, 2-4% of film forming agent and 3-8% of cosolvent. The solder paste of the present invention has high activity, low corrosiveness, and less residue, which can well solve the common problems of current low-temperature lead-free solder paste such as blackening of the periphery after soldering, a large number of tin beads, and a large number of residues, and can greatly reduce Reduce the defective rate of printing and improve the reliability of welding.

The invention discloses a solder paste with low dielectric loss and high reliability and a preparation method thereof. The technical solution is: 85.4-91.6wt% solder alloy powder, 8.4-14.6wt% flux, wherein the tin powder includes 2.5-4.1 wt% silver, 0.5‑2.6wt% copper, 6.5‑8.7wt% indium, 3.1‑4.7wt% zinc, 0.11‑0.25wt% molybdenum, 0.09‑0.19wt% vanadium, 0.08‑0.21wt% lutetium and the rest of tin, the flux includes 35.4‑42.6wt% rosin, 8.4‑14.6wt% organic acid, 1.8‑4.6wt% organic amine, 3.3‑6.1wt% thixotropic agent, 3.5‑6.8 wt% of thermosetting resin, 1.4-3.2wt% of antioxidant and the balance of organic solvent, the thermosetting resin is composed of 48-56wt% of cyanate resin and 44-52wt% of epoxy resin. There will be no corrosive residue on the board, and the prepared solder paste has low residue, low dielectric loss, high surface insulation resistance after soldering, and high reliability solder paste, which is suitable for use in 5G-related application scenarios.