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Halogen-free sulfur-free and lead-free solder paste

A sulfur lead-free solder paste and solder paste technology, which is applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problem that the solder paste on the pad is not full enough, it is easy to enter the blood and accumulate, and the stencil is not released from the mold. Clean and other problems, to achieve the effect of strong wettability, high expansion rate, no penetrating corrosion

Inactive Publication Date: 2018-06-15
SHENZHEN BANGDA TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At the beginning, solder paste was mainly leaded solder paste. If the manufacturing and processing of these leaded products, especially discarded electronic products, are not handled properly, lead and its lead ions will penetrate into the soil and pollute water sources, and lead to the "food" chain (through fish, shrimp, vegetables, etc.) and directly (breathing, drinking water, etc.) The mirror has problems such as corrosion, high surface insulation resistance, insufficient pad solder paste during the printing process, unclean stencil release, and unstable solderability

Method used

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  • Halogen-free sulfur-free and lead-free solder paste
  • Halogen-free sulfur-free and lead-free solder paste

Examples

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Embodiment 1

[0025] Embodiment 1, a kind of halogen-free sulfur-free lead-free solder paste, is the solder paste that is formed by mixing 87.5%-90.5wt% lead-free metal powder and 9.5%-12.5wt% solder paste body material, its characteristic That is, the lead-free metal powder is composed of Sn96.5wt%, Ag3.0wt%, Cu0.5wt%, hydrogenated rosin 20wt%, polymerized rosin 20wt%, water white rosin 5wt%, diethylene glycol diethylene glycol Butyl ether 10wt%, dioctyl adipate 25wt%, adipic acid wt5%, maleic acid 4wt%, octylphenol polyoxyethylene ether 2wt%, polyethylene glycol monoester 0.5wt%; thixotropic Agent 65003wt%, ethylene bis stearic acid amide 1.5wt%, 2,6-di-tert-butyl-4-methylphenol 1wt%, paraffin 0.5wt%, hydrogenated castor oil 2.5wt%.

[0026] Preferably, the ratio of solder paste: metal powder is =11:89;

[0027] Preferably, the lead-free metal powder is melted to form tin alloy tin balls by ultrasonic spraying, and then screened to obtain lead-free metal powder with a suitable particle s...

Embodiment 2

[0033] Embodiment 2, a kind of halogen-free, sulfur-free and lead-free solder paste is a solder paste formed by mixing 87.5%-90.5wt% lead-free metal powder and 9.5%-12.5wt% solder paste material, and its characteristics That is, Sn99.9wt%, Ag0.3wt%, Cu0.7wt% in lead-free metal powder, hydrogenated rosin 20wt%, polymerized rosin 20wt%, water white rosin 5wt%, diethylene glycol dibutyl ether in the solder paste material 10wt%, dioctyl adipate 25wt%, adipic acid wt5%, maleic acid 4wt%, octylphenol polyoxyethylene ether 2wt%, polyethylene glycol monoester 0.5wt%; thixotropic agent 65003wt %, ethylene bis stearic acid amide 1.5wt%, 2,6-di-tert-butyl-4-methylphenol 1wt%, paraffin 0.5wt%, hydrogenated castor oil 2.5wt%.

[0034] Preferably, the ratio of flux paste: metal powder is =11.3:88.7;

[0035] Preferably, the lead-free metal powder is melted to form tin alloy tin balls by ultrasonic spraying, and then screened to obtain lead-free metal powder with a suitable particle size, a...

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Abstract

The invention discloses halogen-free sulfur-free and lead-free solder paste. The halogen-free sulfur-free and lead-free solder paste is solder past formed by mixing 87.5-90.5 wt.% of lead-free metal powder and 9.5-12.5 wt.% of weld-aid paste materials. The halogen-free sulfur-free and lead-free solder paste is characterized in that the lead-free metal powder comprises, by weight, 96.5% of Sn, 3.0%of Ag, and 0.5% of Cu, and the weld-aid paste materials comprise, by weight, 25-55% of modified rosin, 3-12% of an active agent, 0.1-3% of a surface active agent, 2-6% of a thixotropic agent, 0.013%of an antioxidant, 0.1-2% of a release agent, and 30-50% of a solvent. The halogen-free sulfur-free and lead-free solder paste uses organic acid and hydroxy carboxylic acid as the active agent, and oil substances are wetting gent. The solder paste is not only without halogen, high in extension rate, and strong in wettability, but also a bronze mirror has no penetrating corrosion after welded, andthe surface has high insulation resistance. The weld-aid paste and the solder paste made from the lead-free and tin-free alloyed powder have the advantages of high weldability, high welding spot reliability, and good mechanical performance and the like, and the strict requirement of high reliability in modern electronic industry can be met.

Description

technical field [0001] The invention relates to the field of solder paste, in particular to a halogen-free, sulfur-free, lead-free solder paste. Background technique [0002] With the application of reflow soldering technology, solder paste has become the most important process material in surface mount technology (SMT), and along with the continuous miniaturization of electronic components and the increasingly sophisticated process, it has achieved rapid development. In the reflow soldering of surface mount components, solder paste is used to connect the leads or terminals of surface mount components to the pads on the printed board. Solder paste is a uniform solder alloy powder and stable flux. A paste formed by uniformly mixing the proportions. This material is very suitable for reliable soldering in automatic production of surface mount, and is a high-tech product of the current electronics industry. [0003] At the beginning, solder paste was mainly leaded solder past...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/02B23K35/26B23K35/36B23K35/362
CPCB23K35/025B23K35/262B23K35/3613B23K35/362
Inventor 梁凯梁国辉梁丹
Owner SHENZHEN BANGDA TECH CO LTD
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