The invention relates to a no-clean lead-free
tin welding wire and a preparation method thereof, wherein the lead-free
welding wire is composed of 2 to 3 percent of flux and 97 to 98 percent of lead-free solder. The lead-free solder is composed of 0.5 to 0.7 percent of Cu, 0.03 to 0.05 percent of Ni, 0.01 to 0.02 percent of P, 0.005 to 0.01 percent of Ga and the remnant amount of Sn. The No-clean flux is composed of 1.0 to 4.0 percent of
organic acid active agent, 0.5 to 5.0 percent of halogenated derivative active
solvent, 2.0 to 5.0 percent of heat-resistant resin , 1.0 to 4.0 percent of cosolvent, 2.0 to 5.0 percent of high
boiling point solvent and the remnant amount of modified
rosin. The cosolvent belongs to ester compound and the high
boiling point solvent is the mixed solvent of one or more of the SAF-25,
dioctyl sebacate,
benzyl benzoate,
dioctyl adipate. In the preparation of the
welding wire, the key point is first to form the alloys of Sn with other metals, and then the alloys can be added to the
tin for melting. The lead-free welding wire of the invention has good
heat resistance without
halogen, low flux spattering, low
odor, non-corrosive flux residue, strong practical feature, good electrical insulation after being welded, crack-free flux residue and high reliability.