No-cleaning lead-free solder soldering flux

A lead-free solder and flux technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve problems such as odor, easy splashing, residue, etc., and achieve excellent electrical insulation and heat resistance. , Low ion pollution, good weldability

Inactive Publication Date: 2009-03-25
太仓市首创锡业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to provide a kind of lead-free solder wire that can effectively cooperate with lead-free solder to form lead-free solder wire in order to overcome the poor heat resistance of lead-free solder wire and the shortcomings of easy splashing, odor and fire in the welding process. Flux for cleaning lead-free solder, which has good solderability, no amine odor, excellent electrical insulation and heat resistance, low ion pollution, especially no halogen ion residue in products after soldering

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] According to the no-cleaning lead-free solder flux of the present embodiment, it is made up of the component of following weight ratio:

[0023] Refined hydrogenated rosin 82%, benzoic acid 1.5%, adipic acid 1.0%, 12-hydroxystearic acid methyl ester 4.0%, oxidized polyethylene wax 2.0%, 5-chlorosalicylic acid 1.5%, dibromobutene di Alcohol 2.0%, butyl acetate 3.0%, SAF-25 3.0%.

[0024] The no-clean lead-free solder flux of the present embodiment is prepared by the following preparation method:

[0025] Add 82g of refined modified rosin into a container with a stirring and heater, heat and stir to completely melt the refined hydrogenated rosin, then add 3g of SAF-25 at 130-150°C, stir well, then add 1.5g of benzoic acid, 1g adipic acid, 1.5g 5-chlorosalicylic acid, 2g dibromobutenediol and 3g butyl acetate, stir well, and finally add 4g 12-hydroxystearic acid methyl ester and 2g oxidized polyethylene wax until Stir evenly to obtain the no-cleaning lead-free solder flu...

Embodiment 2

[0027] According to the no-cleaning lead-free solder flux of the present embodiment, it is made up of the component of following weight ratio:

[0028] Refined hydrogenated rosin 84.5%, adipic acid 2.5%, 5-chlorosalicylic acid 2.0%, dibromobutene glycol 2.0%, oxidized polyethylene wax 3.0%, ethyl butyrate 3.0%, SAF-25 3.0% .

[0029] The preparation method is the same as in Example 1.

Embodiment 3

[0031] According to the no-cleaning lead-free solder flux of the present embodiment, it is made up of the component of following weight ratio:

[0032] Refined hydrogenated rosin 85.5%, hexamic acid 1.5%, fumaric acid 1.0%, 5-chlorosalicylic acid 2.0%, dibromobutenedioic acid 2.0%, oxidized polyethylene wax 3.0%, butyl acetate 2% , SAF-25 3.0%.

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PUM

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Abstract

The invention relates to a no-clean lead-free solder flux which is composed of following components by weight ratio: 1.0 to 4.0 percent of the organic acid active agent, 0.5 to 5.0 percent of halogenated derivative active solvent, 2.0 to 5.0 percent of heat-resistant resin, 1.0 to 4.0 percent of cosolvent, 2.0-5.0 percent of high boiling point solvent and the remnant amount of modified rosin. The cosolvent belongs to ester compound and the high boiling point solvent is the mixed solvent of one or more of the SAF-25, dioctyl sebacate, benzyl benzoate, and dioctyl adipate. The flux can effectively work with the lead-free solder to form the lead-free welding wire. The invention has good welding property without amine odor, good electrical insulation and heat resistance, and low ion contamination level, and particularly has no halogenated ionic residues after be welded.

Description

technical field [0001] The invention relates to soldering flux, in particular to a no-cleaning lead-free soldering flux. Background technique [0002] In response to the global environmental protection law and the development requirements of the electronic information industry, it is an inevitable trend to realize lead-free electronic information products and electrical products. The melting point of lead-free solder is 30-40°C higher than that of lead-containing solder, which requires that the flux used for it must have excellent heat resistance and oxidation resistance. In the prior art, the activity of the flux is mainly increased by adding hydrogen halide salts of organic amines to the flux formula, but the active halogen ions remaining after soldering will remain in the soldering part, which will bring problems to high-reliability electronic products. In addition, in order to meet the requirements of lead-free soldering, the active dose of lead-free solder has increase...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
Inventor 王文明徐菊英王国银
Owner 太仓市首创锡业有限公司
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