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No-cleaning leadless solder and preparation method thereof

A lead-free soldering, no-cleaning technology, applied in the direction of welding equipment, welding medium, manufacturing tools, etc., can solve the problems of odor splashing, poor heat resistance of flux, etc., to reduce free energy, improve oxidation resistance, and improve plasticity and the effect of insulation resistance

Inactive Publication Date: 2009-03-25
太仓市首创锡业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This flux has good solderability, less particle residue, and high surface insulation resistance, but this flux still has problems such as poor heat resistance, odor, and large spatter

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The no-clean lead-free solder wire according to this embodiment is composed of 2.5% flux and 97.5% lead-free solder, wherein:

[0026] The lead-free solder is composed of 0.7% of Cu, 0.03% of Ni, 0.005% of Ga, 0.01% of P and the balance of Sn, all of which are in mass percentage.

[0027] The flux consists of 82% refined hydrogenated rosin, 1.5% benzoic acid, 1.0% adipic acid, 4.0% methyl 12-hydroxystearate, 2.0% oxidized polyethylene wax, 1.5% 5-chlorosalicylic acid, dibromo 2.0% butylene glycol, 3.0% butyl acetate and 3.0% SAF-25.

[0028] The preparation method of no-cleaning lead-free solder wire comprises the following steps:

[0029] (1) Preparation of flux: Add 82g of refined modified rosin into a container with stirring and heater, heat and stir to completely melt the refined modified rosin, then add 3g of SAF-25 at 130°C, and stir evenly , add 1.5g benzoic acid, 1g adipic acid, 1.5g 5-chlorosalicylic acid, 2g dibromobutenediol and 3g butyl acetate, stir evenl...

Embodiment 2

[0033] Lead-free solder wire consists of 2.5% flux and 97.5% lead-free solder.

[0034] The composition of lead-free solder is: 0.6% Cu, 0.04% Ni, 0.005% Ga, 0.01% P and the balance is Sn.

[0035] The composition of flux is: refined hydrogenated rosin 84.5%, adipic acid 2.5%, 5-chlorosalicylic acid 2.0%, dibromobutene glycol 2.0%, oxidized polyethylene wax 3.0%, ethyl butyrate 3.0% and SAF-25 3.0%.

[0036] The preparation method of no-cleaning lead-free solder wire comprises the following steps:

[0037] (1) Preparation of flux: Add 84.5g of refined modified rosin into a container with stirring and heater, heat and stir to completely melt the refined modified rosin, then add 3g of SAF-25 at 150°C, and stir evenly Finally, add 2.5g of adipic acid, 2g of 5-chlorosalicylic acid, 2g of dibromobutene glycol and 3g of butyl acetate, stir evenly, and finally add 3g of oxidized polyethylene wax, and stir until evenly to obtain the flux.

[0038] (2) Preparation of lead-free solde...

Embodiment 3

[0041] Lead-free solder wire consists of 3% flux and 97% lead-free solder.

[0042]The composition of lead-free solder is: 0.5% Cu, 0.05% Ni, 0.01% Ga, 0.02% P and the balance is Sn.

[0043] The composition of flux is: refined hydrogenated rosin 85.5%, hexamic acid 1.5%, fumaric acid 1.0%, 5-chlorosalicylic acid 2.0%, dibromobutenedioic acid 2.0%, oxidized polyethylene wax 3.0% , butyl acetate 2%, SAF-25 3.0%.

[0044] The preparation method is the same as in Example 2.

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PUM

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Abstract

The invention relates to a no-clean lead-free tin welding wire and a preparation method thereof, wherein the lead-free welding wire is composed of 2 to 3 percent of flux and 97 to 98 percent of lead-free solder. The lead-free solder is composed of 0.5 to 0.7 percent of Cu, 0.03 to 0.05 percent of Ni, 0.01 to 0.02 percent of P, 0.005 to 0.01 percent of Ga and the remnant amount of Sn. The No-clean flux is composed of 1.0 to 4.0 percent of organic acid active agent, 0.5 to 5.0 percent of halogenated derivative active solvent, 2.0 to 5.0 percent of heat-resistant resin , 1.0 to 4.0 percent of cosolvent, 2.0 to 5.0 percent of high boiling point solvent and the remnant amount of modified rosin. The cosolvent belongs to ester compound and the high boiling point solvent is the mixed solvent of one or more of the SAF-25, dioctyl sebacate, benzyl benzoate, dioctyl adipate. In the preparation of the welding wire, the key point is first to form the alloys of Sn with other metals, and then the alloys can be added to the tin for melting. The lead-free welding wire of the invention has good heat resistance without halogen, low flux spattering, low odor, non-corrosive flux residue, strong practical feature, good electrical insulation after being welded, crack-free flux residue and high reliability.

Description

technical field [0001] The invention relates to a no-cleaning lead-free solder wire and a preparation method thereof. Background technique [0002] At present, the lead-free solder wire is composed of lead-free solder and no-cleaning flux. When the lead-free solder is extruded into a filament by a cold press, the liquid no-cleaning flux is simultaneously squeezed into the hollow core of the lead-free soldering wire. , filled to form a no-clean lead-free solder wire, and finally drawn to make a certain specification of lead-free solder. [0003] Lead-free solder wires at home and abroad have problems such as large flux spatter, a large amount of halide added, a lot of smoke, the flux contains halogen, the residual flux is prone to cracks, low insulation resistance, and high corrosion. [0004] The Chinese invention patent application with application number 200710035046.7 discloses a halogen-free no-clean flux for lead-free solder, which mainly consists of organic acid activ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24B23K35/26B23K35/362B23K35/40
Inventor 王文明徐菊英王国银
Owner 太仓市首创锡业有限公司
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