Polishing layer of chemical-mechanical polishing pad and application of polishing layer

Abstract

The invention provides a polishing layer of a chemical-mechanical polishing pad and application of the polishing layer. The polishing layer is prepared by the reaction of isocyanate prepolymer, a curing agent and functional filling; the isocyanate prepolymer is prepolymer prepared by the reaction of raw materials including diisocyanate, polyether ester polyol and optional small molecular polyol; the curing agent is dispersion liquid formed in dioctyl adipate by a complex of diamine compound and sodium chloride, wherein concentration of the complex is 40 wt%-50 wt%; and the functional filling is expanded polymer hollow microspheres. The polishing layer has higher mechanical strength and abrasive resistance while having high elasticity and hydrolysis resistance, so that the durability of thepolishing layer is good.

Description

technical field [0001] The present invention relates to polishing layers of polishing pads that can be used to polish and planarize substrates such as semiconductor substrates or magnetic disks. Background technique [0002] Semiconductor production typically includes some chemical mechanical planarization (CMP) process. During each CMP process, the polishing pad is planed together with a polishing fluid (eg, an abrasive-containing polishing slurry or an abrasive-free activating fluid) to remove excess material or maintain its planarity for subsequent acceptance of a new layer. The stack of these layers is brought together in such a way as to form an integrated circuit. The fabrication of these semiconductor devices is becoming increasingly complex due to the demand for devices with higher operating speeds, lower leakage currents, and lower power consumption. On the structural side of the device, this means finer geometry and metallization of features. These increasingly ...

AI Technical Summary

Problems solved by technology

In the selection of polyols, polyether polyols are preferred due to the consideration of hydrolysis resistance and elasticity, but the strength and wear resistance of the prepared polishing pads are slightly poor, and the service life of the polishing pads is short

Compared with polyether polyols, polyester polyols have stronger crystallinity due to having more strong polar groups, so the prepared polishing pads have higher hardness, mechanical strength and wear resistance; however , the polishing pad prepared with polyester polyol is not resistant to hydrolysis because of its polyester polyol (the polishing pad will contact the polishing liquid during the polishing process, and the main component of the polishing liquid is water), so the prepared polishing pad is also not resistant to hydrolysis. Once the polishing pad is hydrolyzed, its strength and wear resistance will drop sharply, directly affecting the polishing rate and polishing quality as well as the life of the polishing pad

In addition, due to the violent reaction between the isocyanate-terminated urethane prepolymer and the polyamine during curing, the gel time is short, so the formation of pores in the polishing pad will be unevenly distributed, resulting in hardness and density distribution of the polishing pad. Unevenness, affecting the polishing effect

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