591 results about "Low temperature curing" patented technology

The invention discloses low-temperature curing type conductive silver-coated copper slurry for a photovoltaic cell and a preparation method of the low-temperature curing type conductive silver-coated copper slurry, and belongs to the technical field of metallization of photovoltaic cells. The silver-coated copper paste comprises the following components in percentage by mass: 50-80% of micron spherical silver-coated copper powder, 5-30% of submicron spherical silver powder, 1-15% of micron flaky silver-coated copper powder, 2-20% of micron flaky silver powder and the balance of an organic carrier, and the organic carrier comprises the following components in percentage by mass: 2-5% of epoxy resin and 0.5-1.5% of auxiliary resin. According to the silver-coated copper paste and the preparation method thereof, the silver-coated copper paste with good comprehensive performance such as conductivity, printability, thixotropy and weather resistance is prepared by optimizing the raw material ratio and combining a proper preparation method, so that the silver-coated copper paste has more comprehensive performance in the subsequent use process, and the use performance of an HJT photovoltaic cell is finally improved.

The invention belongs to the field of electrode paste preparation, and provides low-temperature curing silver-coated copper paste for a heterojunction solar cell and a preparation method of the low-temperature curing silver-coated copper paste. Ethyl cellulose is adopted as a matrix material, a stable matrix network is provided for slurry through good cohesiveness and dispersity of ethyl cellulose, and a network structure with a high crosslinking degree is formed by adding modified phenolic resin, organic silicon modified epoxy acrylate and other chemical modification materials into the slurry. The mechanical strength and adhesive force of the slurry are further enhanced, surface modification is carried out on inorganic filler such as silver-coated copper powder and bismuth oxide through a silane coupling agent and a titanate coupling agent, and the interface bonding force between the filler and an organic matrix is enhanced through silicon-oxygen bonds formed on the surface of the filler; by adding the carboxylated polyamide wax and the organic bentonite, the agglomeration tendency of the filler is reduced by utilizing the adsorption and electrostatic repulsion effects of the carboxylated polyamide wax and the organic bentonite on filler particles, and the obtained conductive slurry has the characteristics of excellent conductivity and low-temperature rapid curing.

The invention relates to a low-temperature curing polyimide precursor solution and a preparation method thereof. The method comprises the following steps: carrying out condensation polymerization reaction on a dianhydride monomer and a diamine monomer in a reaction solvent to obtain a polyamide acid solution; and adding an amino compound containing one or more special functional groups of pyridine, imidazole, quinoline, pyrimidine and azine into the polyamide acid solution, and fully stirring to enable amino in the compound to fully react with carboxyl in a polyamide acid molecular chain, thereby obtaining the polyimide precursor solution capable of being cured at low temperature. According to the preparation method, the curing temperature of polyimide can be greatly reduced, meanwhile, the mechanical property of the material can be improved, the thermal expansion coefficient can be reduced, and the preparation method can be used for preparing polyimide binders, photoresist, electronic packaging, resin, films, fibers and aerogel.

The invention discloses an amido amine underwater curing agent for epoxy resin and a preparation method of the amido amine underwater curing agent, and belongs to the field of epoxy resin curing agents. The invention discloses a high-temperature-resistant phenolic resin, which is prepared from the following components in parts by mass: 20 to 50 parts of amine, 20 to 50 parts of single acid, 10 to 40 parts of phenolic compound and 5 to 20 parts of phenolic resin, and the amine is at least one of aliphatic amine, alicyclic amine and aromatic amine. The method comprises the following steps: reacting amine with single acid at high temperature to generate amido amine, and further dehydrating at the temperature to synthesize imidazoline. And the content of imidazoline is controlled through the water yield. And cooling to 120-140 DEG C, and adding the phenolic compound to further react with the phenolic resin. According to the invention, the stability of the imidazoline content is controlled by controlling the water yield of the reaction, and the imidazoline content is the key for solving the underwater bonding performance of the epoxy resin adhesive. The low-temperature curing characteristic and flexibility of the curing agent are improved by introducing different amines, and the curing agent can be better applied to protection, reinforcement and waterproofing of underwater buildings, so that the service life of underwater facilities is prolonged.

The invention discloses silver powder with coexisting submicron sheets and nano-particles and a preparation method of the silver powder, and belongs to the technical field of silver powder preparation. A silver nitrate solution is added into a dispersing agent solution, then a directional end-capping reagent solution is added, and nucleation and growth of submicron sheets and nano-particles are controlled through the types of dispersing agents, the types of directional end-capping reagents, the temperature gradient and the like. The diameter of the prepared flaky silver powder ranges from 0.1 micrometer to 1.5 micrometers, the thickness of the flaky silver powder ranges from 30 nm to 120 nm, and the flaking rate ranges from 30% to 90%. And the particle size of the spherical silver powder is 30-150 nm. According to the preparation method of the silver powder, a silver nanocrystal seed solution does not need to be prepared independently, and the silver powder is different from common silver powder with single morphology, can be used for preparing the flake-shaped and particle-shaped coexisting silver powder in one pot, and is suitable for being used as a conductive functional phase of low-temperature curing type electronic paste.

The invention relates to the field of adhesives, and discloses a lightweight vibration and noise reduction structure bonding adhesive and a preparation method thereof.According to the adhesive, epoxy resin serves as a matrix, high-damping resin, rubber and filler are added, and the adhesive not only can provide strong structure bonding force, but also has excellent vibration and noise reduction performance. A low-temperature curing system is adopted, and the curing agent and the accelerant which are high in reactivity and stable in storage are used, so that the adhesive can be cured at the low temperature of 130 DEG C, energy is saved, and the curing efficiency is improved. The adhesive is suitable for the industries of automobiles, buildings and the like, can effectively solve the problems of vibration and noise reduction and insufficient bonding performance in the prior art, and has a wide application prospect.

The invention provides low-silver-content conductive paste for a low-temperature curing HJT battery and a preparation method of the low-silver-content conductive paste, and belongs to the technical field of polymer-based electronic paste materials and HJT efficient battery materials. The low-silver-content conductive paste is composed of the following components in percentage by weight: 52-80% of micron-sized silver-coated copper ball powder, 14-42% of submicron-sized spherical silver powder, 1-3% of an organic solvent, 0.5-2% of a curing agent, 2.5-4% of resin and 0-1% of an auxiliary agent. The micron-sized silver-coated copper ball powder is spherical, and the median particle size is 4-6 microns; the submicron spherical silver powder is in a spherical shape or a sheet shape or a combination of the spherical shape and the sheet shape. The median particle size of the submicron spherical silver powder ranges from 100 nm to 900 nm. The prepared HJT conductive paste can be cured at the low temperature of 150-200 DEG C and has good conductivity, printing performance and adhesive force, the silver content in the paste is only 30-50%, the production cost of a solar cell is greatly reduced, and popularization of the heterojunction solar cell is effectively promoted.

The invention discloses a preparation method of an ultra-infiltration nano coating, and relates to the field of ultra-infiltration nano coatings, and the preparation method comprises the following steps: S1, base material pretreatment, S2, nano material dispersion liquid preparation, S3, coating: adopting an impregnation method, a spraying method or a spin-coating method to attach the nano material dispersion liquid prepared in the step S2 to the surface of the base material pretreated in the step S1, and S4, low-temperature curing to obtain the ultra-infiltration nano coating. And S5, surface modification: carrying out hydrophobic modification or hydrophilic modification on the base material subjected to low-temperature curing in the step S4 according to the type of the base material. The effect of enhancing the adhesive force of the base material and the coating is achieved through the means of pretreating the base material, it is ensured that nano particles of the dispersion liquid are always uniformly dispersed through preparation of the nano material dispersion liquid and the coating, coating is conducted through proper methods such as dipping, spraying and spin coating, and then low-temperature curing is conducted; the effect of constructing a stable porous nano-structure coating with excellent performance is achieved, and meanwhile, different requirements are met through multiple coating modes.

The invention discloses a low-temperature curing high-throwing-power cathode electrophoretic coating and a preparation method and application thereof, and belongs to the field of automobile coating materials, the coating is composed of epoxy resin, a fluorosilicone copolymerization type epoxy modifier, a polyamino siloxane-acrylic acid hybrid and other components, and performance improvement is achieved through the synergistic effect of the two brand-new modifiers. Wherein the fluorine-silicon copolymerization type epoxy modifier is prepared by taking bisphenol A epoxy resin as a framework, introducing fluorine-containing alkyl and siloxane groups and carrying out ultraviolet reaction, so that the surface energy is reduced, and low-temperature crosslinking is promoted; the polyamido siloxane-acrylic acid hybrid takes siloxane as a core, and acrylic acid and polyamido are bridged through isocyanate, so that the crosslinking density and the water solubility are enhanced. When the coating is prepared, the two modifiers are mixed with epoxy resin, a solvent and the like, and the coating is prepared through dispersion and dilution. The coating can be cured at low temperature, so that a uniform thick film is obtained in an inner cavity of a complex workpiece, and meanwhile, the coating has excellent corrosion resistance and adhesive force and is suitable for efficient and environment-friendly coating of an automobile body and parts.

The invention discloses a low-temperature curing PVC plastisol composition for a vehicle and a preparation method of the low-temperature curing PVC plastisol composition. The invention relates to a low-temperature curing PVC plastisol composition for vehicles, which is prepared from the following raw materials in parts by weight. Comprising 5 to 15 parts of polyvinyl chloride-vinyl acetate copolymer resin, 5 to 15 parts of homopolymerized PVC paste resin, 1 to 10 parts of blended PVC paste resin, 30 to 40 parts of a compound plasticizer, 1 to 10 parts of a hydrocarbon solvent, 0.5 to 1.5 parts of terminated polyurethane, 0.5 to 2 parts of polyamide, 0.5 to 1 part of a thixotropic agent, 30 to 45 parts of an inorganic filler, 1 to 5 parts of a stabilizer and 1 to 5 parts of a moisture absorbent. The compound plasticizer is prepared from diethylene glycol dibenzoate, isodecyl benzoate and diisononyl phthalate. The PVC plastisol composition disclosed by the invention is a low-temperature and short-time curing material, and can be cured under the conditions that the baking temperature is 125 DEG C and the baking time is 20 minutes.

The invention relates to the technical field of coatings, in particular to a low-temperature curing anticorrosive coating and a preparation method thereof. The coating is composed of a component A and a component B, and the mass ratio of the component A to the component B is 100: (3-50.8); the component A comprises the following components in parts by weight: 25-35 parts of epoxy resin, 40-72 parts of pigment filler, 2.3-4.5 parts of an auxiliary agent and 10-14 parts of a solvent; the component B is a modified phenolic aldehyde amine curing agent; the epoxy resin is used as a main film-forming substance and is matched with the modified phenolic aldehyde amine curing agent to prepare the low-temperature curing epoxy coating, so that the problem that the epoxy coating cannot be cured at the temperature lower than-10 DEG C is solved, and a coating formed by the coating provided by the invention has good mechanical properties, salt spray resistance, high and low temperature resistance and the like.

The invention discloses low-temperature curing silver-coated copper composite slurry and a preparation method thereof. The conductive adhesive comprises the following raw material components in percentage by weight: 60-80% of conductive phase, 2-2.8% of adhesive, 5-10% of resin and 3-8% of additive, and 20%-30% of a solvent. Wherein the conductive phase is formed by compounding spherical silver-coated copper powder and flaky silver powder, and the silver content is reduced and the sheet resistance of the silver-coated copper composite conductive paste is below 25m omega / square through a copper matrix surface silver plating process. A step-by-step mixing technology is adopted in the preparation process, resin and a solvent are dispersed at a high speed at 60 DEG C, then conductive powder is introduced to avoid agglomeration, and a uniform and compact conductive network is finally formed after grinding. After being cured at the low temperature of 130-180 DEG C, the paste has excellent adhesive force and durability, can be applied to the fields of heterojunction solar cells, flexible circuits and the like, and remarkably improves the photoelectric conversion efficiency and the processing adaptability.

The invention relates to the field of powder coatings, and particularly discloses a slow-release coated heat-curable powder coating catalyst composition, a powder coating and a preparation method of the powder coating. The slow-release coated heat-curable powder coating catalyst composition comprises: i) a component A, which is an inner core coated object and comprises at least one basic catalyst capable of promoting the ring-opening reaction of epoxy resin, and i) a component B, which is an outer core coated object and comprises at least one basic catalyst capable of promoting the ring-opening reaction of epoxy resin; ii) a component B, which is a coated shell comprising at least one crystalline solid unsaturated polyester resin or a semi-crystalline solid unsaturated polyester resin; the component C is a coating medium and comprises at least one alkane wax.The low-temperature powder coating can be cured at the ultralow temperature, the curing temperature is as low as 90-120 DEG C, the storage time of the low-temperature powder coating is effectively prolonged, and the requirement of a normal powder coating process is met.

The present invention belongs to the technical field of coating protection, and discloses a wear-resistant micro-nano structure super-hydrophobic coating with photothermal effect and a preparation method thereof. The method comprises the following steps: spin coating a defoamed PDMS prepolymer and a curing agent mixture onto a substrate for pre-curing treatment; adding micron carbon black particles or nano carbon black particles with photothermal effect into an organic solvent for ultrasonic dispersion to obtain a dispersion; spraying a micron carbon black dispersion on the surface of a substrate coated with PDMS, and then spraying a nano carbon black dispersion to obtain a coating with a micro-nano structure and a photothermal effect; then spraying a layer of PDMS prepolymer and a curing agent mixture diluted with an organic solvent on the surface, and curing at low temperature to enhance the wear resistance and mechanical stability of the coating. The coating prepared by the present invention has good super-hydrophobicity and wear resistance and durability; the photothermal effect significantly increases the temperature of the substrate under the action of sunlight, and has good application prospects in anti-icing.

The invention relates to the technical field of coatings, in particular to a low-temperature curing type fluorocarbon coating for an aluminum alloy and a preparation method of the low-temperature curing type fluorocarbon coating. The preparation method comprises the following steps: adding eugenol, potassium carbonate and decafluorobiphenyl to obtain modified biphenyl; and adding m-chloroperoxybenzoic acid to prepare the reinforcing agent. And performing surface modification on the linear silicon dioxide filler, the flaky silicon dioxide filler and the dendritic silicon dioxide filler by using gamma-epoxypropoxy propyl trimethoxy silane to obtain the epoxy modified wear-resistant filler. The preparation method comprises the following steps: adding epoxy resin and the epoxy modified wear-resistant filler into xylene, ultrasonically stirring, adding fluorocarbon resin, a reinforcing agent and a curing agent, and continuously ultrasonically stirring to obtain the fluorocarbon coating. The fluorocarbon coating prepared by the invention has good adhesion performance, wear resistance and mechanical strength, so that the fluorocarbon coating has a wide application prospect in the technical field of coatings.

The invention relates to the field of photovoltaic cells, and particularly discloses low-temperature cured copper paste and a preparation method and application thereof. The copper paste is prepared from the following raw material components in parts by weight: 85 to 95 parts of copper powder, 2 to 8 parts of a carrier, 2 to 5 parts of a solvent, 0.1 to 3 parts of a curing agent, 0.01 to 0.05 part of an accelerant, 0.5 to 1.5 parts of zinc borate, 0.1 to 0.5 part of nickel nitrate, 0.05 to 0.15 part of ethylenediamine, 0.05 to 0.15 part of diammonium hydrogen phosphate and 0.1 to 0.3 part of citric acid, wherein the purity of the copper powder is 99%-99.9%. The preparation method of the low-temperature cured copper paste comprises the following steps: respectively adding the curing agent, the accelerant, the solvent, the zinc borate, the nickel nitrate, the ethylenediamine, the diammonium hydrogen phosphate, the citric acid and other raw materials into the carrier, uniformly stirring and mixing, then adding the copper powder, mixing and stirring, grinding, and stirring to obtain the low-temperature cured copper paste.

The invention relates to the technical field of sodium ion battery negative electrode materials, and discloses an in-situ doped pre-oxidized heavy organic matter hard carbon preparation method which comprises the following steps: step 1, low-temperature oxidation: obtaining a pre-oxidized carbon material after heat treatment is finished; step 2, element doping: obtaining a hard carbon precursor doped with a sulfur element; step 3, low-temperature curing: obtaining a cured sulfur element doped pre-oxidized heavy organic matter hard carbon precursor; step 4, high-temperature carbonization: obtaining a sulfur element doped pre-oxidized heavy organic matter hard carbon precursor material with a stable structure; the medium-temperature coal pitch is oxidized at low temperature to obtain the pre-oxidized carbon material, then the sulfur element doped material reacts with the medium-temperature coal pitch at low temperature, hydrogen ions of the medium-temperature coal pitch are substituted by sulfur to form relatively stable chemical bonds, and the continuity of the chemical bonds is beneficial to enhancing the stability of the structure; sulfur atom doping not only provides active sites and increases sodium storage capacity, but also expands interlayer spacing and improves rate capability.

The invention discloses a preparation method and application of repairable low-temperature curing slurry based on liquid metal microcapsules and conductive filler, and belongs to the field of flexible circuits. The invention aims to solve the problems that the existing liquid metal and conductive filler are poor in compatibility, agglomeration or intermetallic compounds are easy to form, the repairing effect generated in the circuit deformation process is greatly weakened, and small-particle-size liquid metal particles are difficult to crack and repair the circuit in the circuit deformation process. The method comprises: 1, preparing an elastomer solution; 2, preparing a liquid metal capsule; and 3, preparing the liquid metal capsule / conductive filler / elastomer ink. The method is applied to plane printing, complex structure surface printing and multi-layer stretchable flexible circuit printing. The invention is used for preparation and application of the repairable low-temperature curing slurry based on the liquid metal microcapsule and the conductive filler.

The invention provides a latent curing agent based on a dynamic crosslinking-controllable dissolution mechanism. The latent curing agent at least comprises a reaction product of a component with a maleimide structure, a component with a furan ring structure and an amine component with at least two amino groups or imino groups, and the reaction product has a dynamic cross-linked network structure containing a Diels-Alder addition structure. Compared with the prior art, the latent curing agent provided by the invention can be used for realizing long-term storage and medium and low temperature curing of a single-component thermosetting material, and especially when the latent curing agent is applied to an epoxy-anhydride system, an epoxy-phenolic aldehyde system and an epoxy-dicyandiamide system, not only is the curing temperature reduced, but also the storage life is longer, and the curing effect is better. Meanwhile, the preparation process of the latent curing agent is simple, easy and convenient to operate, good in controllability, easy to implement and suitable for large-scale industrial production.

The invention provides a preparation method and application of a novel crystal glass surface nano self-cleaning coating, and belongs to the technical field of self-cleaning coatings, the method comprises the following steps: (1) pretreatment of a base material: cleaning the glass surface by adopting oxygen plasma, removing organic matters and activating; (2) spraying a bottom coating: mixing 10-15 parts of nano silicon dioxide sol and 3-5 parts of a silane coupling agent, and curing at 120-150 DEG C for 30 minutes after spraying; (3) coating a functional layer; and (4) post-treatment: after ultraviolet curing, carrying out heat treatment at 180-200 DEG C for 10 minutes to form a compact cross-linked structure. Through material innovation (such as nitrogen-doped titanium dioxide and a dynamic disulfide bond ultraviolet light absorber) and process optimization (low-temperature curing and electrostatic atomization), the three major problems of single function, short service life and complex process of a traditional coating are solved, meanwhile, the coating is expanded to the scenes of photovoltaics, automobiles, buildings and the like, and the comprehensive advantages of being efficient, self-cleaning, long-acting, durable and environmentally friendly are achieved.

The present invention addresses the problem of providing: an epoxy resin composition which exhibits good low temperature curability even if a specific trithiol compound is contained therein; and an adhesive, a sealing material, a cured product, a semiconductor device and an electronic component that contain the epoxy resin composition.　Provided are: an epoxy resin composition that contains (A) a thiol compound represented by chemical formula (I), (B) a thiol compound having an isocyanuric acid skeleton, (C) an epoxy resin and (D) a latent thermal curing catalyst; and an adhesive, a sealing material, a cured product, a semiconductor device and an electronic component that contain the epoxy resin composition.

The invention discloses a low-temperature curing photoresist applied to a flexible display panel and a preparation method of the low-temperature curing photoresist, and belongs to the technical field of energy conservation and environmental protection. The photoresist is prepared by compounding a reactive organic-inorganic mixed nano filler, a photosensitive resin matrix, a benzocyclobutenyl silicone oligomer (BSA resin) and an additive. The preparation method comprises the following steps: preparation and surface modification of the nanofiller; synthesizing a photosensitive resin matrix; compounding the oligomer with an additive; dispersing the slurry and adding a nano corrugated template; spin coating, ultraviolet pre-curing, low-temperature baking and heat post-curing are carried out. The curing temperature of the photoresist is lower than 120 DEG C, the resolution ratio is superior to 3 microns, and the bending tolerance frequency is gt; the adhesion strength is gt after 20000 times; 15 Kgf / cm < 2 >, and the water vapor permeability is lt; 10 <-6 >, heat resistance gt; the temperature is 150 DEG C, and the dielectric constant is lt; 3.5, VOC (Volatile Organic Compounds) emission lt; the organic light-emitting material has excellent flexibility, thermal stability and environmental protection performance, is suitable for a pixel definition layer of an OLED flexible display panel, and improves the light extraction efficiency and the anti-fatigue performance.

The invention discloses an anti-natural gas hydrate coating which is obtained by coating the inner surface of a pipeline with a coating which can release phase change latent heat when the temperature drops and then curing the coating at low temperature, and the coating comprises the following raw materials in percentage by mass: 100% of dimethyl sulfoxide aqueous solution, 10% of gelatin and 10% of waterborne polyurethane. The mass fraction of the dimethyl sulfoxide aqueous solution is 60-90 wt%, the mass fraction of the waterborne polyurethane is 5-20 wt%, and the balance is gelatin. When the temperature drops, latent heat of phase change can be released, delayed freezing of the hydrate is achieved, the adhesive force of the hydrate is reduced, the self-repairing characteristic is achieved, and the problems that due to the too low temperature, the hydrate and the surface structure of the super-hydrophobic coating are mechanically interlocked, and the interior of the surface texture is coagulated are solved; and the problem of poor recycling performance of the existing super-hydrophobic coating is also solved.

The invention discloses a low-temperature curable bismaleimide resin-based composite material surface film and a preparation method thereof, relates to the field of bismaleimide resin composite material surface films, and aims at solving the problem that the curing temperature of an existing bismaleimide resin composite material surface film is too high. The surface film is composed of bismaleimide resin, an allyl compound, thermoplastic resin, a catalyst and a fluidity control agent. The preparation method comprises the following steps: adding the allyl compound into a reaction kettle, heating and stirring, adding the thermoplastic resin, cooling, adding the bismaleimide resin, continuously heating and stirring, and carrying out double-roller hot rolling film forming on the bismaleimide resin and a carrier for manufacturing an adhesive film through an adhesive film machine to prepare the low-temperature curable bismaleimide resin surface film.

The invention discloses a preparation method of low-temperature solderable conductive copper paste, and belongs to the technical field of electronic materials. The conductive copper paste is prepared from the following raw materials: silver-coated copper powder, an organic carrier, an antioxidant, a curing agent, an auxiliary agent, a thixotropic agent, a solvent and an adhesion enhancer. The design of the composite copper powder coated with the silver layer on the surface is matched with the graded particle size, and an organic carrier is combined, so that high conductivity and strong oxidation resistance under low-temperature curing are realized. The preparation method comprises the following steps: treating the copper powder by adopting a dipping-drying process, and coating the surface of the copper powder with the adhesion enhancer and the antioxidant by adopting a chemical method; uniformly mixing the organic carrier, the curing agent, the solvent and the auxiliary agent; and finally, copper powder and a thixotropic agent are added into the mixed organic carrier, and the low-temperature solderable conductive copper paste is prepared through high-speed dispersion and grinding of a three-roller machine. The product can be rapidly cured at 100-180 DEG C, the sheet resistance is smaller than or equal to 20 m omega / square, the welding strength reaches 15 MPa or above, cost is low, production is easy, and wide industrial application value is achieved.

The invention belongs to the technical field of coatings, and discloses a preparation method and application of a low-temperature fast-curing coiled material powder coating, and the preparation method comprises the following steps: S1, adding raw materials of the low-temperature fast-curing coiled material powder coating into a high-speed mixer, and mixing for 5-8 minutes at the rotating speed of 1200-1600r / min to ensure that the components are uniformly dispersed; s2, adding the mixture into a double-screw extruder for melt extrusion, wherein the temperature of the double-screw extruder is 80-90 DEG C in a first area, 100-110 DEG C in a second area, 120-130 DEG C in a third area and 110-120 DEG C in a fourth area, and the rotating speed is 200-250 r / min; s3, tabletting and cooling to 40 DEG C or below, after coarse crushing, adopting an ACM pulverizer and a grading screen of 80-120 meshes to obtain the low-temperature fast-curing coiled material powder coating, low-temperature curing and fast film forming are achieved through component cooperation, the process adaptability is high, meanwhile, functional filler modified sericite and modified nanometer aluminum oxide are added, and the low-temperature fast-curing coiled material powder coating is prepared. The two synergistically enhance the corrosion resistance, mechanical strength and environmental adaptability of the powder coating paint film.

The invention discloses low-temperature curing conductive paste as well as a preparation method and application thereof. The low-temperature curing conductive paste is prepared from the following components in percentage by mass: 88 to 95 weight percent of micro-nano powder, 2 to 4.5 weight percent of adhesive, 2 to 5.5 weight percent of solvent and 0.5 to 2 weight percent of auxiliary agent, wherein the adhesive comprises an end-capped bifunctional disubstituted urea curing agent of which the deblocking temperature is less than or equal to 80 DEG C, and a compound of epoxy resin and hydroxyl resin; the micro-nano powder comprises silver-coated copper powder and spherical silver powder subjected to surface treatment, the silver content of the silver-coated copper powder is 3-25 wt.%, the D50 of the silver-coated copper powder is 1-10 microns, and the D50 of the spherical silver powder is 0.1-1 micron and is treated by hydroxyl-containing aliphatic alcohol or ether. The conductive paste provided by the invention can be cured at low temperature and still has high conductivity, and the application problem of traditional conductive silver paste in perovskite solar cells is solved.

The invention discloses low-temperature anti-oxidation conductive copper paste, a preparation method and an RFID tag, and relates to the field of conductive paste. The modified copper powder comprises: copper powder; the cysteamine self-assembly molecular layer is formed by coupling sulfydryl of cysteamine with the surface of the copper powder; the metal phthalocyanine complex molecular layer is coordinated with central metal ions of metal phthalocyanine molecules through amino groups of cysteamine and is connected to the surface of the cysteamine self-assembled molecular layer; and the conductive copper paste is sintered at 140-170 DEG C. According to the low-temperature curing conductive copper paste, the problem of anti-oxidation defects of the copper powder can be effectively solved while the conductivity of the copper powder is ensured, and the low-temperature curing conductive copper paste with long-acting anti-oxidation performance and high conductivity is obtained.

The invention relates to the technical field of epoxy adhesives, in particular to a low-temperature curing epoxy adhesive and a preparation method thereof. The epoxy resin composition comprises the following components in parts by weight: 30-80 parts of epoxy resin, 20-40 parts of a curing agent and 0.1-2 parts of an accelerant, the accelerant comprises a zeolite imidazate framework material. Zinc ions and 2-methylimidazole are coordinated and self-assembled to form a porous crystal material, and the porous crystal material is used as an accelerant, so that the storage stability of the epoxy adhesive can be improved; the particle size of the accelerant is 50-250 nm, the pore diameter is 0.2-1 nm, the pore volume is 0.3-1 cm < 3 > / g, and the addition amount of the accelerant can be reduced; the accelerator prepared by the invention is simple and convenient in synthesis method, is used in an epoxy adhesive formula, and can improve the adhesion and reduce the shrinkage rate.

The invention discloses low-temperature curing high-toughness polyester resin as well as a preparation method and application thereof, and relates to the technical field of high-molecular polymer materials. The polyester resin is prepared from the following raw materials: a prepolymer A, a prepolymer B and an end-capping reagent, the prepolymer A is a hydroxyl-terminated prepolymer containing one or more cycloalkyl groups; and the prepolymer B is a carboxyl-terminated prepolymer containing a borneol structure. The polyester resin has relatively low melt viscosity and relatively high glass transition temperature, is good in leveling property and flexibility, can realize low-temperature curing and is suitable for preparing a powder coating, and the obtained powder coating not only has low-temperature curing performance, but also has relatively low cost compared with a conventional polyester powder coating obtained by low-temperature curing. The leveling property, the flexibility and the storage stability can be considered, and the better comprehensive performance is achieved. The powder coating is particularly suitable for coating thermosensitive substrates, such as substrates such as wood and plastic.