1390 results about "Low temperature curing" patented technology

The present invention, a powder composition for making powder coatings comprising one or more than one curable polymer or resin and an agglomerate of a core-shell polymer, wherein the agglomerate of a core-shell polymer has an average particle size of from 5 to 190 microns, preferably from 10 to 127 microns. The powders in accordance with the present invention provide a cured powder coating that is flexible, smooth, and which may be applied in a thickness of only from 0.3 to 8 mils. In a preferred embodiment of making a powder in accordance with the present invention, the agglomerate is cryoground to form a reduced agglomerate prior to adding it into a powder as a post-blend or a powder-forming mixture as a preblend. The preferred core-shell polymer for use in accordance with the present invention comprises an acrylic impact modifier having a poly(methyl methacrylate) shell and a poly(butyl acrylate) core. Further, the preferred curable polymer or resin powder is an epoxy resin, wherein the powder composition is a low temperature curing one component powder composition which cures at from 107 to 149 degrees C.

An organic field effect transistor (FET) is described with an active dielectric layer comprising a low-temperature cured dielectric film of a liquid-deposited silsesquioxane precursor. The dielectric film comprises a silsesquioxane having a dielectric constant of greater than 2. The silsesquioxane dielectric film is advantageously prepared by curing oligomers having alkyl(methyl) and/or alkyl(methyl) pendant groups. The invention also embraces a process for making an organic FET comprising providing a substrate suitable for an organic FET; applying a liquid-phase solution of silsesquioxane precursors over the surface of the substrate; and curing the solution to form a silsesquioxane active dielectric layer. The organic FET thus produced has a high-dielectric, silsesquioxane film with a dielectric constant of greater than about 2, and advantageously, the substrate comprises an indium-tin oxide coated plastic substrate.

A fast line maintenance repair process for damaged composite structures includes the application of a pre-cured patch that uses a quick curing paste adhesive to bond the patch to the structure. The adhesive is cured at relatively low elevated temperatures provided by a chemical heat pack. The low temperature cure eliminates the need to dry out the part and permits the application of the repair in a hazardous environment. In a typical commercial airline application, airline maintenance personnel can install the repair at the flight gate. The repair is intended to restore the structure to a desired load capability in approximately one hour. The repair can be removed if need be with less overall damage than would occur upon removal of typical mechanically fastened repairs. All or some of the repair materials and tools can be provided in a portable kit.

A process for the bulk polymerization, in the absence of any solvent, of a reactant containing azide functionality and a reactant containing a terminal alkyne functionality, in the presence of Cu (I) catalyst or in the presence of a Cu(II) catalyst without a reducing agent, is described. Polymerization can be achieved at temperatures less than 100° C., which is suitable for low temperature cures. A controlled synthesis for low molecular weight oligomers is disclosed.

The present invention is directed to a powdered coating composition which includes a carboxyl terminated polyester, epoxy compounds and an onium catalyst or beta-hydroxyalkylamide which provide coatings with outstanding properties when cured at low temperature.

The present invention is based on the discovery that certain electron poor olefins combined with nucleophiles and a base catalyst are useful as adhesive compositions for the electronic packaging industry. In particular, the adhesive formulations set forth herein are useful as low temperature curing formulations with high adhesion to a variety of substrates. Invention formulations typically cure at about 80° C. and have a potlife of about 24 hours. The formulations cure by the well-known Michael addition reaction.

The invention discloses a low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive and a preparation method thereof, which relate to an inorganic/organic hybrid epoxy adhesive and a preparation method thereof. The invention solves the problems that inorganic/organic hybrid epoxy adhesive prepared by the prior art has poor high-temperature thermal aging resistance and needs high curing temperature. The low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive is prepared by an epoxy resin, an epoxy resin low-temperature curing agent, a coupling agent, an inorganic active hybrid material and a dispersant. The preparation method comprises the following steps: the epoxy resin, the epoxy resin low-temperature curing agent and the coupling agent are mixed and stirred evenly, and then the inorganic active hybrid material and the dispersant are added into the mixture to be stirred evenly to obtain the low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive. The low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive has high high-temperature bonding strength, good high-temperature thermal aging performance and low curing temperature. The low-temperature curing high temperature-resistant inorganic/organic hybrid epoxy adhesive has the advantages of simple production technology, convenient operation and broad application.

The invention relates to an addition type heat-conducting silicone rubber and a preparation method thereof. The addition type heat-conducting silicone rubber is characterized in that 100 weight portions of vinyl silicone oil and 200 weight portions to 500 weight portions of heat-conducting material are dewatered and mixed in a vacuum kneader for 30 to 200 minutes with the temperature of 100 to 150 DEG C and the vacuum degree of 0.06 to 0.099 MPa so as to obtain base material; under normal temperature, 0.5 weight portion to 1.5 weight portions of hydrogeneous silicone oil, 0.01 weight portion to 0.06 weight portion of inhibitor and 3 weight portions to 10 weight portions of diluent are added and stirred in a stirrer for 15 to 40 minutes so as to obtain A glue; 100 weight portions of base material are taken, 0.25 weight to 0.75 weight portion of platinum catalyst and 3 weight portions to 10 weight portions are added and stirred in the stirrer for 15 to 40 minutes so as to obtain B glue. The A glue and the B glue with the same weight portions are taken, mixed evenly and defoamed for 3 to 10 minutes at the vacuum degree of 0.06 to 0.09 MPa so as to obtain addition type heat-conducting silicone rubber. The heat-conducting silicone rubber is cured at normal temperature or low temperature, has good flow property and convenient use, has higher heat conductivity after fluidization and can be used for the components with the need of heat dissipation and heat transmission in the electronic appliance field.

The invention discloses an environment-friendly cathode electrophoretic coating with a low heating loss and low solvent content which can be cold cured. The method includes following steps and craft conditions: (1) preparation of curing agent and modification of mainbody resin. The curing agent is prepared by reaction of isocyanate, ketoximes solvent and trimethylolpropane so as to produce multifunctional group for closing the isocyanate curing agent. The whole reaction of mainbody resin modification includes chain extension reaction of epoxide resin, ring-opening reaction of amine and polyamide to the epoxide resin, the preparation of semi enclosed isocyanate and grafting reaction steps; (2) preparation of the catalytic curing agent slurry; (3) preparation of cathode electrophoretic coating latex and color paste. The invention improves the epoxide resin stability, reduces the resin curing temperature, and declines the heating loss of the dope and the discharge of the solvent. It applies extracting method in the latex producing process to reduce the solvent content so as to produce a environment-friendly cathode electrophoretic coating which can be cold cured.

The invention discloses a low-temperature curing cyanate ester adhesive and a preparation method thereof, which relate to an adhesive and a preparation method thereof and solve the technical problems of high curing temperature and short room-temperature storage period of the existing cyanate ester adhesive. The adhesive disclosed by the invention is manufactured by adopting cyanate ester resin, a catalyst, modified resin, organic nano particles, inorganic nano particles, a thinning agent and a toughening agent. The preparation method comprises the following steps that: firstly, a mixture A is prepared; secondly, the toughening agent is added into the mixture A to obtain a mixture B; thirdly, the modified resin and the thinning agent are added into the mixture B and are stirred and mixed uniformly, the catalyst is added into the mixture to obtain a substrate, and then the substrate and quartz fiber fabric are subjected to hot melting to be combined into a low-temperature curing cyanate ester carrier adhesive film, so the low-temperature curing cyanate ester adhesive is obtained. The curing temperature of the low-temperature curing cyanate ester adhesive prepared by the preparation method provided by the invention is low, the low-temperature curing cyanate ester adhesive can be cured at a temperature of 120-140 DEG C, and the room-temperature storage period of the low-temperature curing cyanate ester adhesive is as long as 20 days, and meanwhile, the low-temperature curing cyanate ester adhesive has high bonding strength and excellent heat-resistant performance and is suitable for bonded materials which cannot resist to high temperature.

The invention provides a solvent-free polyaspartate polyurea paint, and a preparation method and application thereof. The solvent-free polyaspartate polyurea paint comprises a component A and a component B. The component A comprises the following ingredients in percentage by weight: 60-80% of hexamethylene diisocyanate and 20-40% of urethano modified HDI (hexamethylene diisocyanate) tripolymer. The component B comprises the following ingredients in percentage by weight: 60-70% of polyaspartate, 5-10% of pigment and filler, 10-20% of modified silicon micropowder, 1-3% of defoaming agent, 1-3% of leveling agent, 2-5% of adhesion promoter and 1-3% of coupling agent. The mass ratio of the component A to the component B is (3-5):1. The technical scheme provided by the invention greatly improves the low-temperature curing performance of the product and enhances the binding strength with the nonpolar material polyethylene; and the solvent-free polyaspartate polyurea paint has the advantages of high flexibility, high mechanical strength and high chemical corrosion resistance.

A polyurethane caulking material for expansion joints of a ballastless track of a high speed railway is disclosed. The caulking material is prepared from two parts A and B. the part A is composed of the following raw materials, by weight, 100 parts of isocyanate and its prepolymer, 10-150 parts of a plasticizer, 5-150 parts of a solid filler, 1-20 parts of a diluents, 1-5 parts of an adhesion promoter, 0-10 parts of a thixotropic agent and 1-3 parts of a water-removal agent. The part B is composed of the following raw materials, by weight, 10-20 parts of modified polyhydric alcohol, 1-5 parts of a diluent, 2-30 parts of a plasticizer, 5-30 parts of a solid filler, 0-5 parts of a thixotropic agent, 0.5-2 parts of an antifoaming agent, 0.1-1 part of an anti-aging agent and 0-0.01 part of a catalyst. The mass ratio of the part A to the part B is 4:1-10:1. The polyurethane caulking material has advantages of good low-temperature curing performance, high displacement capability, low tensile modulus, good bond property and excellent endurance quality and fatigue resistance, and is suitable for expansion joints of a ballastless track of a high speed railway as well as expansion joints of roads and airfield runways.

The invention provides a high-conductivity silver paste and a preparation method thereof. The high-conductivity silver paste comprises metal silver powder, wherein the metal silver powder is a mixture of micro-order sheet-shaped silver powder, submicron-order spherical silver powder and nanometer silver powder. The high-conductivity silver paste has the advantages that silver powders with different grain sizes and morphological structures are fully utilized and mutually matched, so that the silver powder can form a more compact status on the structure, and the low-temperature sintered nanometer silver powder is added to be further connected with the conductive silver powder; after mixing the silver paste with macromolecule resin, a solvent, an additive and an assistant agent, the paste can acquire relatively high conductivity under a condition of low-temperature curing (less than or equal to 150 DEG C); and meanwhile, the paste has favorable printing adaptability and favorable attachment performance, and can be applied to the fields of a printed conductive circuit, a radio frequency identification (RFID) label antenna and the like.

The present invention belongs to the field of high molecular synthetic material, and is especially one kind of double end group o-phthalonitrile-benzo oxazine resin, and its solidified substance and preparation process. The present invention provides one kind of 4-aminophenoxyl-o-phthalonitrile monomer and the double end group o-phthalonitrile-benzo oxazine resin therewith. The double end group o-phthalonitrile-benzo oxazine resin has excellent curing reaction activity, low temperature curing performance similar to that of benzo oxazine resin, heat resistance similar to that of o-phthalonitrile resin, greatly lowered curing temperature and capacity of use in high temperature condition. The preparation process is simple and controllable, and the product has excellent application foreground.

The invention discloses a special low-temperature cured body powder coating for an aluminum wheel of an automobile, which consists of low-temperature cured polyester resin, epoxy resin and a latent accelerator. The invention further discloses a preparation method of the powder coating. The powder coating can be cured at 150-160 DEG C and extremely good levelling property and anti-caking performance are ensured, so that requirement for the mirror surface effect of aluminum wheel coating of the automobile is satisfied. Moreover, the coating has excellent counterbalance adhering performance and air permeability; low-temperature curing is achieved, the energy consumption for coating the aluminum wheel is reduced, and the toughness of the aluminum wheel is increased.

A sealant system 13 for a manifold 10 of a proton exchange membrane fuel cell includes low temperature cured or heat cured silicone rubber bridges 14, 14a, 14c between the end plates 9 to compensate for the uneven edges of various fuel cell component layers, and a layer 15 of silicone rubber foam or sponge, or a molded silicone rubber gasket 15a, extending across the bridges and along the end plates, around the entire contact perimeter surfaces of the manifold, to seal the manifold to the fuel cell. The cured silicone rubber may extend along the end plates between the bridges. A rubber strip 20 may be adhered to the silicone rubber bridges and end plates. The bridges may comprise a first layer 22 of low shrinkage self-leveling RTV liquid rubber with viscosity in the range of 10,000-20,000 cps and a second layer 14 of RTV liquid rubber.

The invention discloses polyester resin for a beta-hydroxyalkylamide low temperature curing weather-resistant powder paint. The polyester resin is prepared from the following components by weight percent through melt polycondensation reaction: 25-45% of polyol, 40-55% of aromatic polybasic acid, 0-8% of aliphatic polybasic acid, 0-5% of branching agent, 5-15% of acidolysis agent and 0.01-0.15% ofesterification catalyst. The invention also discloses a preparation method of the polyester resin. The polyester resin prepared by the method disclosed in the invention has the advantages of higher glass transition temperature and softening point and proper melt viscosity and storage stability; and the powder paint prepared from the polyester resin has the advantages of excellent levelling property and mechanical properties, good thick-film pinhole resistance and the like.

The invention discloses thermosetting weather-resistant low-temperature curing powder, which belongs to the technical field of new materials. 0.3%-0.6% of accelerator, 15%-25% of filler, 3%-15% of pigment, 0.5%-2% of auxiliary agent after mixing, the invention has the beneficial effect of curing the coating film The required baking conditions are only 140-150 ℃, 20min, the curing temperature is lower, the curing time can be shortened by 2 to 3 times compared with ordinary products, the mechanical properties are not affected, and it has good weather resistance, which can meet the needs of production and life. , can be used in wood processing, engineering plastics and some metal alloy materials and other fields, expanding the application field of traditional powder.

The invention provides a modified acrylic resin mortar composition and a preparation method thereof. The composition consists of component materials A, B and C, wherein the component material A comprises modified acrylic resin, a flexibilizer, a plasticizer, a crosslinking agent, a coupling agent, a polymerization inhibitor, an accelerating agent, a thickening agent, a combustion improver, an antioxidant and a defoaming agent; the component material B is an initiator; the component material C is an aggregate, wherein the mass ratio of component A to component B to component C is (100-300): (0.5-3): (50-2500). The composition has the advantages of simple preparation method, easy and simple field construction operation process, good low temperature solidification property, adjustable solidification speed, high mechanical strength, good toughness and good ageing resistance and low temperature resistance.

The invention relates to a low-temperature cured cathode electrophoretic coating. The coating comprises cathode electrophoretic coating emulsion and color paste which are stored independently, wherein the composition ratio of cathode electrophoretic coating emulsion to color paste is 1:4. The cathode electrophoretic coating emulsion is prepared in such a way that 30-40 parts of matrix resin, 10-15 parts of low-deblocking curing agent, 1-2 parts of high boiling point alcohol ether cosolvent, and 0.5-1 part of organic acid and/or mineral acid are added into an emulsifying disperser in sequence for stirring and mixing uniformly, and the temperature is controlled under 40 DEG C; and then 40-50 parts of deionized water is added into the emulsifying disperser in twice or more times for high-speed emulsification for one hour. The coating and the preparation method thereof have the advantages as follows: low-temperature dissociation of blocked isocyanate is realized; low-temperature curing performance and coating stability are combined; low-temperature curing performance and coating surface smoothness are combined; and the curing temperature is as low as 140 DEG C.

The invention relates to a resin mixture used for producing FRP (fiberglass-reinforced plastics) profile, the FRP profile made from the mixture and a preparation method thereof. The resin mixture comprises the following materials according to weight proportion: 10 of resin, 0.4 to 3 of low shrinkage agent, 2 to 15 of fillers, 0.05 to 0.2 of low temperature curing agent, 0.05 to 0.2 of high temperature curing agent, 0.05 to 0.2 of parting agent, 0.02 to 0.5 of pigment and appropriate amount of coupling agent and ultraviolet absorbent. The preparation method of the FRP profile by using the mixture is that: a reinforcing material is immersed into the resin mixture. The obtained material is extruded to get forming under high temperature and high pressure through a die; during the extrusion forming, the die is heated after being separated into three segments, and the temperature of the three segments is respectively 60 DEG C to 100 DEG C of a first segment, 100 DEG C to 150 DEG C of a second segment, 100 DEG C to 148 DEG C of a third segment; the haulage speed is 320 mm/min.

The invention discloses a method for producing friction plates of low temperature solidified ceramics, which is characterized in that the friction plates are produced by the following raw materials based on the weight percentage: 15-25% of high temperature resistance adhesives, 20-35% of reinforcing agents, 5-15% of friction adding agents, 10-25% of anti-friction and 20-30% of filling agents. The method has the advantages of no metal or little metal, low density, no pollution, low cost and long service life, etc. As ceramic fibers and ceramic powders are adopted, the high temperature resistance, dispersivity, adsorptivity, wearing resistance and stability are good and the density and price are low, thus ensuring balanced friction coefficient, little fading, no damage to coupling, low brake noise and light weight. The overall performance can reach the level of the same international products.