Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

401 results about "Low temperature curing" patented technology

Low Temperature Heat Cure Epoxy Adhesives. Low temperature heat curing one part epoxy systems are formulated to cure at temperatures from 175 to 210°F (80° to 100°C). These systems are well suited for bonding heat sensitive substrates and engineered to fit other application requirements, such as: Bonding similar/dissimilar substrates with CTE differences.

Low-temperature curing high-throwing-power cathode electrophoretic coating as well as preparation method and application thereof

The invention discloses a low-temperature curing high-throwing-power cathode electrophoretic coating and a preparation method and application thereof, and belongs to the field of automobile coating materials, the coating is composed of epoxy resin, a fluorosilicone copolymerization type epoxy modifier, a polyamino siloxane-acrylic acid hybrid and other components, and performance improvement is achieved through the synergistic effect of the two brand-new modifiers. Wherein the fluorine-silicon copolymerization type epoxy modifier is prepared by taking bisphenol A epoxy resin as a framework, introducing fluorine-containing alkyl and siloxane groups and carrying out ultraviolet reaction, so that the surface energy is reduced, and low-temperature crosslinking is promoted; the polyamido siloxane-acrylic acid hybrid takes siloxane as a core, and acrylic acid and polyamido are bridged through isocyanate, so that the crosslinking density and the water solubility are enhanced. When the coating is prepared, the two modifiers are mixed with epoxy resin, a solvent and the like, and the coating is prepared through dispersion and dilution. The coating can be cured at low temperature, so that a uniform thick film is obtained in an inner cavity of a complex workpiece, and meanwhile, the coating has excellent corrosion resistance and adhesive force and is suitable for efficient and environment-friendly coating of an automobile body and parts.
Owner:KEDE CHEM IND SHUNDE

Low-temperature curing anticorrosive paint and preparation method thereof

The invention relates to the technical field of coatings, in particular to a low-temperature curing anticorrosive coating and a preparation method thereof. The coating is composed of a component A and a component B, and the mass ratio of the component A to the component B is 100: (3-50.8); the component A comprises the following components in parts by weight: 25-35 parts of epoxy resin, 40-72 parts of pigment filler, 2.3-4.5 parts of an auxiliary agent and 10-14 parts of a solvent; the component B is a modified phenolic aldehyde amine curing agent; the epoxy resin is used as a main film-forming substance and is matched with the modified phenolic aldehyde amine curing agent to prepare the low-temperature curing epoxy coating, so that the problem that the epoxy coating cannot be cured at the temperature lower than-10 DEG C is solved, and a coating formed by the coating provided by the invention has good mechanical properties, salt spray resistance, high and low temperature resistance and the like.
Owner:陕西华秦科技实业股份有限公司

Low-temperature curing photoresist applied to flexible display panel and preparation method of low-temperature curing photoresist

The invention discloses a low-temperature curing photoresist applied to a flexible display panel and a preparation method of the low-temperature curing photoresist, and belongs to the technical field of energy conservation and environmental protection. The photoresist is prepared by compounding a reactive organic-inorganic mixed nano filler, a photosensitive resin matrix, a benzocyclobutenyl silicone oligomer (BSA resin) and an additive. The preparation method comprises the following steps: preparation and surface modification of the nanofiller; synthesizing a photosensitive resin matrix; compounding the oligomer with an additive; dispersing the slurry and adding a nano corrugated template; spin coating, ultraviolet pre-curing, low-temperature baking and heat post-curing are carried out. The curing temperature of the photoresist is lower than 120 DEG C, the resolution ratio is superior to 3 microns, and the bending tolerance frequency is gt; the adhesion strength is gt after 20000 times; 15 Kgf / cm < 2 >, and the water vapor permeability is lt; 10 <-6 >, heat resistance gt; the temperature is 150 DEG C, and the dielectric constant is lt; 3.5, VOC (Volatile Organic Compounds) emission lt; the organic light-emitting material has excellent flexibility, thermal stability and environmental protection performance, is suitable for a pixel definition layer of an OLED flexible display panel, and improves the light extraction efficiency and the anti-fatigue performance.
Owner:合肥汉旸科技材料有限公司

Bismaleimide resin-based composite material surface film capable of being cured at low temperature and preparation method thereof

PendingCN120944351APolymer sciencePtru catalyst
The invention discloses a low-temperature curable bismaleimide resin-based composite material surface film and a preparation method thereof, relates to the field of bismaleimide resin composite material surface films, and aims at solving the problem that the curing temperature of an existing bismaleimide resin composite material surface film is too high. The surface film is composed of bismaleimide resin, an allyl compound, thermoplastic resin, a catalyst and a fluidity control agent. The preparation method comprises the following steps: adding the allyl compound into a reaction kettle, heating and stirring, adding the thermoplastic resin, cooling, adding the bismaleimide resin, continuously heating and stirring, and carrying out double-roller hot rolling film forming on the bismaleimide resin and a carrier for manufacturing an adhesive film through an adhesive film machine to prepare the low-temperature curable bismaleimide resin surface film.
Owner:INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI

Preparation method of low-temperature solderable conductive copper paste

The invention discloses a preparation method of low-temperature solderable conductive copper paste, and belongs to the technical field of electronic materials. The conductive copper paste is prepared from the following raw materials: silver-coated copper powder, an organic carrier, an antioxidant, a curing agent, an auxiliary agent, a thixotropic agent, a solvent and an adhesion enhancer. The design of the composite copper powder coated with the silver layer on the surface is matched with the graded particle size, and an organic carrier is combined, so that high conductivity and strong oxidation resistance under low-temperature curing are realized. The preparation method comprises the following steps: treating the copper powder by adopting a dipping-drying process, and coating the surface of the copper powder with the adhesion enhancer and the antioxidant by adopting a chemical method; uniformly mixing the organic carrier, the curing agent, the solvent and the auxiliary agent; and finally, copper powder and a thixotropic agent are added into the mixed organic carrier, and the low-temperature solderable conductive copper paste is prepared through high-speed dispersion and grinding of a three-roller machine. The product can be rapidly cured at 100-180 DEG C, the sheet resistance is smaller than or equal to 20 m omega / square, the welding strength reaches 15 MPa or above, cost is low, production is easy, and wide industrial application value is achieved.
Owner:GUANGDONG YINA NEW MATERIAL TECH CO LTD

Preparation method and application of low-temperature fast-curing coiled material powder coating

The invention belongs to the technical field of coatings, and discloses a preparation method and application of a low-temperature fast-curing coiled material powder coating, and the preparation method comprises the following steps: S1, adding raw materials of the low-temperature fast-curing coiled material powder coating into a high-speed mixer, and mixing for 5-8 minutes at the rotating speed of 1200-1600r / min to ensure that the components are uniformly dispersed; s2, adding the mixture into a double-screw extruder for melt extrusion, wherein the temperature of the double-screw extruder is 80-90 DEG C in a first area, 100-110 DEG C in a second area, 120-130 DEG C in a third area and 110-120 DEG C in a fourth area, and the rotating speed is 200-250 r / min; s3, tabletting and cooling to 40 DEG C or below, after coarse crushing, adopting an ACM pulverizer and a grading screen of 80-120 meshes to obtain the low-temperature fast-curing coiled material powder coating, low-temperature curing and fast film forming are achieved through component cooperation, the process adaptability is high, meanwhile, functional filler modified sericite and modified nanometer aluminum oxide are added, and the low-temperature fast-curing coiled material powder coating is prepared. The two synergistically enhance the corrosion resistance, mechanical strength and environmental adaptability of the powder coating paint film.
Owner:GUANGDONG RUIZHI HIGH-TECH CO LTD

Low-temperature anti-oxidation conductive copper paste, preparation method and RFID tag

The invention discloses low-temperature anti-oxidation conductive copper paste, a preparation method and an RFID tag, and relates to the field of conductive paste. The modified copper powder comprises: copper powder; the cysteamine self-assembly molecular layer is formed by coupling sulfydryl of cysteamine with the surface of the copper powder; the metal phthalocyanine complex molecular layer is coordinated with central metal ions of metal phthalocyanine molecules through amino groups of cysteamine and is connected to the surface of the cysteamine self-assembled molecular layer; and the conductive copper paste is sintered at 140-170 DEG C. According to the low-temperature curing conductive copper paste, the problem of anti-oxidation defects of the copper powder can be effectively solved while the conductivity of the copper powder is ensured, and the low-temperature curing conductive copper paste with long-acting anti-oxidation performance and high conductivity is obtained.
Owner:CANGNAN ANTE SECURITY TECH

Weather-resistant polyester resin for low-temperature curing and preparation method thereof

The invention belongs to the field of polyester resins, and provides a weather-resistant polyester resin for low-temperature curing and a preparation method thereof. A three-step progressive design that a polyester prepolymer is terminated by silane and then is subjected to hydrolytic polycondensation with tetraethyl orthosilicate to construct an organic-inorganic covalent hybrid network is adopted; through cooperation of the condensation catalyst, the hindered amine light stabilizer and the ultraviolet absorbent, the mechanical properties that the pencil hardness reaches the HB level or above and the cross-cut test level is not higher than the first level under the low-temperature curing condition of not higher than 100 DEG C are achieved, and the long-term weather resistance that the color difference is not larger than 2.0 and the gloss retention rate is not lower than 80% after 500-hour artificial accelerated aging is achieved. The technical problems of poor storage stability and difficulty in consideration of high solid content and low viscosity caused by insufficient low-temperature curing capacity and non-uniform organic-inorganic hybridization of the traditional polyester resin are solved, and the polyester resin has wide application value in the fields of building coatings, automobile refinishing paints, wood coatings and the like with strict requirements on low-temperature curing and weather resistance.
Owner:WUXI CHANGCHUAN MATERIAL TECH CO LTD

Bio-based low-temperature curing powder coating and preparation method thereof

The invention provides a bio-based low-temperature curing powder coating and a preparation method thereof, and belongs to the technical field of powder coatings, and the bio-based low-temperature curing powder coating specifically comprises the following components in parts by weight: 65-75 parts of bio-based resin, 5-6 parts of triglycidyl isocyanurate, 0.05-0.15 part of tetrabutylammonium bromide, 8-12 parts of air glass beads, 4-6 parts of mica and 0.4-0.6 part of ethylene bis stearamide. 0.7 to 1.3 parts of flatting agent, 0.2 to 0.5 part of benzoin, 0.3 to 0.7 part of amide wax and 6 to 8 parts of pigment. The curing temperature of the bio-based low-temperature curing powder coating is 100-120 DEG C, and the bio-based low-temperature curing powder coating has the advantage of low curing temperature, can be suitable for surface coating of plastic devices, has the advantages of salt mist resistance, impact resistance and the like, and can effectively solve the problems of existing powder coatings.
Owner:CHENGDU HSINDA POLYMER MATERIALS CO LTD

Manufacturing method and mold of stator blade made of high-temperature-resistant composite material

The invention discloses a manufacturing method of a high-temperature-resistant composite material stator blade and a mold thereof in the technical field of aero-engines. The manufacturing method comprises the following steps: S1, material pretreatment and mold preparation; s2, laying and pre-compaction are carried out; s3, carrying out vacuum mould pressing and curing molding; s4, carrying out edge covering treatment; and S5, detecting and post-processing. According to the method, the specially-made mold is arranged, the upper mold and the lower mold are buckled for pressing, the inclined pressing block provides side face pressing, multi-face pressing is carried out in cooperation with staged vacuumizing, uniform flowing and sufficient curing of resin are achieved, and the size stability and the mechanical property of the blade in the high-temperature environment are guaranteed; besides, in the edge covering treatment, a low-temperature curing high-temperature-resistant adhesive is used for bonding and edge covering, so that edge transition of the blade is smoother, the blade is almost free of deformation after edge covering, and meanwhile, through a series of treatment such as vacuum control, temperature management and quality detection, the manufactured stator blade has excellent internal compactness.
Owner:JIANGSU XINYANG NEW MATERIALS CO LTD

Epoxy resin for halogen-free flame-retardant self-leveling powder coating and preparation method thereof

The invention provides epoxy resin for halogen-free flame-retardant self-leveling powder coating and a preparation method of the epoxy resin, and belongs to the technical field of powder coating. The flame retardant is mainly prepared from anhydrous piperazine, bisphenol A diglycidyl ether, trihydroxymethyl phosphorus oxide, triethyl phosphite, epoxy chloropropane, sodium hydroxide, N-methyl iminodiacetic acid, ethylene glycol diglycidyl ether and other main raw materials through polymerization. The prepared epoxy resin and 2-phenylimidazoline are subjected to low-temperature curing (135 DEG C / 20 min) on the premise that an additional flatting agent does not need to be used, the flexibility of a coating film is good, the impact resistance grade is high, the impact performance reaches the condition that no cracking phenomenon exists in the front and back 60cm, the leveling grade reaches the grade 7 or above, the gloss is high and reaches 95% or above, the oxygen index reaches 34% or above, and the halogen-free flame retardant performance is excellent.
Owner:HUANGSHAN HENGTAI CHEM CO LTD

Composite material based on multiple synergistic modification and gradient nanostructure and preparation method thereof

The invention discloses a composite material based on multiple synergistic modification and a gradient nanostructure and a preparation method of the composite material, and relates to the technical field of high-performance composite materials. The problems of weak interface bonding and insufficient load transmission efficiency of the composite material in the prior art are solved, the cohesiveness of the fiber surface and the matrix is greatly enhanced, the problem of high-temperature long-time curing of PAN / CNT grafting is avoided through microwave curing of the nano structure, rapid low-temperature curing is realized, the process period is shortened, and the production cost is reduced. The interface shear strength, the tensile strength and the bending strength of the composite material are obviously improved.
Owner:SOUTHWEST PETROLEUM UNIV

Coating technology of self-cleaning glass coating

The invention discloses a coating technology of a self-cleaning glass coating, which adopts a water-based paint containing nano TiO2 / SiO2 hybrid sol (core-shell structure), a polyurethane modified silane coupling agent and a flatting agent, and forms a 150-300nm super-hydrophilic coating (the contact angle is less than or equal to 5 degrees) on the surface of glass through a synergistic process of gradient curing (three-stage heating at 80-150 DEG C) and ultraviolet radiation (a main wave band of 365nm and an auxiliary wave band of 280-320nm). The technology breaks through the bottleneck that low-temperature curing and high adhesive force are difficult to be compatible, and the contact angle of the coating is still lt after damp-heat aging; 10 degrees, the light transmittance loss lt; and 3%, the photovoltaic module is suitable for building curtain walls, automobile windshields and photovoltaic modules. The method comprises the following steps: (1) bonding a polyurethane chain segment with a mechanical interlocking enhanced interface through a hydrogen bond; (2) the SiO2 shell layer improves the TiO2 quantum efficiency; and (3) equipment zoned humidity control and inert atmosphere oxidation inhibition are realized, and unification of self-cleaning performance, optical performance and mechanical durability is realized by an environment-friendly process.
Owner:XINXIANG INST OF TECH

Adhesive for repairing glass fiber reinforced plastic pipeline and preparation process thereof

The invention relates to the technical field of adhesives, and particularly discloses an adhesive for repairing a glass fiber reinforced plastic pipeline and a preparation process. The invention relates to an adhesive for repairing a glass fiber reinforced plastic pipeline. The adhesive is prepared from the following raw materials: modified bisphenol A epoxy resin, a curing agent, a glass fiber reinforced filler, a silane coupling agent, phenyl glycidyl ether, hydroxyl-terminated nitrile rubber and an antioxidant 1076, the modified bisphenol A type epoxy resin is prepared by grafting and modifying bisphenol A type epoxy resin through amino-terminated polyether; the glass fiber reinforced filler is prepared from hydroxylated glass fibers and a graphene-carbon nanotube compound through covalent grafting. The adhesive can be used for emergency repair of glass fiber reinforced plastic pipelines, has the advantages of high low-temperature curing speed, high bonding strength and good durability, can effectively avoid cracking and leakage of repaired parts, and is adaptive to low-temperature and high-pressure complex repair working conditions. The preparation process is simple and convenient to operate and high in controllability, the adhesive with uniform performance can be stably prepared, and the repair efficiency and repair quality are guaranteed.
Owner:SHENGLI OILFIELD DONGFANG PENGDA NON-METALLIC MATERIAL PROD CO LTD

Functional additive slurry, low-temperature curing copper slurry of N-type TOPCon solar cell, electrode and preparation method

The invention provides functional additive slurry, low-temperature curing copper slurry of an N-type TOPCon solar cell, an electrode and a preparation method, and belongs to the technical field of solar cells. The functional additive slurry comprises 50-90 parts by mass of an organic carrier; 0.1-30 parts by mass of a functional additive; the functional additive comprises at least one of magnesium powder, silicon powder, lead powder, graphite, carbon black, tin-bismuth alloy, gallium, iron powder, vitamin C and aluminum powder; 0.1-10 parts by mass of a dispersant; and 5-40 parts by mass of a solvent. When the functional additive slurry is used in the copper slurry, the copper powder can be uniformly dispersed, and the copper powder is not easy to oxidize in the printing and curing process, so that the resistance is reduced.
Owner:NANTONG T SUN NEW ENERGY CO LTD +1

Preparation method and application of high-sensitivity wide-temperature-range thermal camouflage anticorrosive coating

The invention provides a preparation method of a high-sensitivity wide-temperature-range thermal camouflage anticorrosive coating. The preparation method specifically comprises the following steps: firstly, preparing an internal high-temperature phase change microcapsule, secondly, preparing a multi-core microcapsule, then preparing a surface 3D heat-conducting network of the multi-core microcapsule (MCPCM), finally, adding the multi-core microcapsule of which the surface is constructed with the 3D heat-conducting network into anticorrosive matrix resin, and carrying out ultrasonic dispersion. And carrying out vacuum defoaming and low-temperature curing treatment to obtain the high-sensitivity wide-temperature-range thermal camouflage anticorrosive coating. According to the high-sensitivity wide-temperature-range thermal camouflage anticorrosive coating prepared by the preparation method disclosed by the invention, on the basis of a multi-core microcapsule split charging strategy, extremely-wide-temperature-range coverage is realized, and phase change volume stress is relieved; the high / low temperature phase change material is independently packaged, phase change enthalpy attenuation caused by component intermixing is avoided, surface infrared radiation characteristics are dynamically adjusted through stepped phase change heat absorption / release in a temperature fluctuation environment, the infrared characteristic difference of a target under a complex thermal background is reduced, and the phase change phase change material is particularly suitable for all-weather hidden combat requirements of unmanned reconnaissance equipment.
Owner:XIAN UNIV OF TECH

Anodic oxidation process suitable for 6061 aluminum alloy

According to the anodic oxidation technology suitable for the 6061 aluminum alloy, multi-component silica sol is adopted for conducting room-temperature dipping hole sealing and low-temperature curing on a 6061 aluminum alloy anodic oxidation film, and technology energy consumption and equipment requirements are reduced. The dense silicon network seals the membrane holes, prolongs the diffusion path of a corrosive medium and prevents the corrosive medium from invading the substrate, thereby greatly improving the corrosion resistance of the membrane layer and inhibiting pitting corrosion.
Owner:SHANDONG JIANZHU UNIV

Water-based high-dispersion carbon nanotube-graphene composite conductive liquid and low-temperature curing process thereof

The invention relates to the technical field of carbon nanomaterials, and discloses a water-based high-dispersion carbon nanotube-graphene composite conductive liquid and a low-temperature curing process thereof, the process comprises pre-dispersion, fine dispersion, conductive liquid preparation, curing treatment, low-temperature curing and post-treatment, and by optimizing the composite dispersion process and a surface modification method, the conductive liquid is prepared. The agglomeration phenomenon of nano materials is inhibited, uniform and stable dispersion of the carbon nanotubes and graphene in a high-water-based medium is realized, and the storage stability and applicability of the conductive liquid are improved; by designing a multi-stage low-temperature cross-linking mechanism, the curing temperature is reduced, the process time is shortened, and damage of high temperature to a heat-sensitive base material is avoided; through the synergistic effect of the graphene and the carbon nanotubes and the application of an interface enhancement technology, a continuous and stable three-dimensional conductive path is formed in a low-temperature film forming process, and the conductivity, the mechanical strength and the environmental stability of the conductive film are improved.
Owner:JIANGSU XINCHENYA NEW MATERIAL CO LTD

Polyamide acid ester, photosensitive polyimide resin, negative photoresist composition and application thereof

The invention provides polyamide acid ester, photosensitive polyimide resin, a negative photoresist composition and application thereof. A covalent bond on a side chain of the polyamic acid ester contains a benzoylmethyl-containing structure, the structure has an ultraviolet light sensing function and can realize light degradation, so that the polyamic acid ester is converted into polyamic acid and primary alcohol, and the formed polyamic acid can be dissolved in a water-based developing agent, so that the targets of water-based developing and photoetching are realized. Besides, after the polyamic acid ester provided by the invention is imidized, no crosslinking component is left, and the polyamic acid ester has high mechanical property, high resolution, high film thickness and depth-to-width ratio gt; and 2.0, good performance can be achieved even if low-temperature curing is carried out.
Owner:CHANGCHUN INSTITUTE OF APPLIED CHEMISTRY CHINESE ACADEMY OF SCIENCES

Preparation method and application of low-temperature rapid curing coil powder coating

The application belongs to the technical field of paint, and discloses a preparation method and application of low-temperature rapid curing coiled material powder paint, and the preparation method comprises the following steps: S1, adding raw materials of the low-temperature rapid curing coiled material powder paint into a high-speed mixer, rotating at a speed of 1200-1600 r / min, and mixing for 5-8 min to ensure uniform dispersion of components; S2, adding the mixed material into a double-screw extruder for melting and extrusion, the temperature of the double-screw extruder is 80-90 DEG C in a first zone, 100-110 DEG C in a second zone, 120-130 DEG C in a third zone, and 110-120 DEG C in a fourth zone, and the rotating speed is 200-250 r / min; S3, tabletting and cooling to below 40 DEG C, coarsely crushing, and then using an ACM pulverizer and a grading screen with a mesh size of 80-120 meshes to obtain the low-temperature rapid curing coiled material powder paint, low-temperature curing and rapid film forming are realized through component synergy, the process has high adaptability, and functional fillers, i.e., modified sericite and modified nano-aluminum oxide, are added, and the two fillers synergistically enhance the corrosion resistance, mechanical strength and environmental adaptability of the powder paint film.
Owner:GUANGDONG RUIZHI HIGH-TECH CO LTD

Low-temperature curing type electrostatic spraying molding powder and production process thereof

The invention relates to the technical field of molding powder coatings, in particular to low-temperature curing type electrostatic spraying molding powder and a production process thereof. The coating comprises modified polyester resin, thermal expansion microspheres, modified amide wax, a latent curing agent, a conductive composite filler, a pigment filler and an auxiliary agent, through a dual leveling system constructed by thermal expansion microspheres and modified amide wax, the resin viscosity can be reduced through microsphere expansion stress in the initial low-temperature melting stage, meanwhile, amide wax directionally forms a lubricating layer through hydrogen bonds, the surface tension is dynamically adjusted, and the problem of insufficient leveling or excessive migration caused by a fixed proportion of a traditional auxiliary is solved; the flatness of the coating is improved, and surface defects are eliminated; through a'resin-wax-curing agent 'ternary covalent network, an interpenetrating cross-linked structure is formed in the low-temperature curing process, the cohesion strength and weather resistance of the coating are enhanced, and the adaptability and long-term protection capability of the coating to a base material are improved through the interface interpenetrating effect of the thermal expansion microspheres and a resin matrix.
Owner:SHANDONG HEYANG NEW MATERIALS TECHNOLOGY CO LTD

A low temperature cure paste with enhanced temperature cycle resistance and a method of making the same

The application discloses a kind of low-temperature curing paste of enhanced temperature cycle resistance and preparation method thereof, it is related to chip packaging field, low-temperature curing paste includes by mass percentage: 1-20% thermoplastic resin particles, 0.1-5.0% thermosetting resin, 0.1-1.5% solvent and remaining silver powder;Silver powder includes by mass percentage: 10-45% spherical nanometer silver particles a, 1-5% spherical nanometer silver particles b and remaining micron silver flake;The particle size of micron silver flake is 1-10 μm, the particle size of spherical nanometer silver particles a is 50-100 nm, the particle size of spherical nanometer silver particles b is 5-50 nm, the particle size of thermoplastic resin particles is 1-15 μm.The paste of component allocation of the present application by thermoplastic resin particles and silver powder etc., when joint structure formed by paste solidification experiences temperature cycle, thermoplastic resin particles can melt at high temperature and dynamically fill the pore between silver powder particles, to hinder the migration path of silver atom, inhibit the metal grain growth caused by temperature fluctuation, reduce the internal stress generated by grain coarsening.
Owner:SHENZHEN XINYUAN NEW MATERIALS CO LTD

A high tap density sheet silver powder for high solid content low temperature curing silver paste and a preparation method thereof

The application discloses a high-tapped-density flaky silver powder for high-solid-content low-temperature curing silver paste and a preparation method thereof, and can be used in the preparation of low-temperature high-thermal-conductivity LED conductive silver paste, high-solid-content low-temperature HJT silver paste and other low-temperature silver pastes requiring high solid content, and can replace the use of other foreign silver powders. The high-tapped-density flaky silver powder for high-solid-content low-temperature curing silver paste has concentrated flaky powder particle size distribution, and the tapped density reaches 5.5 or above, so that the market demand is met, and the blank of the high-tapped-density flaky silver powder required by the high-solid-content low-temperature curing silver paste in China is filled.
Owner:HUNAN ZONGCHENG NEW MATERIAL TECH CO LTD

A new type of flexible printed circuit board and camera module prepared based on a weldable low-temperature silver paste

The application discloses a novel flexible printed circuit board and camera module prepared based on weldable low-temperature silver paste, and belongs to the technical field of electronic materials and devices. The conductor pattern in the flexible printed circuit board comprises a main circuit pattern and an auxiliary function structure formed by weldable low-temperature cured silver paste. The curing temperature of the weldable low-temperature silver paste is 87-103 DEG C. The silver paste comprises conductive fillers, a polymer resin system, ester solvents, a curing agent, a silane coupling agent, polyamide wax thixotropic agents, polysiloxane defoaming agents, modified carbon nanotubes, modified antimony tin oxide powder, modified ceramic fillers and low-stress modifiers. The polymer resin system comprises hydrogenated bisphenol A type epoxy resin, diphenyl type epoxy resin and polyacrylate-CTBN copolymer. The conductive fillers comprise silver-coated copper flaky powder, nano silver wire and low-temperature alloy powder. Through the synergistic effect of components and the innovative process, the comprehensive improvement of mechanical properties, conductive properties, high-frequency characteristics and welding reliability is realized under the premise of ultralow-temperature curing.
Owner:NANO TOP ELECTRONICS TECH

Low temperature curable high strength benzoxazine silicone adhesive formulations and methods of use

ActiveCN117777946BFacilitate cross-linkingPromote cross-linking and curingAdhesive cementPolymer science
The present application relates to the low temperature curing high-strength benzoxazine type silicone adhesive formula and use method, the formula includes the benzoxazine group containing organic silicon compound and organic alkali compound, the mass ratio of benzoxazine group containing organic silicon compound, organic alkali compound is 100:0.1-20.The adhesive of the present application is based on the cooperation between the benzoxazine group containing organic silicon compound and the basic catalyst, can be cured at low temperature, realize the higher strength bonding.The benzoxazine type silicone adhesive formula provided by the present application can be directly used as adhesive, and the bonding strength is high;It can also be used as a basic formula, used as an adhesive after adding other fillers, to meet the different needs of various special occasions.
Owner:SHANDONG UNIV

High-performance modified epoxy adhesive and preparation method thereof

The invention discloses a high-performance modified epoxy adhesive and a preparation method thereof, and belongs to the technical field of epoxy adhesives, and the preparation method comprises the following steps: preparing a hydrolyzed silane solution, silane modified silicon dioxide, carboxylated silicon dioxide and modified nano silicon dioxide, and premixing and curing to obtain the high-performance modified epoxy adhesive. According to the method, curing process parameters are optimized, a mild segmented low-temperature curing system is constructed, the damage risk of traditional high-temperature curing on the thermosensitive base material is technically avoided, the bonding requirements of different thermosensitive base materials can be met without additionally adding a base material protection or pretreatment step, and the technical suitability is higher.
Owner:CHANGSHU JIANGNAN BOND CO LTD

A low-temperature curing organosilicon high-temperature resistant coating and its preparation method and application

The present invention relates to an organosilicon high-temperature resistant coating, and in particular to an organosilicon high-temperature resistant coating that cures at low temperatures, and a preparation method and application thereof. The organosilicon high-temperature resistant coating of the present invention is composed of component A and component B; component A includes an organosilicon resin and an organic modified silicone resin; component B includes a curing agent and an adhesion promoter. The resin system adopted by the present invention has a silicon-oxygen bond (-Si-O-) main chain content that is significantly higher than that of a chemically modified organosilicon resin, and the heat resistance will not be significantly reduced; the curing agent selected by the present invention can react with the organosilicon resin and the modified organosilicon resin at low temperatures or even at room temperature. Therefore, the high-temperature resistant coating prepared by the present invention reduces the curing temperature while also having heat resistance; it solves the contradiction between the low-temperature curing and poor thermal stability of organosilicon coatings.
Owner:MARINE CHEM RES INST CO LTD

A method for the bioactive and biocompatible surface treatment of dentures and implants

The present application relates to the technical field of biomedical materials, and discloses a biological activity and biocompatibility surface treatment method for dentures and implants, which comprises the following steps: a) performing surface pretreatment on the base body of the denture or implant; b) applying a composite coating containing hydroxyapatite particles and biocompatible resin adhesive on the surface of the pretreated base body; c) performing low-temperature thermal curing on the composite coating to form a composite coating layer; and d) performing precision polishing on the surface of the cured composite coating layer to selectively remove part of the resin adhesive on the surface. Through mechanical locking of the base body surface and chemical combination of the interface inside the coating, a composite coating layer which is firmly combined with the base body and chemically stable is obtained; meanwhile, through low-temperature curing and surface activation treatment, the hydroxyapatite is exposed on the surface of the coating layer while the biological activity of the hydroxyapatite is retained, so that the coating layer is endowed with effective biological functions.
Owner:DONGGUAN UFO AUTOMATION TECH

A low-temperature curing fluorocarbon coating for aluminum alloys and its preparation method

This invention relates to the field of coating technology, specifically to a low-temperature curing fluorocarbon coating for aluminum alloys and its preparation method. The invention involves adding eugenol, potassium carbonate, and decafluorobiphenyl to obtain modified biphenyl; then adding m-chloroperoxybenzoic acid to prepare a reinforcing agent. Next, γ-epoxypropoxypropyltrimethoxysilane is used to surface modify linear silica fillers, lamellar silica fillers, and dendritic silica fillers to obtain epoxy-modified wear-resistant fillers. Epoxy resin and epoxy-modified wear-resistant fillers are added to xylene, ultrasonically stirred, and then fluorocarbon resin, reinforcing agent, and curing agent are added, followed by continued ultrasonic stirring to obtain the fluorocarbon coating. The fluorocarbon coating prepared by this invention exhibits excellent adhesion, wear resistance, and mechanical strength, thus showing broad application prospects in the field of coating technology.
Owner:JIANGSU DADESEN CONSTR TECH CO LTD

Low-temperature quick-drying bar-planting adhesive and preparation method thereof

The invention belongs to the technical field of embedded steel bar adhesives, and particularly relates to a low-temperature quick-drying embedded steel bar adhesive which comprises a material A and a material B. The material A comprises the following components in parts by weight: 18-22 parts of epoxy resin, 4.8-5.3 parts of a diluent, 0.5-0.6 part of first white carbon black and 18-22 parts of first silica powder; and the material B comprises the following components in parts by weight: 10-12 parts of a curing agent, 0.1 part of a coupling agent, 0.5-0.8 part of second white carbon black, 6.5-11.5 parts of second silica powder and 0.03-0.06 part of color paste. The overall structure provided by the embodiment of the invention has certain thixotropy and does not flow during construction; good bonding performance with most structural materials is achieved; the adhesive is free of crystallization and low-temperature curing, can well meet various requirements specified in the national standard, meets the construction requirement at the low temperature of-10 DEG C, can be stressed for 2 hours at the normal temperature of 23 DEG C, is high in corrosion resistance, does not flow during construction, and has high adhesive property.
Owner:NAN JING MANKATE SCI& TECH CO LTD