Low-temperature curing cyanate ester adhesive and preparation method thereof

A cyanate ester and adhesive technology, applied in the direction of adhesives, adhesive types, film/sheet adhesives, etc. The effect of low, high bond strength, excellent heat resistance

Inactive Publication Date: 2012-09-19
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the technical problems of high curing temperature and short storage period at room tempe

Method used

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  • Low-temperature curing cyanate ester adhesive and preparation method thereof

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specific Embodiment approach 1

[0024] Specific embodiment 1: In this embodiment, the low-temperature curing cyanate ester adhesive consists of 70-100 parts by weight of cyanate resin, 2-20 parts of catalyst, 5-40 parts of modified resin, 3-15 parts of organic nanoparticles, 0.5-5 parts of inorganic nanoparticles, 1-5 parts of diluent and 5-15 parts of toughening agent;

[0025] The cyanate resin is bisphenol A cyanate, bisphenol B cyanate, bisphenol E cyanate, bisphenol M cyanate, phenolic cyanate, dicyclopentadiene type cyanate and cashew One or a combination of several phenol cyanate resins;

[0026] The modified resin is bisphenol A type epoxy resin E-54, bisphenol A type epoxy resin E-51, bisphenol A type epoxy resin E-44, bisphenol A type epoxy resin E-42, Bisphenol A type epoxy resin E-35, bisphenol A type epoxy resin E-31, bisphenol A type epoxy resin E-20, bisphenol A type epoxy resin E-14, bisphenol A type epoxy resin Resin E-12, bisphenol A type epoxy resin E-06, bisphenol A type epoxy resin E-0...

specific Embodiment approach 2

[0043] Specific embodiment two: the preparation method of this embodiment low-temperature curing cyanate ester adhesive is carried out according to the following steps:

[0044] 1. Weigh 70-100 parts of cyanate resin, 2-20 parts of catalyst, 5-40 parts of modified resin, 3-15 parts of organic nanoparticles, 0.5-5 parts of inorganic nanoparticles, 1-5 parts 1 part diluent and 5-15 parts toughening agent;

[0045] 2. Under the condition of 40℃~100℃, mix the cyanate ester resin, inorganic nanoparticles and organic nanoparticles and stir at a speed of 60~300r / min for 20~50min, and then in a high-speed mixer at a speed of 700~1500r / min Disperse at a speed of 20-60 minutes to obtain mixture A;

[0046] 3. Add the toughening agent weighed in step 1 to the mixture A, and stir at a speed of 60-300 r / min under the condition of 100°C-150°C until completely dissolved to obtain the mixture B;

[0047] 4. Add modified resin and diluent to mixture B under the condition of 100°C-150°C, stir...

specific Embodiment approach 3

[0048] Specific embodiment three: the difference between this embodiment and specific embodiment two is that the cyanate resin described in step one is bisphenol A cyanate, bisphenol B cyanate, bisphenol E cyanate, bisphenol M One or a combination of cyanate esters, phenolic cyanate esters, dicyclopentadiene type cyanate esters and cardanol cyanate resins. Others are the same as in the second embodiment.

[0049] In the present embodiment, when the cyanate resin is a composition, the ratio of each component is arbitrary.

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Abstract

The invention discloses a low-temperature curing cyanate ester adhesive and a preparation method thereof, which relate to an adhesive and a preparation method thereof and solve the technical problems of high curing temperature and short room-temperature storage period of the existing cyanate ester adhesive. The adhesive disclosed by the invention is manufactured by adopting cyanate ester resin, a catalyst, modified resin, organic nano particles, inorganic nano particles, a thinning agent and a toughening agent. The preparation method comprises the following steps that: firstly, a mixture A is prepared; secondly, the toughening agent is added into the mixture A to obtain a mixture B; thirdly, the modified resin and the thinning agent are added into the mixture B and are stirred and mixed uniformly, the catalyst is added into the mixture to obtain a substrate, and then the substrate and quartz fiber fabric are subjected to hot melting to be combined into a low-temperature curing cyanate ester carrier adhesive film, so the low-temperature curing cyanate ester adhesive is obtained. The curing temperature of the low-temperature curing cyanate ester adhesive prepared by the preparation method provided by the invention is low, the low-temperature curing cyanate ester adhesive can be cured at a temperature of 120-140 DEG C, and the room-temperature storage period of the low-temperature curing cyanate ester adhesive is as long as 20 days, and meanwhile, the low-temperature curing cyanate ester adhesive has high bonding strength and excellent heat-resistant performance and is suitable for bonded materials which cannot resist to high temperature.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof. Background technique [0002] As a new generation of structural adhesives, cyanate ester (CE) adhesive combines the high temperature resistance of bismaleimide resin and the good processability of epoxy resin, and has excellent mechanical properties, heat and humidity resistance and dielectric properties. It has a wide range of applications in aerospace, electronics and many other fields. At present, cyanate ester adhesives are mainly used in aerospace structural components, aircraft stealth structures, high-performance advanced radomes, satellite antennas, and printed circuit boards for high-frequency and high-speed communication electronic equipment. [0003] The curing reaction of cyanate ester is characterized by high curing temperature and long curing time. In the absence of catalyst, the curing is carried out at a relatively high temperature (above 200°C) for a long time (abo...

Claims

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Application Information

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IPC IPC(8): C09J179/04C09J163/00C09J7/04
Inventor 朱金华赵颖刘晓辉徐鑫李欣张大勇王刚
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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