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Modified cyanate adhesive film and preparation method thereof

A technology of cyanate ester and cyanate resin, which is applied in the direction of adhesives, epoxy resin adhesives, film/sheet adhesives, etc., and can solve the problems of easy crystallization of cyanate film, low mechanical properties, and high curing temperature. problems, to achieve excellent mechanical properties, excellent dielectric properties, and promote the effect of curing reaction

Active Publication Date: 2013-01-16
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the technical problems that the cyanate film prepared by the existing cyanate film preparation method has the technical problems that the surface is easy to crystallize when placed at room temperature, the mechanical properties are low and the curing temperature is high, and a modified cyanate film is provided. Ester film and preparation method thereof

Method used

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  • Modified cyanate adhesive film and preparation method thereof
  • Modified cyanate adhesive film and preparation method thereof
  • Modified cyanate adhesive film and preparation method thereof

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specific Embodiment approach 1

[0015] Specific implementation mode one: a kind of modified cyanate ester adhesive film provided in this embodiment, by weight parts by the cyanate ester resin of 60~100 parts, the epoxy resin of 5~40 parts, 1~50 parts It is prepared from 1 part of toughening resin, 1 part to 10 parts of reactive diluent and 1 part to 5 parts of accelerator.

[0016] The modified cyanate film provided by this embodiment has crystallization on the surface when it is placed at room temperature for more than 20 days, and has excellent mechanical properties. The shear strength at room temperature can reach 35.6 MPa, and the peel strength can reach 78.9 N / cm; agent, to promote the curing reaction of cyanate ester, so that the dielectric properties of the modified cyanate ester film are excellent, and the dielectric constant at room temperature reaches 3.09.

specific Embodiment approach 2

[0017] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the cyanate resin is 4,4'-dicyanate diphenylmethane, 4,4'-dicyanate diphenylethane, 4,4'-dicyanatodiphenylpropane, 4,4'-dicyanatodiphenylbutane, 2,2-bis(4-cyanato -3,5-dimethylphenyl)propane, 2,2-bis(4-cyanato-3-methylphenyl)propane, 2,2-bis(4-cyanato-3- tert-butylphenyl)propane, 2,2-bis(4-cyanato-3-methylphenyl)propane, 2,2-bis(4-cyanato-3-tert-butyl-6 -Methylphenyl)propane, 2,2-bis(4-cyanato-3-allylphenyl)propane, 1,1-bis(4-cyanato-3-tert-butyl- 6-methylphenyl)butane, 1,1-bis(4-cyanatophenyl)cyclohexane, 1,1-bis(4-cyanato-3-methylphenyl)cyclohexane One or a combination of hexane and 1,1-bis(4-cyanato-3-cyclohexyl-6-methyl)butane. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0018] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin and One or a combination of several phenolic epoxy resins; the toughening resin is vinyl resin, polyethersulfone, polysulfone, polyether ether ketone, polyphenylene ether, polyphenylene sulfide, poly One or a combination of imide resin, polyphenol oxygen resin and nylon, wherein the molecular weight of vinyl resin is 300,000~500,000. Others are the same as in the first or second embodiment.

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Abstract

The invention relates to a modified cyanate adhesive film and a preparation method thereof, belonging to the field of modified cyanate adhesive films and preparation methods thereof. The invention aims at solving the technical problems that the surface of the cyanate adhesive film prepared by using the existing cyanate adhesive film preparation method is apt to be crystallized during placing at room temperature, the mechanical performance is low and the curing temperature is high. The modified cyanate adhesive film is prepared by using the following components in parts by weight: 60-100 parts of cyanate resin, 5-40 parts of epoxy resin, 1-50 parts of toughened resin, 1-10 parts of activated thinner and 1-5 parts of accelerator. The preparation method comprises the following steps of: 1) weighing raw materials; 2) preparing matrix resin; 3) preparing adhesive; and 4) preparing the modified cyanate adhesive film. The modified cyanate adhesive film and the preparation method thereof are used in the fields of aerospace and electronic information.

Description

technical field [0001] The invention relates to the field of cyanate film and its preparation method. Background technique [0002] In modern technology, cyanate resin has good heat resistance, dielectric properties, mechanical properties and process properties, etc. It belongs to high-performance resin matrix materials like epoxy resin and bismaleimide resin, and can be Applied to structural materials, wave-transmitting materials, adhesive materials, dielectric functional materials, etc., used in the aerospace field, electronic information field, etc. For example, there are higher requirements for materials used in the bonding of high-performance radome honeycomb sandwich structures, the resistance of integrated circuit circuit boards and the manufacture of copper-clad circuit boards. [0003] In the field of aviation and aerospace, honeycomb sandwich structure is often used for bonding structural parts, and adhesive film is mostly used for bonding skin and honeycomb core....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J179/04C09J163/00C09J163/02C09J11/08C09J11/06
Inventor 王冠赵汉清付刚高堂玲匡弘付春明
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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