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Soldering flux for low temperature lead-free soldering paste

A lead-free solder paste and flux technology, used in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of reducing the printing stability, storage stability and welding reliability of solder paste, and achieve high The effect of antioxidant capacity, low production cost, and excellent printability

Inactive Publication Date: 2009-11-25
郴州金箭焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since metal bismuth (Bi) is relatively easy to oxidize, in order to ensure that this type of lead-free solder paste can be soldered well in the air, a relatively large amount of strong activator must be introduced into the flux
In this case, the solder metal easily reacts with the flux, and as a result of this reaction, the printing stability, storage stability, and soldering reliability of the solder paste are lowered.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Weigh respectively: 250g modified rosin, 110g esterified rosin, 20g acrylic resin; 276g 2-ethyl-1,3-hexanediol, 80g diethylene glycol monobutyl ether; 30g hydrogenated castor oil, 40g ethylene bis Stearic acid amide; 4g hydroquinone, 30g benzotriazole, 80g high temperature antioxidant A; 25g succinic acid, 20g adipic acid, 10g sebacic acid, 15g diphenylguanidine hydrochloride. Mix at 90°C to prepare a solder paste, then take 111g of the above solder paste and 890g of SnAgBi tin powder (25-45um) and mix them evenly in a planetary mixer, then store in a refrigerator at 5-10°C after sub-packaging.

Embodiment 2

[0035] Weigh respectively: 350g modified rosin, 60g acrylic resin; 276g 2-ethyl-1,3-hexanediol, 70g diethylene glycol monobutyl ether; 25g hydrogenated castor oil, 40g ethylene bis stearamide; 4g hydroquinone, 30g benzotriazole, 70g high temperature antioxidant A; 20g succinic acid, 20g adipic acid, 10g sebacic acid, 15g diphenylguanidine hydrochloride. Mix at 90°C to prepare a solder paste, then take 111g of the above solder paste and 890g of SnAgBi tin powder (25-45um) and mix them evenly in a planetary mixer, then store in a refrigerator at 5-10°C after sub-packaging.

Embodiment 3

[0037] Weigh respectively: 250g modified rosin, 110g esterified rosin, 20g acrylic resin; 276g 2-ethyl-1,3-hexanediol, 80g diethylene glycol monobutyl ether; 30g hydrogenated castor oil, 40g ethylene bis Stearic acid amide; 4g hydroquinone, 30g benzotriazole, 80g high temperature antioxidant A; 25g succinic acid, 20g adipic acid, 10g sebacic acid, 15g diphenylguanidine hydrochloride. Mix at 90°C to prepare a solder paste, then take 115g of the above solder paste and 855g of SnAgBi tin powder (25-45um) and mix them evenly in a planetary mixer, then store in a refrigerator at 5-10°C.

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PUM

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Abstract

The invention relates to an environment-friendly soldering flux for low temperature lead-free soldering paste for soft soldering; the soldering paste is characterized by comprising the ingredients of weight percentages as follows: 30-50% of rosin or modified rosin and synthetic resin; 30-40% of high boiling solvent; 3-10% of activating agent; 1-10% of rheological agent; and 0.1-3% of stabilizing agent. The low temperature lead-free soldering paste prepared by the soldering flux invented is featured with good high temperature oxidation resistance, long printing time, strong welding wettability and proper viscosity of soldering paste, which is in particular applied to the through hole plugged reflow soldering in high frequency processing procedure, also to the SMT surface mount reflow soldering.

Description

Technical field: [0001] The invention relates to an environment-friendly flux for lead-free solder paste for soldering, in particular to a flux for preparing low-temperature lead-free solder paste for through-hole insertion reflow soldering. Background technique: [0002] Sn-Pb solder paste has become a typical solder alloy for electronic packaging and assembly in the current electronics industry due to its excellent wettability, solderability, electrical conductivity, mechanical properties, and low cost. However, Pb and Pb-containing compounds are toxic and harmful substances that endanger human health and pollute the environment. At present, Japan, the European Union, and the United States have successively formulated their own lead-free solder processes. The WEEE (Waste Electrical and Electronic Equipment) and RoHS (Resbiction of Hazrdous Subsfances) directives have mandated that since July 1, 2006, in European shopping malls Electronic products sold on the website shoul...

Claims

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Application Information

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IPC IPC(8): B23K35/24
Inventor 邓和升杨立明陈朗秋石波卢斌
Owner 郴州金箭焊料有限公司
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