Underfill adhesive with high surface insulation resistance and preparation method thereof

An underfill and insulation resistance technology, applied in the field of underfill with high surface insulation resistance and its preparation, can solve the problems of low surface insulation resistance, poor high temperature adhesion, poor high and low temperature resistance, etc. High transition temperature, high surface insulation resistance, good high and low temperature resistance

Active Publication Date: 2019-12-20
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Microelectronics packaging technology is developing in the direction of high density and multiple I / O pins. In common BGA and CSP microelectronics packaging technologies, the pitch of solder balls is generally 0.8mm, the distance between pins is short, and moisture absorption after packaging It will reduce the service life of the components, make the electrical parameters of the components worse, and cause the components to open and fail
After moisture absorption, the surface insulation resistance decreases, and it is also easy to cause short circuit and failure of components
Underfill is widely used in packaging technology. Epoxy resin is usually used as the main raw material for underfill. This is a thermosetting resin. After curing, it has the advantages of good adhesion, good dimensional stability, and high mechanical strength. High and low temperature performance is poor, and moisture resistance is poor, which leads to most underfills having shortcomings such as high low temperature brittleness, poor high temperature adhesion, poor moisture resistance, and low surface insulation resistance after moisture absorption, which cannot meet the needs of microelectronics. Requirements for high packaging density, good electrical performance, and high reliability

Method used

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  • Underfill adhesive with high surface insulation resistance and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] An underfill adhesive with high surface insulation resistance. Its components include bisphenol F epoxy resin EXA-830LVP 620g, dicyclopentadiene phenol epoxy resin HP-7200 50g, polydimethyl silicon 8 g of oxane compound, 6 g of γ-glycidoxypropyltrimethoxysilane, 6 g of carbon black, and 310 g of bishydrazine compound VDH-J.

[0027] The method for preparing the underfill with high surface insulation resistance is as follows:

[0028] (1) Weigh 620g of bisphenol F epoxy resin EXA-830LVP, HP-720050g of dicyclopentadiene phenol epoxy resin and 6g of carbon black, put them into the reactor and heat up to 90°C, stir at high speed for 1 hour, and mix well;

[0029] (2) Weigh 8g of polydimethylsiloxane compound and 6g of γ-glycidoxypropyltrimethoxysilane under the condition of 30°C, put them into the reactor, stir at high speed for 1.5h, and mix well;

[0030] (3) Weigh 310g of the bishydrazine compound VDH-J under 22°C, put it into the reaction kettle and evacuate it, stir at low spe...

Embodiment 2

[0033] An underfill adhesive with high surface insulation resistance. Its components in parts by weight include: bisphenol F epoxy resin EXA-835LV 600g, biphenol epoxy resin NC-3000 60g, polydimethylsiloxane Compound 8g, γ-glycidoxypropyltrimethoxysilane 6g, carbon black 6g, bishydrazine compound VDH-J 200g, and bishydrazine compound UDH-J 120g.

[0034] The method for preparing the underfill with high surface insulation resistance is as follows:

[0035] (1) Weigh 600g of bisphenol F epoxy resin EXA-835LV, 60g of biphenol-type epoxy resin NC-3000 and 6g of carbon black, put them into the reactor and heat up to 95℃, stir at high speed for 1h, and mix well;

[0036] (2) Weigh 8g of polydimethylsiloxane compound and 6g of γ-glycidoxypropyltrimethoxysilane at 35°C, put them into the reactor and stir at high speed for 1h, and mix well;

[0037] (3) Under the condition of 24°C, weigh 200g of bishydrazine compound VDH-J and 120g of bishydrazine compound UDH-J, put them into the reaction ket...

Embodiment 3

[0040] An underfill adhesive with high surface insulation resistance. Its components include, in parts by weight: bisphenol F epoxy resin EXA-830LVP 620g, biphenol epoxy resin NC-3000 40g, polydimethylsiloxane Compound 8g, γ-glycidoxypropyltrimethoxysilane 6g, carbon black 6g, bishydrazine compound VDH-J 160g, and bishydrazine compound UDH-J 160g.

[0041] The method for preparing the underfill with high surface insulation resistance is as follows:

[0042] (1) Weigh 620g of bisphenol F epoxy resin EXA-830LVP, 40g of biphenol-type epoxy resin NC-3000 and 6g of carbon black, put them into the reactor and heat up to 98°C, stir at high speed for 0.8h, and mix well;

[0043] (2) Weigh 8g of polydimethylsiloxane compound and 6g of γ-glycidoxypropyltrimethoxysilane under the condition of 25℃, put them into the reactor and stir at high speed for 1h, and mix well;

[0044] (3) Under the condition of 24°C, weigh 160g of bishydrazine compound VDH-J and 160g of bishydrazine compound UDH-J, put t...

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PUM

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Abstract

Belonging to the technical field of filling adhesive preparation, the invention particularly relates to an underfill adhesive with high surface insulation resistance and a preparation method thereof.The underfill adhesive disclosed by the invention does not adopt any flexibilizer or plasticizer, has the characteristics of low storage modulus, high glass-transition temperature, low hygroscopicity,good high and low temperature resistance, high surface insulation resistance under the conditions of high temperature and high humidity, etc., and ensures long-term reliable use of micro-sized densely packaged components in various environments.

Description

Technical field [0001] The invention belongs to the technical field of filler preparation, and in particular relates to an underfill with high surface insulation resistance and a preparation method thereof. Background technique [0002] The era of electronic information technology is coming, and electronic products are required to have the characteristics of multi-functionality, lightness and miniaturization. Microelectronic packaging technology is developing towards high density and multiple I / 0 pin counts. In the common BGA and CSP microelectronic packaging technology, the pitch of the solder balls and the solder joints is generally 0.8mm, the lead distance is short, and moisture absorption after packaging It will reduce the service life of the components, make the electrical parameters of the components worse, and cause the components to open and fail. After moisture absorption, the surface insulation resistance decreases, and it is also easy to cause short circuit and failur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L83/04C08K3/04C08K5/5435C08G59/40
CPCC08L63/00C08G59/4035C08L2205/025C08L83/04C08K3/04C08K5/5435
Inventor 闫善涛陈田安王建斌
Owner YANTAI DARBOND TECH
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