Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for preparing polytetrafluoroethylene copper-clad plate

A technology of polytetrafluoroethylene and copper clad laminates, which is applied in chemical instruments and methods, lamination devices, lamination auxiliary operations, etc., can solve problems such as high loss factor, low bending strength, and small surface insulation resistance

Inactive Publication Date: 2011-09-07
禹胜林
View PDF5 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the copper clad laminates in the prior art have high dielectric loss factor, small surface insulation resistance, low bending strength, and low peel strength.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for preparing polytetrafluoroethylene copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method for preparing polyethylene copper-clad laminates, comprising pretreatment of glass fiber cloth, preparation of dipping solution, dipping of glass fiber cloth to obtain medium cloth and medium cloth coated with copper and aluminum, medium cloth covered with copper and aluminum, the medium Cloth clad copper clad aluminum includes the following steps:

[0024] a. Cut the dielectric cloth, copper foil and aluminum foil into 330mm×460mm specifications;

[0025] b. Lay aluminum foil, copper foil, dielectric cloth, copper foil, and aluminum foil on the template in sequence, and then put it into a hot press machine. Keep this state for 2.5 hours and then cool naturally. When the temperature is cooled to 200° C., quench for 30 minutes to obtain the modified polytetrafluoroethylene copper-clad laminate.

[0026] Each material performance index described in the present invention is as follows:

[0027] Polytetrafluoroethylene concentrated dispersion: FR301G, solid conte...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
flexural strengthaaaaaaaaaa
peel strengthaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for preparing a polytetrafluoroethylene copper-clad plate, which comprises the following steps of: pretreating glass fiber cloth, preparing impregnation liquid, preparing dielectric cloth by impregnating the glass fiber cloth, and cladding copper and aluminum on the dielectric cloth, wherein the step of cladding copper and aluminum on the dielectric cloth comprises the following sub-steps of: a, cutting the dielectric cloth, copper foils and aluminum foils according to required sizes; and b, staking on a template in a sequence of an aluminum foil, a copper foil, the dielectric cloth, a copper foil and an aluminum foil, putting into a hot press, raising the temperature in a mode of wave bands, applying pressure of 6-9MPa when the temperature is between 360 and 380DEG C, cooling, and quenching when the temperature is reduced to be 200DEG C to obtain the modified polytetrafluoroethylene copper-clad plate. The dielectric cloth copper-clad plate has the dielectric loss factor reduced from 1*10<-3> to 7*10<-4>, the surface insulation resistance improved from 1*10<10> to the average 10<15>, the bending strength improved from 80MPa to average 140MPa, and the peel strength from 1.5kN / m to average 3kN / m.

Description

technical field [0001] The invention relates to a preparation method for copper-clad laminates, in particular to a preparation method for polytetrafluoroethylene copper-clad laminates. Background technique [0002] Printed circuit boards are widely used in computer, communication, instrumentation, military industry, automobile, scientific equipment and other fields to provide identification and graphics for component insertion, welding, inspection and maintenance. The substrate of the printed circuit board is also called a copper clad laminate. With the gradual development of high-speed and high-frequency communication and electronic products, the market demand for high-frequency high-performance PTFE copper-clad laminates is also growing rapidly. [0003] PTFE copper-clad laminate is made of glass fiber cloth through a series of treatments to obtain dielectric cloth, and then the dielectric cloth and copper foil are combined. Therefore, the preparation of glass fiber cloth...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B37/06B32B38/08C08L27/18
Inventor 禹胜林马立萍沈海平
Owner 禹胜林
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com