A kind of solder paste with low dielectric loss and high reliability and preparation method thereof

A reliable, low-dielectric technology, applied in welding equipment, welding media, welding/cutting media/materials, etc., can solve the problem of high dielectric loss of solder paste, reduce dielectric loss, reduce post-soldering residue, and reduce signal interference Effect

Active Publication Date: 2022-04-01
中山翰华锡业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problem of high dielectric loss of the existing solder paste, the present invention provides a solder paste with low dielectric loss and high reliability, no corrosive residue will exist on the circuit board after soldering, and the obtained solder paste has low residue, Solder paste with low dielectric loss, high surface insulation resistance after soldering, and high reliability, suitable for use in 5G-related application scenarios

Method used

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  • A kind of solder paste with low dielectric loss and high reliability and preparation method thereof
  • A kind of solder paste with low dielectric loss and high reliability and preparation method thereof
  • A kind of solder paste with low dielectric loss and high reliability and preparation method thereof

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Effect test

Embodiment 1

[0032] A low dielectric loss high reliability solder paste, including the following weight component composition, 88.9 wt% solder alloy powder, 11.1% by weight of flux, wherein the group dispensing of tie alloy powder is shown in Table 2, the help The group distribution of the flux is described, for example, the preparation method thereof, comprising the steps of:

[0033] According to Table 2, the weight percentage of Table 3 refers to each component, backup; first add solvent to the container, heated to 120 ° C, then add rosin, stir well to rosin completely dissolve, add thermal resin, maintain temperature at 120 ° C Next, the thixotropic agent is added to the container, maintain the temperature and stir until completely dissolve; the temperature drops to 70 ° C, adding an antioxidant, organic acid and an organic amine, and stirring the temperature and stirring for 45 minutes; The rotational speed of MIN is ground to a particle diameter of less than 20 microns to obtain flux; ad...

Embodiment 2

[0035] A low dielectric loss high reliability solder paste, including the following weight components, 90.1% by weight solder alloy powder, 9.9 wt% flux, wherein the group dispensing of the tie alloy powder is shown in Table 2, the help The group distribution of the flux is described, for example, the preparation method thereof, comprising the steps of:

[0036] According to Table 2, the weight percentage of Table 3 refers to each component, backup; first add solvent to the container, heating to 125 ° C, then add rosin, stir well to rosin completely dissolve, add thermal resin, maintain temperature at 125 ° C Next, the thixotropic agent is added to the container, maintain the temperature and stir until completely dissolve; the temperature drops to 65 ° C, adding an antioxidant, organic acid and an organic amine, and stirring the temperature and stirring for 30 minutes; The rotational speed of MIN is ground to a particle diameter of less than 20 microns to obtain flux; add flux and...

Embodiment 3

[0038] A low dielectric loss high reliability solder paste, including the following weight components, 85.4 wt% solder alloy powder, 14.6 wt% flux, wherein the group dispensing of the tie alloy powder is shown in Table 2, the help The group distribution of the flux is described, for example, the preparation method thereof, comprising the steps of:

[0039] According to Table 2, the weight percentage of Table 3 refers to each component, backup; first add the solvent to the container, heated to 130 ° C, then add rosin, stir until the rosin is completely dissolved, add the thermosetting resin, maintain the temperature at 130 ° C Next, the thixotropic is added to the container, keeps the temperature and stir until completely dissolve; the temperature drops to 80 ° C, the antioxidant, organic acid and the organic amine are added, and the temperature is maintained and stirred for 50 minutes; The rotation of MIN is ground to a particle diameter of less than 20 microns to obtain flux; add...

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Abstract

The invention discloses a solder paste with low dielectric loss and high reliability and a preparation method thereof. The technical solution is: 85.4-91.6wt% solder alloy powder, 8.4-14.6wt% flux, wherein the tin powder includes 2.5-4.1 wt% silver, 0.5‑2.6wt% copper, 6.5‑8.7wt% indium, 3.1‑4.7wt% zinc, 0.11‑0.25wt% molybdenum, 0.09‑0.19wt% vanadium, 0.08‑0.21wt% lutetium and the rest of tin, the flux includes 35.4‑42.6wt% rosin, 8.4‑14.6wt% organic acid, 1.8‑4.6wt% organic amine, 3.3‑6.1wt% thixotropic agent, 3.5‑6.8 wt% of thermosetting resin, 1.4-3.2wt% of antioxidant and the balance of organic solvent, the thermosetting resin is composed of 48-56wt% of cyanate resin and 44-52wt% of epoxy resin. There will be no corrosive residue on the board, and the prepared solder paste has low residue, low dielectric loss, high surface insulation resistance after soldering, and high reliability solder paste, which is suitable for use in 5G-related application scenarios.

Description

[Technical field] [0001] The present invention belongs to the technical field of welding materials, and more particularly to a low dielectric loss high reliability solder paste and a preparation method thereof. 【Background technique】 [0002] At present, high-end electronic information companies represented by Huawei and ZTE have mainly dependent on imports. The main reasons are: Currently, radioactive hosae elements such as Bi, Pb, Co are added. There is an alpha decay in the solder alloy, and continuously release α particles in the semiconductor device, thereby causing a single particle effect in the semiconductor device, and the integrity of the 5G signal has a loss, it is harmed to the data loss of electronic equipment. Functional interrupt, etc .; on the other hand, the magnetic material such as Fe, Co, Ni, Nd is added to the welding alloy component, and the magnetic thermal conductivity of the magnetic material produces non-linear changes with the magnetic field change, res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/363B23K35/36B23K35/40
CPCB23K35/262B23K35/362B23K35/3613B23K35/3612B23K35/40
Inventor 李爱良马鑫曹正冷学魁王钰
Owner 中山翰华锡业有限公司
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