A kind of halogen-free flux for tin-bismuth series lead-free solder paste and preparation method thereof

A lead-free solder paste and flux technology, used in welding equipment, welding media, manufacturing tools, etc., can solve problems such as adverse effects on mechanical properties and electrical properties of solder joints, reducing surface insulation resistance, solder joints and substrate corrosion, etc. Achieve high mechanical strength after welding, prevent blackening of solder joints, and reduce corrosion.

Active Publication Date: 2017-03-01
深圳市同方电子新材料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although such highly active organic halides can effectively remove black oxides and assist solder to climb tin quickly, if the organic halides used in large quantities remain in the solder joints without time to decompose and volatilize during the soldering process, this will Potential adverse effects on the mechanical and electrical properties of solder joints, such as corrosion of solder joints and substrates, reduction of surface insulation resistance and short circuits, etc.

Method used

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  • A kind of halogen-free flux for tin-bismuth series lead-free solder paste and preparation method thereof
  • A kind of halogen-free flux for tin-bismuth series lead-free solder paste and preparation method thereof

Examples

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Effect test

Embodiment 1

[0031] Flux raw materials: 20g perhydrogenated rosin, 20g P-105 resin, 0.5g imidazole, 4g malonic acid, 3g ethylhexyl isooctanoic acid, 3g ethanolamine, 3g diethanolamine, 8g monooctyl phosphate, modified hydrogenated castor oil 4g, ethyl octane glycol 34.5g;

[0032] Preparation method: Put 4g of malonic acid, 3g of ethylhexylisooctanoic acid, 3g of ethanolamine and 3g of diethanolamine into a reaction vessel, heat to 100°C, stir for 20 minutes, make it fully react, and prepare acid ammonium salt; Add 20g of perhydrogenated rosin, 20g of P-105 resin, 0.5g of imidazole and 34.5g of ethyl octane glycol into another reaction vessel, heat to 140°C, stir for 15 minutes to make it evenly mixed; then cool the mixture to 100 ℃, add the above-mentioned acid ammonium salt and 8 g of monoisooctyl phosphate, stir for 15 minutes, and mix well; continue to cool down to 50 ℃, add 4 g of modified hydrogenated castor oil, and use a high-speed emulsifier to emulsify at high speed for 10 minute...

Embodiment 2

[0034] Flux raw materials: water white rosin 20g, colorless rosin 10g, P-105 resin 4g, polybutene 4g, 2-ethylimidazole 6g, 2,6-di-tert-butyl-4-methylphenol 6g, dibutylene 5g of glutaric acid, 5g of glutaric acid, 0.2g of ethylhexyl isooctanoic acid, 8g of triethanolamine, 0.2g of phenyl glycidyl ether, 0.3g of polyoxyethylene glyceryl ether, 10g of ethylene stearic acid amide, ethyl hexanediol 10g and methylpentanediol 11.3g;

[0035] Preparation method: Put 5g of succinic acid, 5g of glutaric acid, 0.2g of ethylhexylisooctanoic acid, and 8g of triethanolamine into a reaction vessel, heat to 120°C, stir for 30 minutes, and make it fully react to prepare ammonium acid Salt; add 20g of water-white rosin, 10g of colorless rosin, 4g of P-105 resin, 4g of polybutene, 6g of 2-ethylimidazole and 2,6-di-tert-butyl-4-methyl in another reaction vessel 6g of phenol, 10g of ethyl hexanediol and 11.3g of methylpentanediol, heated to 180°C, stirred for 20 minutes, and mixed evenly; then th...

Embodiment 3

[0037] Flux raw materials: 685 rosin 10g, 610 rosin 20g, 604 rosin 17g, polyisobutylene 8g, imidazole 0.5g, adipic acid 1g, sebacic acid 2g, benzoic acid 2g, ethylhexylisooctanoic acid 3g, diethylenetriamine 14g , monoisooctyl phosphate 2g, modified hydrogenated castor oil 2g, ethylene stearic acid amide 3g, tetraethylene glycol dimethyl ether 5g, diethylene glycol monohexyl ether 5g and triethyl carbitol ether 5.5 g;

[0038]Preparation method: Put 1g of adipic acid, 2g of sebacic acid, 2g of benzoic acid, 3g of ethylhexylisooctanoic acid and 14g of diethylenetriamine into a reaction vessel, heat to 110°C, and stir for 25 minutes to make it fully react , to prepare acid ammonium salt; in another reaction vessel, add 10g of 685 rosin, 20g of 610 rosin, 17g of 604 rosin, 8g of polyisobutylene, 0.5g of imidazole, 5g of tetraethylene glycol dimethyl ether, diethylene glycol monohexyl ether 5g and 5.5g of triethyl carbitol ether, heated to 160°C, stirred for 18 minutes, and mixed...

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Abstract

The invention provides a halogen-free soldering agent for tin bismuth system unleaded tin paste and a preparation method thereof. The halogen-free soldering agent for the tin bismuth system unleaded tin paste consists of 20-47% of rosin, 8-20% of thickening agent, 0.5-12% of antioxidant, 4-15% of organic acid, 0.2-3% of ethylhexyl isocaprylic acid, 6-14% of organic amine, 0.5-8% of surface active agent,4-10% of thixotropic agent and the balance solvent. By optimizing selection of an active system of the soldering agent, the halogen-free soldering agent for the tin bismuth system unleaded tin paste enables the tin paste prepared from the halogen-free soldering agent for the tin bismuth system unleaded tin paste and tin bismuth system unleaded tin powder to not only contain no halogen element such as fluorine, chlorine, bromine, iodine and astatine, but also have good welding ability in soldering, and then generates full and bright soldering spots, does not generate black oxides, and is high in surface insulation resistance after the soldering, and is specially suitable for assembly welding of electronic parts and components, which require low soldering temperature.

Description

technical field [0001] The invention relates to the technical field of solder paste, in particular to a halogen-free flux for tin-bismuth series lead-free solder paste and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, lead-free solder paste as a connecting material for electronic components and circuit boards has been widely used. At present, the mainstream lead-free solder paste alloy composition in the market is mainly Sn-3.0Ag-0.5Cu (abbreviated as SAC305), its melting point is above 217°C, and the corresponding reflow soldering temperature is also as high as above 240°C. For sensitive or low-temperature soldering fields with poor thermal shock resistance (such as LED lighting industry and radiators, etc.), the soldering temperature should not be too high, so SAC305 lead-free solder paste can no longer meet the low-temperature soldering requirements. Therefore, tin-bismuth lead-free solder paste with a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3612B23K35/40
Inventor 刘家党肖德成肖德华肖大为肖涵飞肖健肖雪邓忠庆邱海波
Owner 深圳市同方电子新材料有限公司
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