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Halogen-free scaling powder used for lead-free solder paste and preparation method thereof

A technology of lead-free solder paste and flux, which is applied in the soldering materials of electrical products and in the field of electronics, which can solve problems such as short circuit of electronic component pins, potential safety hazards in use reliability, and many halogen residues, and achieve surface insulation High resistance, good weldability, and excellent mechanical properties

Active Publication Date: 2013-04-03
广东中实金属有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This type of substance has very high activity, and the soldering flux can be tinned quickly and the welding effect is good; however, due to the large amount of halogen residues after soldering, this type of substance has brought great safety hazards to the reliability of the product, especially in Under the condition of high temperature and high humidity, such substances are very easy to ionize halogen ions under the interaction of thermal field and electric field, corrode circuit boards and solder joints, cause short circuits between pins of electronic components, cause components to fail, and make electronic products The reliability of the
[0005] Organic acids as activator components are widely used in the preparation of halogen-free soldering flux due to their advantages of low corrosion and high reliability. However, the weak activity of organic acids is not enough to fully remove lead-free tin alloy powder and the oxide on the surface of the pad meet the wetting requirements to form a firm and reliable solder joint

Method used

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  • Halogen-free scaling powder used for lead-free solder paste and preparation method thereof
  • Halogen-free scaling powder used for lead-free solder paste and preparation method thereof
  • Halogen-free scaling powder used for lead-free solder paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] raw material:

[0032] Water white rosin 10g, polymerized rosin 20g, hydrogenated rosin 25g, succinic acid 1g, glutaric acid 1g, glycolic acid 1g, dodecyl dimethyl amine oxide 0.1g, hydrogenated castor oil 2g, imidazole 0.01g, paraffin 0.1 g, dipropylene glycol 34.79g, castor oil 2g, soybean oil 3g;

[0033] Add 10g of water-white rosin, 20g of polymerized rosin, 25g of hydrogenated rosin, 1g of succinic acid, 1g of glutaric acid, 1g of glycolic acid, 0.1g of dodecyldimethylamine oxide and 34.79g of dipropylene glycol into the vessel after mixing Heat up to 145°C, stir until completely dissolved to obtain a mixture; then cool the above mixture to 80°C, add 2g of hydrogenated castor oil, 0.01g of imidazole and 0.1g of paraffin, stir until complete dissolution to obtain a secondary mixture; The temperature of the secondary mixture was lowered to 35° C., 2 g of castor oil and 3 g of soybean oil were added, and stirred evenly to obtain a halogen-free flux for lead-free sol...

Embodiment 2

[0035] raw material:

[0036] Polymerized rosin 10g, hydrogenated rosin 30g, suberic acid 6g, glycolic acid 6g, dimethyl alkyl betaine 1g, cocamidopropyl betaine 2g, modified hydrogenated castor oil 2g, 6500 thixotropic agent 4g, p-benzene Diphenol 1g, 2,6-di-tert-butyl-4-methylphenol 2g, paraffin 2g, diethylene glycol 20g, diethylene glycol monohexyl ether 13.9g, castor oil 0.1g;

[0037] 10 g of polymerized rosin, 30 g of hydrogenated rosin, 6 g of suberic acid, 6 g of glycolic acid, 1 g of dimethyl alkyl betaine, 2 g of cocamidopropyl betaine, 20 g of diethylene glycol and 13.9 g of diethylene glycol monohexyl ether were added After mixing in a container, heat up to 140°C, stir until completely dissolved to obtain a mixture; then lower the temperature of the above mixture to 80°C, add 2g of modified hydrogenated castor oil, 4g of 6500 thixotropic agent, 1g of hydroquinone, 2g of 2,6-di-tert-butyl-4-methylphenol and 2g of paraffin, stirred until complete dissolution to obta...

Embodiment 3

[0039] raw material:

[0040]Disproportionated rosin 25g, sebacic acid 4g, dodecanoic acid 4g, glycolic acid 4g, octylphenol polyoxyethylene ether 2g, alkylphenol polyoxyethylene ether 1g, 6650 thixotropic agent 2g, 7000 thixotropic agent 3g, hard Fatty acid amide 1g, 2,6-di-tert-butyl-4-methylphenol 1.5g, paraffin 0.5g, glycerin 35g, triethylene glycol monobutyl ether 15g, sesame oil 2g;

[0041] 25g disproportionated rosin, 4g sebacic acid, 4g dodecanoic acid, 4g glycolic acid, 2g octylphenol ethoxylate, 1g alkylphenol ethoxylate, 35g glycerin and 15g triethylene glycol monobutyl ether Add it into the container and mix it, heat it up to 140°C, stir until it is completely dissolved to obtain the mixture; then lower the temperature of the above mixture to 90°C, add 2g of 6650 thixotropic agent, 3g of 7000 thixotropic agent, and 1g of stearic acid amide , 1.5g of 2,6-di-tert-butyl-4-methylphenol and 0.5g of paraffin, stirred until complete dissolution to obtain a secondary mix...

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Abstract

The invention relates to a halogen-free scaling powder used for a lead-free solder paste and a preparation method thereof. The halogen-free scaling powder used for the lead-free solder paste is characterized by being composed of the following components by weight percent: 25-55% of modified rosin, 3-12% of active agent, 0.1-3% of surface active agent, 2-6% of thixotropic agent, 0.01-3% of antioxidant, 0.1-2% of release agent, 30-50% of solvent and 0.1-5% of oil wetting agent, wherein the scaling powder does not contain halogen; the activity of the scaling powder can be obviously improved through adding organic carboxylic acid and hydroxy carboxylic acid as the active agent, and combining the active agent with the surface active agent; and in addition, the oil wetting agent is used, so that a layer of thin continuous oil membrane is enabled to cover the surface of a welding spot in a whole reflow soldering technological process of the solder paste, thereby playing an oxygen insulating function, and greatly improving the expansibility and the wetting property. The solder paste prepared by the scaling powder provided by the invention and a tin-silver-copper lead-free solder has the advantages of being good in printing performance, clean in demoulding, good in solderability and strong in wettability, having no penetrability corrosion in a bronze mirror after soldering, being high in soldering spot reliability and excellent in mechanical property, and capability of satisfying the high reliability requirements of high-end electronic products.

Description

technical field [0001] The invention relates to a halogen-free flux for lead-free solder paste, in particular to a halogen-free flux for tin-silver-copper lead-free solder paste, belonging to the field of soldering materials for electronic and electrical products. [0002] The invention also relates to a preparation method of the halogen-free flux. Background technique [0003] With the development of electronic products towards miniaturization, light weight and multi-functionality, packaging technology is developing towards high density, narrow pitch and miniaturization of solder joints; correspondingly, surface mount technology (SMT) with many advantages has been It has become the mainstream technology and process applied in the field of electronic packaging. As the main connecting materials of SMT, flux and solder paste have become the focus of research and industry. Their performance directly affects the quality of soldering, and directly determines the quality, reliabi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
Inventor 方喜波梁静珊黄家强马骁张新平
Owner 广东中实金属有限公司
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