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Wash-free soldering flux

A flux and no-cleaning technology, which is applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of low efficiency and high cost, achieve low spatter value, good welding quality, and smooth and bright solder joints Effect

Active Publication Date: 2018-09-28
五河县俊宝钢结构有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are still many companies still using the process that belongs to the aforementioned process of using rosin tree finger-based flux solder and then cleaning it with cleaning agent, which has low efficiency and high cost

Method used

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  • Wash-free soldering flux

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] A no-clean flux, which contains the following components in terms of mass percentage: 7.0% film-forming agent, 3.5% active agent, 0.3% surfactant, 0.20% corrosion inhibitor, 0.45% additive, and the rest Solvent, mix the above ingredients evenly, heat to 70°C, reflux and stir for 2 hours, cool to 20°C, and filter to obtain the product, wherein the film-forming agent is composed of the following ingredients in parts by weight: 45 parts of amino acid ester, 30 parts of glyceryl monostearate, 25 parts of epoxy resin, 20 parts of naphthalene diphenol resin, and 15 parts of bishydroxybiphenyl resin.

[0015] As a further description of the above scheme, the active agent is composed of the following components in parts by weight: 12 parts of adipic acid, 13 parts of sebacic acid, 15 parts of salicylic acid, 18 parts of stearic acid, 21 parts of boric acid, three 24 parts of ethanolamine.

[0016] As a further description of the above solution, the solvent consists of the foll...

Embodiment 2

[0021] A no-clean flux containing the following components in terms of mass percentage: 8.0% film-forming agent, 3.8% active agent, 0.35% surfactant, 0.23% corrosion inhibitor, 0.48% additive, and the rest Solvent, mix the above ingredients evenly, heat to 75°C, reflux and stir for 2.3 hours, cool to 23°C, and filter to obtain the product, wherein the film-forming agent is composed of the following ingredients in parts by weight: 50 parts of amino acid ester, 33 parts of glyceryl monostearate, 28 parts of epoxy resin, 23 parts of naphthalene diphenol resin, and 17 parts of bishydroxybiphenyl resin.

[0022] As a further description of the above scheme, the active agent is composed of the following components in parts by weight: 13 parts of adipic acid, 14 parts of sebacic acid, 16 parts of salicylic acid, 19 parts of stearic acid, 22 parts of boric acid, three 25 parts of ethanolamine.

[0023] As a further description of the above scheme, the solvent consists of the followin...

Embodiment 3

[0028] A no-clean flux containing the following components in terms of mass percentage: 8.5% film-forming agent, 4.0% active agent, 0.4% surfactant, 0.25% corrosion inhibitor, 0.50% additive, and the rest Solvent, mix the above ingredients evenly, heat to 80°C, reflux and stir for 2.5 hours, cool to 25°C, and filter to obtain the product, wherein the film-forming agent consists of the following ingredients in parts by weight: 55 parts of amino acid ester, 35 parts of glyceryl monostearate, 30 parts of epoxy resin, 25 parts of naphthalene diphenol resin, and 20 parts of bishydroxybiphenyl resin.

[0029] As a further description of the above scheme, the active agent consists of the following components in parts by weight: 15 parts of adipic acid, 15 parts of sebacic acid, 18 parts of salicylic acid, 20 parts of stearic acid, 23 parts of boric acid, three 26 parts of ethanolamine.

[0030] As a further description of the above scheme, the solvent consists of the following compo...

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Abstract

The invention relates to the technical field of welding material and discloses a wash-free soldering flux. The flux contains the following components in terms of mass percentage: 7.0 to 8.5% of film former, 3.5 to 4.0% of active agent, 0.3 to 0.4% of surfactant, 0.20 to 0.25% of corrosion inhibitor, 0.45 to 0.50% of additive and the remaining is solvent. The above components are uniformly mixed, heated to 70 to 80 DEG C, and undergo reflux stirring reaction for 2 to 2.5 hours, cooled to 20 to 25 DEG C, and filtered to obtain the product. The wash-free soldering flux does not contain a halide active agent, has strong ability to remove metal oxides, has low spatter value and is basically non-corrosive to the device, and has good soldering quality. It has a very high surface insulation resistance, is wash-free after welding, saves equipment and solvents, and is environmentally friendly.

Description

technical field [0001] The invention belongs to the technical field of welding materials, and in particular relates to a no-cleaning flux. Background technique [0002] Welding is the main process in electronic assembly. Flux is an auxiliary material used in welding. The main function of flux is to remove the oxides on the surface of the solder and the base material to be welded, so that the metal surface can reach the necessary cleanliness. It prevents re-oxidation of the surface during soldering, reduces the surface tension of the solder, and improves soldering performance. The quality of flux performance directly affects the quality of electronic products. In recent decades, in the soldering process of electronic products, rosin resin flux mainly composed of rosin, resin, halide-containing active agent, additive and organic solvent is generally used. Although this type of flux has good solderability and low cost, it has high residues after soldering. The residues contai...

Claims

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Application Information

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IPC IPC(8): B23K35/363
CPCB23K35/3613B23K35/362
Inventor 荚爱明丁永贵汪亮亮左洪流
Owner 五河县俊宝钢结构有限公司
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