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Preparation method of modified polytetrafluoroethylene copper clad plate

A technology of polytetrafluoroethylene and copper clad laminates, which is applied in chemical instruments and methods, textiles and papermaking, lamination auxiliary operations, etc., can solve the problems of small surface insulation resistance, low peel strength, high loss factor, etc., and achieve improved surface insulation The effect of small dispersion of resistance and dielectric constant and reduction of mass loss factor

Inactive Publication Date: 2011-09-07
禹胜林
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] However, the copper clad laminates in the prior art have high dielectric loss factor, small surface insulation resistance, low bending strength, and low peel strength.

Method used

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  • Preparation method of modified polytetrafluoroethylene copper clad plate

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Embodiment 1

[0018] A method for preparing a modified polytetrafluoroethylene copper-clad laminate, comprising pretreatment of glass fiber cloth, impregnation of glass fiber cloth, and copper-clad aluminum-coating of medium cloth. Polytetrafluoroethylene dispersion modified by oxygen concentrated dispersion; the mass ratio of perfluoroalkoxy concentrated dispersion to polytetrafluoroethylene in the impregnating liquid is 1:4. A small amount of additive nonylphenol polyoxyethylene ether is added to the dipping liquid.

[0019] Each material performance index described in the present invention is as follows:

[0020] Polytetrafluoroethylene concentrated dispersion: FR301G, solid content 60%, resin melting point 327 ℃, Shanghai Sanaifu Co., Ltd.;

[0021] Concentrated perfluoroalkoxy dispersion: FR503, solid content 30%, resin melting point 302°C, Shanghai Sanaifu Co., Ltd.

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Abstract

The invention discloses a preparation method of a modified polytetrafluoroethylene copper clad plate, which comprises the following steps: pretreating glass fiber cloth, impregnating the glass fiber cloth, cladding copper and aluminum on the medium cloth, wherein the impregnation liquid for impregnating the glass fiber cloth is a perfluoro-alkoxy concentrated dispersion liquid modified polytetrafluoroethylene dispersion liquid. The copper clad plate using the medium cloth impregnated in the impregnation liquid has lower dielectric loss factor, higher surface insulation resistance, higher bending strength and higher peel strength.

Description

technical field [0001] The invention relates to a preparation method for copper-clad laminates, in particular to a preparation method for polytetrafluoroethylene copper-clad laminates. Background technique [0002] Printed circuit boards are widely used in computer, communication, instrumentation, military industry, automobile, scientific equipment and other fields to provide identification and graphics for component insertion, welding, inspection and maintenance. The substrate of the printed circuit board is also called a copper clad laminate. With the gradual development of high-speed and high-frequency communication and electronic products, the market demand for high-frequency high-performance PTFE copper-clad laminates is also growing rapidly. [0003] PTFE copper-clad laminate is made of glass fiber cloth through a series of treatments to obtain dielectric cloth, and then the dielectric cloth and copper foil are combined. Therefore, the preparation of glass fiber cloth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B38/08D06M15/256
Inventor 禹胜林沈海平马立萍
Owner 禹胜林
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