148results about How to "Improve joint force" patented technology

Disclosed herein is a stacking or stacking/folding type electrode assembly of a cathode/separator/anode structure, wherein the electrode assembly is constructed in a structure in which tabs (electrode tabs), having no active material applied thereto, protrude from electrode plates constituting the electrode assembly, the electrode tabs are electrically connected to an electrode lead, and the pluralities of electrode tabs are joined to the top and the bottom of the electrode lead at an electrode lead-electrode tabs joint portion such that the resistance difference between electrodes at the electrode lead-electrode tabs joint portion is minimized. Also disclosed is an electrochemical cell including the electrode assembly.

In a photoelectric device-part, a bonding pad is formed without increasing a plane area of a concave part for housing a photoelectric device to implement miniaturization and improvement of the light usability efficiency. A light reflecting surface 3 of nearly a parabola configuration or the like provided for light emission and reception by a photoelectric device 5 is formed on a slanting curved surface constituting a concave part 2 of a circuit substrate 1. A convex portion 9a projecting from the light reflecting surface 3 and a receding concave portion 9b are formed in the middle of the concave part 2. A stage 9 is formed by an upper and bottom surfaces of the convex and concave portions 9a and 9b, respectively. A bonding pad 7 for connecting circuits of the photoelectric device 5 is formed at the stage 9. Since a space for the bonding pad 7 is provided by both concave and convex portions, deformation of the light reflecting surface 3 caused by the receding concave portion 9b and a ratio of intrusion to the bottom surface of the concave part by the projecting convex portion 9a can be both minimized. As a result, the photoelectric device 5 can be mounted without largely lowering light emission efficiency or without decentering the light emitting and receiving center, whereby a photoelectric device-part 10 can be miniaturized.

The invention is a counterblow door lock structure which is opposite direction motion between door and doorframe. Door lock connecting structure, the one end of the convex area which is perpendicular to the cardinal plate of the door board is the cylinder stick, the stick whose spherical equivalent diameter is bigger than cylinder diametric is a knuckling stick, and other door board is installed movable block ball mechanism. A ball cavity whose middle is hollow space is perpendicular to the base of the flat-plate, the interior diameter of the ball cavity is bigger than that of the knuckling stick, a limit ball control mechanism whose caliber size is changeable is installed at the mouth of the ball cavity. The limit ball control mechanism is: at least two round holes are radial at the wall part of the ball cavity, ball bearing is placed in the round hole, a slipper block which can move along the axial cord of the ball cavity around the ball cavity and the inner wall has vary in size step hole is configured at the base of the ball cavity, the technical project achieves that the little electromagnetic force transforms to the large door leaves engaging force; after the door leaves closed, the door leaves is permitting opened through the method of the electromagnetic control etc; and its operations is smooth, steady and convenience.

A semiconductor package includes a semiconductor die having a plurality of bond pads, a first protective layer formed at the periphery of the bond pads of the semiconductor die, UBM (Under Bump Metals) formed at the bond pads of the semiconductor die, a plurality of solder balls wetted to the UBM, and a second protective layer formed at the periphery of the solder balls. The second protective layer includes a thick collar, which is formed from the surface of the solder ball toward its periphery, so that the joint force of the solder ball can be more improved. Further, the second protective layer protects the surface of the wafer from the external environment, and absorbs and alleviates the external stress.

A clutch having high engaging force and featuring of smooth operation, wherein clutch weights that are biased by return elements are subject to thrusting force caused by constraint sections of a main driving plate that receive and convert torque from an engine into the pressing action against engaging slots defined in the clutch weights so as to gain enhanced engaging force even when the minor difference or error existing on the response time of the clutch weight or the strength of the return elements and also provides anti-reversal function to reduced the oscillation and let the power output more smooth and more stable. Accordingly, slippage of clutch and wear of the clutch wear pad are both reduced and temperature rise of the wear pad is also reduced.

The gasket material that is manufactured from a joint seat which includes three layers, that is, a front surface layer (1a), a back surface layer (1b) and the middle layer (1c), and these layers have different composition of reinforced fiber and filler respectively, and this joint seat is made from an ingredient made by mixing and kneading rubber, reinforced fiber and filler, then pressurized laminating and vulcanizing the ingredient, this joint seat is characterized in that the reinforced fiber is as a sort of fibril which is composed from one or both of organic fiber and non-asbestos type inorganic fiber, and at least a part of the filler is spicular inorganic fiber and its composition is 10 wt %-45 wt %. According to this joint seat (1), a crack breakage of the gasket that the ingredient material is the joint seat (1) due to fretting is prevented.

A method of manufacturing a semiconductor device capable of obtaining high joining force between a heat spreader and resin is provided. The method of manufacturing a semiconductor device according to the present invention includes: setting a heat spreader 60 on a face formed a plurality of apertures 22 in a cavity 21 of a first molding die 14; filling resin 20 into the cavity; setting a substrate 54 mounted with a semiconductor chip 50 a second molding die 12; and pressure-welding the first molding die 14 and the second molding die 12 so that the semiconductor chip is embedded in the resin 20, wherein a plurality of concave portion is formed on one face of the heat spreader 60, a plurality of convex portions is formed on the other face of the heat spreader 60, and the plurality of concave portions and the plurality of convex portions are overlapped in plan view.

The invention relates to a mold fabrication method by dividing at least one patterned notch on several thin plates, laminating machining on each cut plate, stacking them into the mold, with the notches formed into the mold cavity, cooling system and ejection system. It can greatly reduce the manufacturing cost and time of mold, getting rid of the extra size of the mold, shrinking it to achieve the goal of light mold.

A high pressure discharge lamp includes a vessel made mainly of quartz including a luminous portion and side tube portions extending from both sides of the luminous portion; mercury enclosed in the luminous portion; a metal foil buried in each of the side tube portion; and an electrode rod, one end of which is connected to the metal foil and the other of which is extending to the luminous portion. The electrode rod has a surface area increase structure for increasing a surface area in at least a part of a portion buried in the side tube portion. A sealing portion glass containing at least one metal material selected from the group consisting of metals and metal oxides thereof is provided in a portion of the side tube portion including at least a part of the metal foil, a connection portion between the metal foil and the electrode rod and a part of the surface area increase structure.

An absorbent composite sheet is thin and has a surface to be easily situated in dry condition. The absorbent composite sheet includes at least a first layer and a second layer. The first layer placed on the side of receiving a liquid is a non-woven fabric fabricated from thermoplastic synthetic resin fibers. The second layer stacked below the first layer is a non-woven fabric fabricated by entangling cellulose type fibers and thermoplastic synthetic resin fibers. The first layer and the second layer are joined by fuse bonding synthetic resin fibers of the first layer and synthetic resin fibers of the second layer. The liquid applied on a surface of the first layer is transferred to the second layer through gaps between synthetic resin fibers of the first layer.

Joint section is provided in a connection between a journal section and one of two arms supporting a crankpin and between the crankpin and the other of the arms. In each of the joint sections, a plurality of bolts are arranged along an imaginary circle substantially concentric to the axis of the journal section or crankpin, for fastening together the components. Radius of at least one of the journal section and crankpin is greater than a distance between axis lines of the journal section and crankpin. Blanks of shaft components are worked to provide thereon positioning sections, and the components are provisionally attached together to provide a crankshaft blank. The crankshaft blank is worked and then diassembled to attach thereto float bearings and a connecting rod integrally having a big end. Then, the crankshaft is re-assembled to make a crankshaft assembly.

Device for preparing a beverage from a beverage ingredient contained in a receptacle (17) by driving the receptacle in centrifugation comprising:-a holding part (16) arranged for holding the receptacle in a position enabling it to be driven in rotation along a longitudinal axis of rotation (I),-a liquid interfacing part (8) arranged for supplying water in the receptacle and/or extracting the beverage from the receptacle,-a collecting part (44) for collecting the beverage obtained by the interaction between the ingredient and water in the receptacle, wherein the holding part and liquid interfacing part (8, 16) are connected together by connection means in such a manner that these parts (8, 16) rotate together with the receptacle during centrifugation, wherein the connection means comprise at least a first engaging surface (48; 86) of the holding part (16) and a second engaging surface (23; 87) of the liquid interfacing part (8) engaged in contact together during connection in a manner preventing the holding part (16) and the liquid interfacing part (8) from moving away from each other, at least in the axial direction of rotation (I), and the connection means further comprising at least one mass of inertia (20, 21, 31; 80) arranged to be moveably connected to at least one of the parts (8, 16) with at least one degree of freedom in a least one radial direction for enabling the engagement forces to increase between the two engaging surfaces as a result of the increase of the centrifugal forces.

The invention discloses a multi-chip stacking method for halving routing procedure, comprising the following steps: firstly, providing a support plate having two or more finger joints and arranging at least one first chip on the support plate; then, routing to form two or more bonding wires to connect a first electrode of the first chip to the finger joints; arranging at least one second chip on the first chip face to face, and meanwhile, joining the second electrode of the second chip to one end of the bonding wires on the first electrodes, so that the second chip is electrically connected to the support plate through the bonding wires. The invention also discloses a multi-chip stacking structure for halving routing procedure. Therefore, the invention can shorten the procedure period and save cost, ensures that the bonding wires are located at the routing end on the chip and connected to the first electrode, and avoids line disconnection and line breasting.

Electroluminescent display device and manufacturing method thereof. To prevent exfoliation and rupture of a desiccant layer of an organic EL panel and improve the reliability to the temperature cycle. Using a plurality of resist patterns (101a) arranged in lattice shape as a mask, a sealing glass substrate (100) is etched with hydrofluoric acid, and a pocket part (103) is formed. An unevenness (104) is formed on the surface of the sealing glass substrate (100) on the bottom of the pocket part (103). Then, a desiccant layer (105) is formed. By this coarse surface making treatment, an anchor effect is demonstrated and adhesion of the desiccant layer to the sealing glass substrate is increased, and exfoliation or the like can be prevented.

The present invention belongs to the technical field of Velcro, and provides a Velcro, a Velcro work-piece and preparation methods of the Velcro and the Velcro work-piece. The Velcro comprises a hook surface and a back surface, wherein the back surface comprises a base material layer and a first adhesive layer, the base material layer comprises a roughened surface arranged opposite to the hook surface, and the first adhesive layer is adhered and connected to the roughened surface. The Velcro work-piece comprises a carrier and the Velcro, wherein the Velcro is adhered and connected to the carrier through the first adhesive layer, and the partial or all back surface of the Velcro is embedded into the carrier.

The invention relates to a pad structure and a manufacturing method thereof. The pad structure comprises an isolation material layer, a metallic pad situated above the isolation material layer, a top metallic layer embedded in the isolation material layer and connected with the metallic pad through a metallic connecting line, and a nail pad situated under the metallic pad, tightly connected with the metallic pad and embedded in the isolation material layer while being spaced apart from the top metallic layer. The invention solves the problems in the prior art and provides a new pad structure. The nail pad is situated under the metallic pad, and the nail pad is integrated into one body with the metallic pad and embedded tightly in a passivation layer under the metallic pad. The bonding force of the metallic pad is thus increased to prevent falling off of the metallic pad.

A receptacle connector that improves strength against wire (W) stretching and enables flattening of the connection structure. It includes: a socket housing (110), with a wire insertion groove (115) recessed from the back side (111), and a support recess (116) that communicates with the wire insertion groove (115) and opens on the back side (111); The socket contact (120) that enters the wire insertion groove (115); the contact part (121) that contacts the contact (220) in the support recess (116); the insulating barrel (122) and the notch for crimping (123 ), press the electric wire (W) in the insertion groove (115) and crimp it on the cut groove (123), press the sheath of the electric wire (W) with the insulating tube (122), and the installation object (P) When the plug connector (200) is butted, the wire insertion groove (115) of the socket housing (110) is blocked by the installation object (P).