Method for manufacturing mould and its structure

A mold manufacturing and mold technology, applied in the field of laminated mold manufacturing method and its structure, can solve the problems of time-consuming and money-consuming, complicated process, mold volume and weight cannot be reduced or reduced, etc., and achieve void elimination and volume reduction. , The effect of reducing production cost and time

Inactive Publication Date: 2007-10-31
林承洋
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0004] In addition, existing molds must go through drilling and other processes. Therefore, the material and volume of the mold need to consider the structural strength and reserved space that each drilling process can withstand. Therefore, traditional molds are factors that are considered regardless of volume or material. One, the volume and weight of the mold cannot be reduced or reduced; moreover, the cooling step is performed after the mold is filled, and the model must be ejected with the help of the ejection system after cooling, so the mold must also have an ejection system in design , plus the original mold cavity in the mold, so the process of mold manufacturing is very complicated, and the above-mentioned mold cavity, cooling system and ejection system process are mostly carried out in stages using the current technology, so It also takes a lot of time and money to

Method used

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  • Method for manufacturing mould and its structure
  • Method for manufacturing mould and its structure
  • Method for manufacturing mould and its structure

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Embodiment Construction

[0025] The mold manufacturing method of the present invention is different from the existing mechanical drilling method, and the mold manufacturing time, precision and cost are greatly improved. The mold structure and manufacturing process are explained below.

[0026] First introduce the structure of the present invention, with reference to shown in Fig. 1 and Fig. 2, this mold structure 10 is formed by stacking a plurality of thin plates 12, and the material of this thin plate 12 is metal material, and thin plate 12 also can be heat-resistant material in addition, This mold structure 10 comprises lower mold 14 and upper mold 16, and this lower mold 14 is provided with a filling hole 18, and is provided with a mold cavity 20 between lower mold 14 and upper mold 16, and filling hole 18 can be connected with this. The mold cavity 20 is connected, and the pouring hole 18 can be poured into and flow into the mold cavity 20 by molten molding liquid; in addition, a cooling system an...

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Abstract

The invention relates to a mold fabrication method by dividing at least one patterned notch on several thin plates, laminating machining on each cut plate, stacking them into the mold, with the notches formed into the mold cavity, cooling system and ejection system. It can greatly reduce the manufacturing cost and time of mold, getting rid of the extra size of the mold, shrinking it to achieve the goal of light mold.

Description

technical field [0001] The invention relates to a mold structure, in particular to a fast-manufacturing, high-precision and low-cost laminated mold manufacturing method and its structure. Background technique [0002] In response to the advent of the meager profit era, all walks of life are pursuing the reduction of their own costs, and the most effective way for the manufacturing industry is to reduce costs through mass production, and the first condition for mass production is to provide molds for casting this product. Mass production is carried out by pouring molding, but today's product categories must be constantly updated, especially consumer electronics products, so the cost and efficiency of mold manufacturing are steps that cannot be ignored. [0003] A mold is a special tool that can be injected into a molten molding liquid to form a predetermined shape and construct an object. Common molding liquids such as: plastic solution, metal solution, etc., pour high-temper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/24B23K28/02B23K26/00B29C33/38B29C33/00B22C9/00
Inventor 林承洋
Owner 林承洋
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