The invention relates to a device and a method for nanoimprinting of a full wafer, comprising a working platform, a full wafer coated with an etchant resist, a nozzle for demoulding, a template, an imprinting head, a pressure pipeline, a vacuum pipeline and an ultraviolet light source, wherein the template is fixed on the bottom surface of the imprinting head; the side surface on the lower part of the template is equipped with the nozzle for demoulding; the pressure pipeline and the vacuum pipeline are connected to air inlet holes which are arranged on two side surfaces of the working platform of the imprinting head; the full wafer coated with the etchant resist is fixed on a wafer working platform; and the ultraviolet light source is arranged over the imprinting head. The method providedby the invention comprises the following steps of: 1) pre-treating process; 2) imprinting process; 3) curing process; and 4) demoulding process. The device and the method for nanoimprinting of the full wafer provided by the invention have the characteristics that the structure is simple, the cost is low, the production efficiency is high, the accuracy is high, the imprinting area is large, and the suitability for the batch production and the imprinting of the full uneven wafer can be obtained. The device and the method can be applied to the large-scale manufacturing of high-density disc, micro-optic device and micro-fluidic device and the like, and the device and the method are particularly suitable for the imaging of the full wafer of a photonic crystal LED (Light Emitting Diode).