Disclosed herein are a
printed circuit board with embedded capacitors therein and a process for manufacturing the
printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a
printed circuit board inner layer, and applying a high
dielectric polymer capacitor paste thereto. The process for manufacturing a printed circuit board with embedded capacitors therein comprises the steps of: i) laminating
photoresist dry films to a
copper clad FR-4, exposing to light and developing the dry films, and
etching copper foils of the
copper clad FR-4 to form bottom electrodes for forming capacitors; ii) applying a photosensitive insulating resin to the surfaces of the bottom electrodes, and exposing to light and developing to etch the photosensitive insulating resin; iii) applying a
capacitor paste to the etched regions and curing the
capacitor paste; iv) plating the upper regions of the cured capacitor paste and the photosensitive insulating resin using an electroless
copper plating process to form
copper foil layers for top electrodes; v) laminating photosensitive dry films to the
copper foil layers for top electrodes, and exposing to light and developing the photosensitive dry films to etch regions of the dry films except for the
copper foil layers where the top electrodes are to be formed; and vi)
etching the regions of the dry films except for the copper foil layers where the top electrodes are to be formed, and the dry films formed on the top electrodes are removed so that the capacitor paste is discretely positioned between the top electrodes and the bottom electrodes to form discrete capacitors.