143results about How to "Reduce local deformation" patented technology

A cooling plate comprises a passage 6 for flowing a coolant by closing a groove 5 formed on a main body 2 with a lid 3. The lid 3 has a width greater than that of the groove 5 and has a convex portion 4 at least on one surface. The cooling plate can be used as a backing plate with little local deformation and long operation lifetime.

An apparatus including a coil used for generating a thrust to move a movable portion, and a coil support portion which supports the coil. The coil support portion constrains the coil in a direction of the thrust, and slidably supports the coil in a direction perpendicular to the direction of the thrust.

The disc-shaped lower cutting blade and the disc-shaped upper cutting blade having a sharper corner than that of the lower cutting blade are arranged such that their rotational axes are parallel to each other, and a part of these blades overlap each other along the direction in which the rotational axis extends. As the upper and lower cutting blades are rotated, the coating flakes with the coating layer on one side are fed through between the upper and lower cutting blades in a direction perpendicular to these axes of rotation so that they are positioned opposite the coating layer. The coated flake surface on one side remains in circumferential contact with the lower cutting blade. When the coated flake is sheared, the contact start position where the contact between the coated flake and the upper cutting blade starts is set upstream in the feeding direction of the coated flake but at the position where the coated flake is in circumferential contact with the lower cutting blade outside of the contact area.

The invention discloses a self-adaptive circular tubular thin-wall part clamping jaw. The self-adaptive circular tubular thin-wall part clamping jaw comprises a driving motor and a guide cylinder, wherein the guide cylinder is provided with a transmission screw rod, the transmission screw rod is connected with a transmission nut, and an oval through hole is formed in the transmission nut; a clamping device is arranged on a guide groove and comprises a sliding seat, an outer claw, an inner claw, an input lever, a transmission part, an outer sliding block and an inner sliding block; the slidingseat is slidably connected to the guide groove, a rectangular through hole is formed in the sliding seat, and the outer end of the outer sliding block is elastically connected to the outer end of thesliding seat; one end of the input lever is rotationally connected to the sliding seat, the input lever is hinged to the outer sliding block, and the input lever is hinged to the transmission nut through the oval through hole; and the transmission part is rotationally connected to the sliding seat, one end of the transmission part is hinged to the other end of the input lever, and the other end ofthe transmission part is hinged to the bottom of the inner sliding block. The self-adaptive circular tubular thin-wall part clamping jaw can self-adapt to clamping of thin-walled parts with differentpipe diameters, the mode of inner-outer opposite clamping is adopted, and the possibility of deformation of the thin-walled parts is greatly reduced.

The invention relates to a device and a method for nanoimprinting of a full wafer, comprising a working platform, a full wafer coated with an etchant resist, a nozzle for demoulding, a template, an imprinting head, a pressure pipeline, a vacuum pipeline and an ultraviolet light source, wherein the template is fixed on the bottom surface of the imprinting head; the side surface on the lower part of the template is equipped with the nozzle for demoulding; the pressure pipeline and the vacuum pipeline are connected to air inlet holes which are arranged on two side surfaces of the working platform of the imprinting head; the full wafer coated with the etchant resist is fixed on a wafer working platform; and the ultraviolet light source is arranged over the imprinting head. The method providedby the invention comprises the following steps of: 1) pre-treating process; 2) imprinting process; 3) curing process; and 4) demoulding process. The device and the method for nanoimprinting of the full wafer provided by the invention have the characteristics that the structure is simple, the cost is low, the production efficiency is high, the accuracy is high, the imprinting area is large, and the suitability for the batch production and the imprinting of the full uneven wafer can be obtained. The device and the method can be applied to the large-scale manufacturing of high-density disc, micro-optic device and micro-fluidic device and the like, and the device and the method are particularly suitable for the imaging of the full wafer of a photonic crystal LED (Light Emitting Diode).