The invention provides a method for photocuring 3D printing of a high-temperature-resistant mold, and the method comprises the following steps: synthesizing high-temperature-resistant photocuring 3D printing resin which comprises the following components in percentage by weight: 50-80% of ethoxylated
bisphenol A diacrylate, 15-35% of ethoxylated
trimethylolpropane triacrylate, 5-10% of 2, 4, 6-trimethyl-1, 3-pentanediol monoisobutyrate, 5-10% of 2, 4, 6-trimethyl-1, 3-pentanediol monoisobutyrate, 5-10% of 2, 4, 6-trimethyl-1, 3-pentanediol monoisobutyrate, 5 the component A comprises the following components in percentage by weight: 3-10% of 2, 3, 6-trimethylbenzoyl-diphenyl
phosphine oxide, 1-5% of filler and 0-2% of auxiliaries; a mold model is constructed through three-
dimensional modeling software, and the mold model structurally comprises a conformal cooling water pipeline;
slicing processing is conducted on the mold modeling model through
slicing software, printing parameters are set, and a
slicing file is generated; and the generated slice file is guided into photocuring 3D printing equipment, the high-temperature-resistant photocuring 3D printing resin serves as a 3D printing material, and a high-temperature-resistant mold is formed through the photocuring 3D printing technology. According to the method for photocuring 3D printing of the high-temperature-resistant mold, the high-
temperature resistance and the compression resistance of the photocuring 3D printing molding high-temperature-resistant mold can be effectively improved.