Circuit board and manufacturing method thereof

Abstract

The invention provides a manufacturing method of a circuit board, which comprises the following steps of: 1) providing a core board which is provided with a first surface and a second surface which are opposite to each other; 2) forming positioning holes in the core plate; (3) positioning is carried out through the positioning holes, performing laser drilling on the core plate, machining a plurality of first blind holes in the first face, and distributing and drilling the drilling lines of the first blind holes according to a spiral path from outside to inside when the first face is drilled; and (4) turning over the core plate, performing positioning through the positioning holes, machining a plurality of second blind holes in the second face, and when the second blind holes are drilled inthe second face, drilling lines correspondingly drill holes according to a spiral path from outside to inside, so that the first blind holes drilled in the first face and the second blind holes drilled in the corresponding second face are coaxially communicated. The paths for drilling the blind holes in the two surfaces of the core plate are the spiral lines from outside to inside, so that the core plate is deformed into uniform shrinkage, deformation caused by local overheating of the core plate is avoided, and the communication accuracy of each first blind hole and the corresponding secondblind hole is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing circuit board drilling holes. Background technique [0002] With the development trend of light, thin and small electronic products, the demand for multilayer circuit board products is gradually increasing. However, the poor reliability of laser blind holes in the core board and the difficulty in filling and leveling the through holes in the core board, and other technical bottlenecks have become important reasons that limit its development. Therefore, the "X-shaped hole" (laser drilling on both sides of the same hole to form a through hole with some protrusions in the hole) has gradually entered everyone's field of vision, but the problem of misalignment of the laser holes on both sides of the same hole position has become a problem for everyone. problem. [0003] Excluding the deviation of about 10 μm caused by the accuracy of th...

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Problems solved by technology

[0004] The invention provides a circuit board and its manufacturing method which improves the problem of local deformation of the core board, improves the coincidence degree of the holes on both sides, and has high drilling quality.

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