A kind of circuit board and its manufacturing method

Abstract

The invention provides a method for manufacturing a circuit board, comprising the following steps: 1) providing a core board, the core board is provided with opposite first and second surfaces; 2) opening positioning holes on the core board; 3) Using the positioning holes for positioning, performing laser drilling on the core plate, processing a number of first blind holes on the first surface, and drilling some of the first blind holes when drilling on the first surface The circuit is drilled according to the spiral path layout from outside to inside; 4) Turn over the core board, use the positioning holes for positioning, and process a number of second blind holes on the second surface, and the second blind holes are in the When the second surface is drilled, the drilling line is drilled correspondingly according to the spiral path from the outside to the inside, so that the first blind hole drilled on the first surface is coaxial with the corresponding second blind hole drilled on the second surface line connected. In the present invention, the path of drilling several blind holes on the two surfaces of the core board is adopted as a spiral line from outside to inside, so that the core board is deformed into a uniform shrinkage, thereby avoiding local overheating and deformation of the core board, and improving the quality of each first blind hole. Communicate precision with the corresponding second blind hole.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing circuit board drilling holes. Background technique [0002] With the development trend of light, thin and small electronic products, the demand for multilayer circuit board products is gradually increasing. However, the poor reliability of laser blind holes in the core board and the difficulty in filling and leveling the through holes in the core board, and other technical bottlenecks have become important reasons that limit its development. Therefore, the "X-shaped hole" (laser drilling on both sides of the same hole to form a through hole with some protrusions in the hole) has gradually entered everyone's field of vision, but the problem of misalignment of the laser holes on both sides of the same hole position has become a problem for everyone. problem. [0003] Excluding the deviation of about 10 μm caused by the accuracy of th...

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Problems solved by technology

[0004] The invention provides a circuit board and its manufacturing method which improves the problem of local deformation of the core board, improves the coincidence degree of the holes on both sides, and has high drilling quality.

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