Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cooling plate

A cooling plate and cooling medium technology, applied in ion implantation plating, lighting and heating equipment, coating, etc., can solve the problems of distance change, backplane strength weakening, bending, etc., and achieve less local deformation and longer replacement life long effect

Inactive Publication Date: 2006-12-20
SH COPPER PROD CO LTD
View PDF2 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] However, conventional backplanes are subjected to mechanical stress and thermal stress each time as described above during the bonding work, so that the strength of the backplane becomes weak, warps, or Problems such as expansion of the cover part which is structurally weaker than the main body
[0016] In addition, such deformation of the back plate may cause a change in the distance between the target and the film-forming substrate, or a change in the heat transfer (cooling) efficiency due to partial peeling of the target material, resulting in a decrease in the quality and yield of the formed thin film. Lower etc.
[0017] When deformation occurs, it is necessary to replace the backplane itself, but when the replacement life is short, the number of replacement operations increases and becomes a major cause of cost increase

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cooling plate
  • Cooling plate
  • Cooling plate

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0034] The structure of the backplane is as follows.

[0035] figure 1 and figure 2 A perspective view and a partial sectional view (along the figure 1 in the A-B line part). image 3 A side view showing a cover constituting the back plate of the first embodiment of the present invention. refer to Figures 1 to 3 , the configuration of the backplane of the first embodiment will be described below.

[0036] The backplane 1 has a main body 2 and a cover 3, and the main body 2 has a width W opened on one side. 2 slot 5. The cover 3 has a width W at its inner side, that is, one side of the groove 5. 1 The convex part (flange) 4. The convex portion 4 is provided continuously along the entire length of the cover 3 (in the length direction) at an approximately central portion thereof. From the standpoint of strength, it is desirable that the width W of the convex portion 4 1 than the width of slot 5 W 2 Small, at W 2 / 4 or more. preferably at W 2 / 3 or more, more pre...

no. 2 example

[0052] Figure 7 is a partial cross-sectional view of a back plate showing a second embodiment of the present invention. Figure 7 The difference between the shown backplane 31 and the backplane 1 of the first embodiment is only that the width W of the protrusion 34 of the cover 33 1 Made with the width W of the groove 35 of the body 32 2 Basically the same build. In this way, the cooling plate 7 of the second embodiment has the strength to withstand higher stress. The description of applicable modification examples and the like is omitted since they are the same as those of the first embodiment.

[0053] The strength against deformation and the moment of inertia of the section under stress (mm 4 ) proportional to. For example, in the second embodiment also applicable Image 6 , let the thickness of the cover (t 1 ) is 3mm, set the cross-section of the water channel as height 5mm×width 100mm, and set the height (thickness t 2 ) 2.5mm x width (runner width direction) 10...

no. 3 example

[0055] Figure 8 is a partial cross-sectional view of a back plate showing a third embodiment of the present invention. Figure 8 The difference between the shown backboard 41 and the backboard 1 of the first embodiment is only that the outer surface of the cover 43 protrudes from the surface on the same side as the above-mentioned outer surface of the body 42, and the cover 43 is connected to the body 42. combined. The description of applicable modification examples and the like is omitted since they are the same as those of the first embodiment.

[0056] This embodiment is not limited to the method of providing the convex part of the back plate on the outside of the cover in the first embodiment and the second embodiment, but also includes the method of making the width of the convex part wider than the width of the groove, or only The method of thickening the thickness of the cover ( Figure 8 ).

[0057] Figure 8 In the shown backplane 41, there is a width W 1 The c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A cooling plate comprises a passage 6 for flowing a coolant by closing a groove 5 formed on a main body 2 with a lid 3. The lid 3 has a width greater than that of the groove 5 and has a convex portion 4 at least on one surface. The cooling plate can be used as a backing plate with little local deformation and long operation lifetime.

Description

technical field [0001] The present invention relates to a cooling plate, in particular to a cooling plate having a flow channel for a cooling medium formed by a groove and a cover. Background technique [0002] Cooling plates are widely used in industry, for example, in sputtering devices. Sputtering devices are widely used in the manufacturing process of various electronic components such as semiconductor elements, various sensors, magnetic recording media, optical recording media, and flat panel displays. In this case, the bottom plate (back plate) on which the target material to be sputtered is attached not only functions as a back plate for the target material but also functions as a cooling plate. [0003] The cooling plate needs to have efficient cooling capacity. For example, in the above-mentioned sputtering apparatus, since the heat generated from the target material due to sputtering is effectively dissipated, the performance (quality) of the thin film formed on ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/00C23C14/34
CPCC23C14/3407
Inventor 酒寄一志井坂功一小田仓正美野村克己
Owner SH COPPER PROD CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com