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High heat conductivity and insulation plastic as well as preparation method and application thereof

An insulating plastic, high thermal conductivity technology, applied in the field of materials, can solve problems such as low thermal conductivity and limited application fields

Active Publication Date: 2017-06-13
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional thermally conductive and insulating plastics have the disadvantage of low thermal conductivity (about 0.14-0.34W / m·K), which greatly limits their application fields.

Method used

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  • High heat conductivity and insulation plastic as well as preparation method and application thereof
  • High heat conductivity and insulation plastic as well as preparation method and application thereof
  • High heat conductivity and insulation plastic as well as preparation method and application thereof

Examples

Experimental program
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preparation example Construction

[0129] The present invention also provides a preparation method of the high thermal conductivity insulating plastic, comprising the following steps:

[0130] a-1) Provide thermoplastic resin and composite thermally conductive filler;

[0131] a-2) mixing the thermoplastic resin and composite thermally conductive filler, and granulating to obtain the high thermally conductive insulating plastic.

[0132] In another preferred example, the thermoplastic resin and the composite thermally conductive filler are as described in the first aspect of the present invention.

[0133] In the present invention, the thermally conductive filler, thermoplastic resin, flame retardant, toughener and antioxidant are not particularly limited, and can be prepared by conventional methods or purchased from the market.

[0134] In another preferred example, the composite thermally conductive filler is prepared as follows:

[0135] b-1) providing the first mixture, the second mixed liquid and the coa...

Embodiment 1

[0185] Embodiment 1 High thermal conductivity insulating plastic 1 (graphene content is 0wt%)

[0186] Dissolve 12.5g of coupling agent KH550 evenly in 80ml of a mixed solvent of absolute ethanol and water (the mixing ratio of absolute ethanol and water is 95:5), and then adjust the pH value of the solution system to 4 with acetic acid. Stir mechanically at a stirring speed of rpm for 20 min. At a stirring speed of 500 rpm, use a spray bottle to spray the resulting mixed solution into 2500 g of inorganic insulating heat-conducting filler MgO with a particle size of 50 μm to be stirred. After stirring continuously for 60 minutes, gradually increase the stirring speed to 2000 rpm , the friction between the materials makes the temperature of the materials rise. When the temperature rises to about 100°C, the coupling agent will react with the inorganic insulating heat-conducting filler MgO. After about 30 minutes of reaction, stop stirring, and wait for the temperature of the reac...

Embodiment 2

[0192] Embodiment 2 High thermal conductivity insulating plastic 2 (graphene content is 1wt%)

[0193] 2450g of inorganic insulating thermally conductive filler MgO with a particle size of 50 μm was uniformly mixed with 25000 ml of a slurry containing 50 g of graphene with a particle size of 20 μm, and dried to obtain a composite thermally conductive filler of graphene and MgO. Dissolve 12.5g of coupling agent KH550 evenly in 80ml of a mixed solvent of absolute ethanol and water (the mixing ratio of absolute ethanol and water is 95:5), and then adjust the pH value of the solution system to 4 with acetic acid. Stir mechanically at a stirring speed of rpm for 20 min. At a stirring speed of 500 rpm, use a spray bottle to spray the resulting mixed solution into the stirred composite heat-conducting filler. After continuous stirring for 60 minutes, gradually increase the stirring speed to 2000 rpm. The friction between the materials makes the temperature of the materials rise. Hig...

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Abstract

The invention relates to high heat conductivity and insulation plastic as well as a preparation method and application thereof. The invention specifically discloses the high heat conductivity and insulation plastic. The high heat conductivity and insulation plastic comprises thermoplastic plastic and a compound heat conductivity filler uniformly distributed in the thermoplastic plastic, wherein the compound heat conductivity filler is prepared from graphene and an inorganic insulation type heat conductivity filler. The invention further discloses the preparation method and the application of the high heat conductivity and insulation plastic. Under a condition of keeping the mechanical property and the insulation performance of the high heat conductivity and insulation plastic, by adding of the specific compound heat conductivity filler, the heat conductivity of the high heat conductivity and insulation plastic is obviously improved, and the obvious improvement has an important significance for extending the application field of heat conductivity plastic.

Description

technical field [0001] The invention relates to the field of materials, in particular to a high thermal conductivity insulating plastic and its preparation method and application. Background technique [0002] At present, thermally conductive plastics are increasingly replacing metal parts in various fields such as aerospace, electronic appliances, auto parts, and chemical production. Compared with traditional metal heat dissipation components, thermally conductive plastics have many advantages such as light weight, high degree of freedom in product design, convenient molding and processing, high production efficiency, uniform heat dissipation, avoiding hot spots, and effectively reducing local deformation of parts caused by high temperatures. . More importantly, due to the insulating properties of thermally conductive plastics, safety problems caused by electrical conduction can be avoided when used in electronic devices. However, conventional heat-conducting and insulati...

Claims

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Application Information

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IPC IPC(8): C08L77/02C08L51/06C08K13/06C08K9/06C08K9/10C08K3/04C08K3/22C08K5/3492C08K5/134C08K5/526C08K5/372
Inventor 颜春祝颖丹刘东陈明达徐海兵王贵民林新耀涂丽艳
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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