26 results about "Substrate deformation" patented technology

The invention relates to a gold stamping packaging box production method and system, and the method comprises the following steps: S1, carrying out the humidity adjustment and flatness correction of a packaging box blank raw material, and enabling the humidity and flatness of the raw material to reach preset threshold values; s2, a gold stamping target area of the blank is recognized, and three-dimensional coordinates of the gold stamping target area are obtained; s3, based on the raw material characteristics, the environmental parameters and the positioning data, gold stamping temperature, pressure and speed parameters are calculated through a machine learning model; s4, according to the three-dimensional coordinates and the gold stamping parameters, a gold stamping plate is controlled to be attached to the green body for hot stamping; s5, performing defect detection on the gold-stamped green body, and dividing qualified products and unqualified products according to a detection result; and S6, the qualified product is subjected to cutting, film covering, impurity removal and collection. The method has the beneficial effects that substrate deformation caused by non-uniform humidity of raw materials and poor flatness is eliminated, the three-dimensional space coordinates of the gold stamping target area can be accurately recognized, and the gold stamping temperature, pressure and speed can be dynamically optimized based on a machine learning model.

A system includes an electrostatic chuck. The electrostatic chuck includes a ceramic puck configured to support a substrate. The electrostatic chuck further includes a clamping electrode disposed within the ceramic puck and configured to electrostatically clamp the substrate to the ceramic puck responsive to being energized with a clamping voltage. The electrostatic chuck further includes one or more sensor electrodes disposed within the ceramic puck. The system further includes one or more electronic circuits coupled with the one or more sensor electrodes. The system further includes a processing device. The processing device is configured to receive, from the one or more electronic circuits, a signal indicative of substrate deformation. The processing device is further configured to adjust the clamping voltage based on the signal.

The present application relates to the technical field of precision measurement of geometric quantity, and discloses a kind of four-layer half-hole plate precision drilling trajectory measurement system, comprising: image acquisition module, deformation analysis unit and trajectory measurement module, image acquisition module gathers the random texture image of the surface of the drilling site and the dynamic projection profile of cutting tool;Deformation analysis unit identifies feature point displacement vector, to reconstruct non-uniform grid and convert substrate deformation into local coordinate offset of modified reference surface;Trajectory measurement module extracts gray gradient data to determine spindle deflection vector, and combines shadow shortening rate to identify depth zero position, the present application uses substrate local texture displacement and the inversion mechanism of rotating light shadow feature, eliminates the nonlinear residual caused by stress release, guarantees the spatial consistency of complex inner space motion trajectory measurement.

The invention discloses an additive and subtractive composite manufacturing online monitoring method, which comprises the following steps of: acquiring strain characteristics in an additive and subtractive process by utilizing a monitoring and feedback control system comprising a substrate, a strain gauge, a strain collector, a data processing computer, an additive and subtractive composite forming control system and a motion system; according to the method, real-time monitoring of substrate deformation in the additive and subtractive composite manufacturing process is achieved, whether process adjustment of additive and subtractive composite manufacturing needs to be carried out or not is judged by comparing strain signals with strain signal preset values in a process adjustment database, feedback control is achieved, the local large strain phenomenon in the additive and subtractive manufacturing process can be found in time, and the production efficiency is improved. The method has the advantages of preventing crack defects, monitoring the state of the cutter, optimizing the roughness and dimensional precision of the machined surface, solving the problem of part machining failure caused by hot cracks or low precision in additive and subtractive composite manufacturing, and having wide application prospects and remarkable technical advantages.

A system includes an electrostatic chuck. The electrostatic chuck includes a ceramic puck configured to support a substrate. The electrostatic chuck further includes a clamping electrode disposed within the ceramic puck and configured to electrostatically clamp the substrate to the ceramic puck responsive to being energized with a clamping voltage. The electrostatic chuck further includes one or more sensor electrodes disposed within the ceramic puck. The system further includes one or more electronic circuits coupled with the one or more sensor electrodes. The system further includes a processing device. The processing device is configured to receive, from the one or more electronic circuits, a signal indicative of substrate deformation. The processing device is further configured to adjust the clamping voltage based on the signal.

This application provides a fixing fixture and processing equipment, relating to the field of material processing, and solves the technical problem that rigid clamping methods can easily damage products during machining. The fixing fixture includes: a support component having at least one receiving space and a first opening connecting the receiving space to the outside, the first opening facing upwards; shape memory alloy particles disposed in the receiving space and extending from the first opening, so that the shape memory alloy particles support the product. The shape memory alloy particles can deform at the processing temperature to conform to the shape of the product after thermal expansion, thereby reducing the pressure of the shape memory alloy particles on the deformed product and lowering the risk of coating damage and substrate deformation.

Disclosed is a method of determining a substrate deformation metric relating to at least one substrate, the substrate deformation metric describing deformation across the at least one substrate. The method comprises obtaining alignment data relating to measurement of a plurality of structures on said substrate using a plurality of illumination conditions; and determining substrate deformation metric values for the substrate deformation metric which minimizes the number of basis vectors which are required to expand dispersion due to structure deformation of said plurality of structures.

An imprint apparatus including a mold deformation mechanism configured to deform a mold by applying a pressure to the mold, a substrate deformation mechanism configured to deform the substrate by applying a pressure to the substrate, a measurement unit configured to measure a deformation amount of the mold and a deformation amount of the substrate during separating the mold from the cured imprint material on the substrate, and a control unit configured to control, during the separating, a pressure to be applied to the mold by the mold deformation mechanism and a pressure to be applied to the substrate by the substrate deformation mechanism based on the deformation amounts measured by the measurement unit such that a difference between the deformation amount of the mold and the deformation amount of the substrate falls within an allowable range.

The present application relates to a kind of double-coated brake disc ultra-high speed laser cladding process method, comprising the following steps: according to brake disc surface area, the calculation formula of total energy output value of cladding efficiency, determine the total energy output value under the binding force qualified threshold;Set control factor, deduce the coupling formula of power, powder feed rate, efficiency and thickness;Using double-layer time-lapse cladding, establish radius time line speed kinematics model, accurately describe the second layer linear velocity variation law;Determine the compensation factor of second layer cladding, obtain the real-time compensation formula of power, powder feed rate changes with linear velocity in second layer cladding process.The present application is around the technical goal of high efficiency and high quality collaborative optimization, systematic design is carried out in process modeling, parameter coupling and dynamic control, on the premise of ensuring coating bond strength, forming quality and substrate deformation controllable, realize efficiency maximization, with stronger implementability and replicability, be conducive to standardization, large-scale development.

This invention discloses an intelligent defect detection system and self-healing method for RFID tags on flexible substrates, belonging to the field of IoT electronic device manufacturing technology. The system integrates a high-resolution image acquisition module, a multispectral sensor array, and a robotic arm motion platform to construct a three-dimensional dynamic scanning system, capturing the surface and internal structural features of the flexible substrate in real time. A deep learning-based defect recognition algorithm, combined with multi-scale convolutional neural networks and transfer learning techniques, achieves accurate classification of 12 types of defects, including microcracks, conductive layer fractures, and substrate deformation, with a detection accuracy of 99.2%. A dual-mode self-healing mechanism is proposed: for conductive layer defects, nano-silver conductive colloid is injected through microfluidic channels, and 3D structural reconstruction is achieved using a controllable temperature field; for substrate damage, a photoresponsive shape memory polymer patch is used, which achieves molecular-level bonding repair after activation by ultraviolet light. This solution improves detection efficiency by more than 5 times, and the RF performance of the tag recovers to 98.7% of its initial value after self-healing.

The invention relates to the technical field of optical coating production, in particular to an optical coating method for preventing deformation and warping of a substrate and an optical filter, and the method comprises the steps: decomposing a target spectrum of the optical filter into a first spectrum and a second spectrum; designing a first film layer according to the first spectrum, and designing a second film layer according to the second spectrum; a first film layer is deposited on the front face of the substrate, a second film layer is deposited on the back face of the substrate, and the stress applied to the substrate by the first film layer and the stress applied to the substrate by the second film layer are mutually counteracted. The super-multilayer film is decomposed into the first film layer and the second film layer, and the first film layer is deposited on the front surface of the substrate and the second film layer is deposited on the back surface of the substrate respectively, so that the possibility of substrate deformation caused by overlarge stress due to the fact that the super-multilayer film is completely deposited on the same surface of the substrate is reduced; and meanwhile, the stresses applied to the substrate by the first film layer and the second film layer are approximately equal, so that the substrate is kept flat after the first film layer and the second film layer are deposited on the front surface and the back surface of the substrate respectively.

This application provides a temperature control method, apparatus, electronic device, and storage medium for an etching stage. First, the real-time temperature of the etching stage and the real-time temperature control fluid are acquired. Then, based on the real-time temperature of the etching stage, the real-time temperature of the temperature control fluid, and a limiting temperature, a temperature control command is determined. Finally, a circulating temperature control fluid loop responds to the temperature control command, stabilizing the target operating temperature of the etching stage within a preset range. By increasing the feedback quantity of the real-time temperature of the etching stage, the response speed of temperature control is improved, and the temperature overshoot is reduced, resulting in a more regular temperature distribution on the substrate during etching. This solves the technical problem in existing technologies where uneven temperature distribution on the etching stage leads to substrate deformation and poor etching quality. The method achieves controllable and regular substrate deformation, ensuring the etching effect meets design expectations and improving etching quality.

The invention belongs to the technical field of contact interface analysis methods, and particularly relates to a double rough surface analysis method based on a parabola revolving body micro-convex body. The method comprises the following steps: on the basis of statistics and measured data of microstructure of a metal connection interface, representing geometrical morphology of a micro-convex body by using a parabola revolving body, establishing a double-rough-surface statistical contact model considering a side contact condition, and establishing a micro-convex body contact model considering a matrix deformation effect in elastic, elastic-plastic and complete-plastic stages; and determining the analytic expression of the macroscopic contact parameters through a statistical integration method. According to the method, the side contact hypothesis is adopted under the condition of considering the deformation of the substrate, the parabola revolution body is adopted as the micro-convex body shape based on the actual rough surface microstructure measurement, the actual condition is better met, and therefore the method has the advantage of being more accurate in the prediction of the contact characteristics.

The disclosed system and technique are intended to correct out-of-plane deformation (OPD) of a substrate. The technique includes using optical inspection data to obtain an OPD profile of the substrate, obtaining a polynomial representation of the OPD profile, and determining a plurality of polynomial coefficients that characterize each fundamental deformation shape of the substrate. The technique further includes identifying one or more cylindrical decompositions of a parabolic portion of the OPD profile, and calculating one or more characteristics of a stress compensation layer (SCL) for the substrate using a selected one of the one or more cylindrical decompositions. The technique further includes depositing the SCL on the substrate and exposing the SCL to a stress relaxation beam.

The invention relates to a microfluidic device (10) comprising: a support (20) comprising a substrate (25) made of an elastically deformable material; a study chamber (30, 30a, 30b) extending inside the support (20) and having: at least one upper wall (32), at least one lower wall (34), and at least two side walls (33) at least partially formed by a base (25); at least one substrate deformation chamber (40, 40a, 40b) formed at least partially by the substrate (25) and fluidically independent of the study chamber (30, 30a, 30b) and extending at least partially inside the support (20) along one of the side walls (33) of the study chamber (30), the microfluidic device is configured such that deformation of the deformation chamber (40, 40a, 40b) results in application of a mechanical stress to at least one portion of the upper wall (32) in the study chamber (30).

The disclosed system and technique are directed to correcting out-of-plane (OPD) deformation of a substrate by depositing a stress compensation layer (SCL) on the substrate and obtaining a profile of the OPD of the substrate using optical inspection data. The technique further includes obtaining a dataset including a representation of an influence function of the substrate, the influence function characterizing a deformation response of the substrate caused by a point-like mechanical influence. The technique further includes performing a regression calculation to determine a distribution of stress relaxation exposure of the SCL that relieves the OPD of the substrate based on at least the profile of the OPD of the substrate and the influence function. The technique further includes performing a stress relaxation exposure of the SCL using the determined distribution of stress relaxation exposure.

A method of determining a positioning correction of a substrate in a lithographic process is disclosed. The method includes obtaining a trained first model for various training data sets, the trained first model having been trained to minimize a force balance residual of a force on a substrate after performing at least one action causing a physical deformation of the substrate, the physical deformation is affected by a non-linear frictional interaction between the substrate and a substrate support supporting the substrate; obtaining estimated substrate deformation data associated with the substrate; inputting the estimated substrate deformation data into the trained first model to obtain, after the action, modeled substrate deformation data relating to the substrate, the modeled substrate deformation data taking into account the non-linear frictional interaction between the substrate and the substrate support; and determining a positioning correction of the substrate in exposure using the modeled substrate deformation data.

The invention relates to the technical field of laser holography anti-counterfeiting printing, in particular to an anti-counterfeiting bill printing system based on the laser holography technology, a tension fluctuation detection unit collects tension data of a base material in real time through a plurality of sensors, and a microprocessor of a control unit combines the elasticity modulus of the base material and the tension fluctuation frequency to control the anti-counterfeiting bill printing system based on the laser holography technology. Accurately calculating a grating spacing compensation value through a grating coupling compensation algorithm and a deformation lag correction factor; the diffraction angle compensation unit adopts dual-channel cooperative control, the first channel adjusts the pressure of a compression roller through force-position hybrid control and displacement redundancy check, and the second channel corrects the laser irradiation angle by means of a two-dimensional rotating platform and an angle dynamic pre-compensation mechanism; and model parameters are optimized through diffraction consistency verification and a neural network self-learning module, the influence of base material deformation caused by tension fluctuation is continuously counteracted, the consistency of holographic grating distances and the stability of diffraction angles are guaranteed, and the anti-counterfeiting performance and printing quality of bills are improved.

The invention relates to the technical field of plastic packaging, and discloses a tool clamp structure suitable for a lead frame and a high-density substrate, which comprises a pressing plate, a limiting plate and a base, the limiting plate and the base as well as the limiting plate and the pressing plate are aligned through matching of internal magnetic parts and magnetic conduction positioning pins, and are fixedly connected in sequence through magnetic attraction structures; wherein a hollow cavity is formed in the limiting plate, and a step is arranged in the hollow cavity and used for positioning the base plate. A positioning and fixing structure is designed on the basis of the structural design requirements for universality and alignment precision of the substrate, universality and alignment precision are achieved through tool combination, compared with an existing tool technology, the limiting precision is higher, front and back face machining of the substrate material can be achieved through tool combination, substrate deformation is effectively controlled, and the production efficiency is improved. And the production efficiency and the product reliability are improved.

The invention discloses a method and equipment for manufacturing a concave-surface Praxiso plate and a storage medium, and belongs to the technical field of electronic equipment. The semitransparent polymer blank can be specifically made of a polymethyl methacrylate material, and the material has excellent optical transparency and mechanical stability; the tool can be specifically designed to be a rigid clamping device made of aluminum alloy, and the geometrical shape of an inner cavity of the tool is precisely matched with the rear surface of a Praxiso plate forming part so that stress-free fixing can be achieved; a high-precision numerical control lathe can be selected as a lathe, the deviation between the center of the tool and the rotating center of a lathe spindle is controlled within the micron-scale range through a laser alignment instrument, the method effectively restrains deformation of the base through rigid support provided by the tool, the interface quality is optimized in combination with a surface treatment process, and the concave surface structure keeps geometric stability in the manufacturing process; the optical precision and the long-term mechanical reliability of the Praxiso plate are remarkably improved, the uniformity and the sharpness of the annular pattern are ensured, and the strict requirements of corneal topographic map measurement are met.

This invention belongs to the field of precision manufacturing equipment technology, specifically relating to a support member for improving substrate deformation. It is used to support the substrate during precision etching processes. The support member is a ring-shaped support member, used to support the substrate from its outer edge. An adsorption portion is provided at the contact portion with the substrate; the adsorption portion is used to eliminate edge warping that occurs when the substrate is placed on the support member. This invention improves the deformation of thin substrates caused by gravity by applying adsorption force or pressure to the substrate edge to compensate for the effects of gravity on the effective area of ​​the substrate, preventing deformation in the edge region, ensuring structural resolution and uniformity, and improving processing efficiency.

The utility model relates to a substrate anti-deformation type film pasting jig which comprises a mounting base, a placing base body is arranged on the mounting base, positioning spaces are distributed in the placing base body, a sealing mechanism is arranged at the position, located on the edge of the positioning spaces, of the placing base body, and a positioning assembly is arranged at the position, located above the sealing mechanism, of the placing base body. A plurality of supporting devices are distributed in the positioning space, and a plurality of adsorption channels are distributed on the placing base body. Therefore, the square rubber sealing strip is adopted, the installation is convenient and fast, a complicated rubber casting process is not needed, and the manufacturing and maintenance cost is reduced. And by replacing a square rubber sealing strip, the device can adapt to various conventional substrate shapes, adsorption assistance is carried out, and the universality is good. The positioning assembly is adopted to participate in positioning of the sealing mechanism, proper clamping or pressing combination can be achieved, and the air tightness in the using period is improved.

This utility model relates to a continuous vertical transfer deposition equipment, including a vertical conveying mechanism, a metal foil strip, several guide rollers, a deposition section, and a transfer deposition section. The vertical conveying mechanism is used to transport an upright substrate. In the deposition section, the metal foil strip has a horizontal coating surface facing downwards, while in the transfer deposition section, the coating surface is vertical and faces the substrate. The deposition section has a deposition source, and the transfer deposition section includes a vertical heating source. A gap is formed between the vertical heating source and the substrate for the metal foil strip to pass through. The guide rollers are used to taut the metal foil strip and switch its direction between vertical and horizontal. The movement direction of the metal foil strip near the vertical heating source is the same as the movement direction of the substrate. This utility model uses a metal foil strip as a carrier, first depositing the coating material from bottom to top onto its coating surface, and then twisting the metal foil strip to a vertical direction to vertically deposit the coating material onto the upright substrate. This provides good process continuity, avoids substrate deformation, and ensures uniform deposition thickness.

The invention provides a deformation suppression and compensation method for a large-size packaged high-precision bonded substrate, and belongs to the technical field of microelectronic chip packaging. The method comprises the steps that a wave crest part and a wave trough part are formed on a substrate in a warping state, the wave crest part and the wave trough part of the substrate are positioned, the distance between the highest point of the wave crest part in the thickness direction of the substrate and the lowest point of the wave trough part is the warping amplitude, and the warping amplitude is measured. The base plate is placed on a base plate, a cushion block is arranged between the wave trough part and the base plate, and a pressing plate is arranged above the wave crest part. And the pressing plate is pressed downwards, so that the warping amplitude is gradually reduced. And bonding the substrate with the chip. According to the method provided by the invention, the complex deformation of the multi-chip large-size packaging substrate can be inhibited.

Provided are a computer program, an information processing method, and an information processing device.　The computer program, which is for outputting information of a processing parameter to be applied to a processing step for correcting deformation of a substrate, causes a computer to execute processing for receiving a constraint condition in the processing step, predicting an amount of deformation of the substrate in accordance with the given processing parameter, evaluating the prediction result of the amount of deformation, searching for the processing parameter to be applied to the processing step under the received constraint condition, and outputting information of a candidate for the processing parameter obtained as the search result.

The present application relates to the field of precision measurement and analysis technology, and relates to a rectangular thin substrate deformation and stress state variable curvature prediction method and device. The prediction method comprises: establishing a three-dimensional coordinate system XYZ; establishing a deflection model of the variable curvature of the thin substrate with the change of the position coordinates, abandoning the original deflection model with the same curvature everywhere, and obtaining the strain model of the rectangular thin substrate at the coordinates (x, y, z) by establishing the variable curvature deflection model: X-axis direction strain ε x , Y-axis direction strain ε y , and shear strain γ xy . The strain model of the present application ε x , ε y , and γ xy adopts the method of designing a new ω, especially ω, and the calculation model of the deflection ω is designed as ω=ax 4 +by 4 +cx 2 y 2 +dx 2 +ey 2 . At this time, the curvature of the thin substrate changes with the change of the position coordinates, and the traditional model of the rectangular thin substrate deflection calculation model with the same curvature everywhere is completely abandoned. The present application solves the technical problem of inaccurate prediction of the stress state of the rectangular thin substrate in the prior art.