56 results about "Substrate deformation" patented technology

The invention discloses an intelligent defect detection system and a self-repairing method for a flexible base material RFID tag, and belongs to the technical field of Internet of Things electronic device manufacturing. According to the system, a three-dimensional dynamic scanning system is constructed by integrating a high-resolution image acquisition module, a multispectral sensor array and a mechanical arm motion platform, and surface and internal structure characteristics of a flexible substrate are captured in real time. A defect identification algorithm based on deep learning is combined with a multi-scale convolutional neural network and a transfer learning technology, precise classification of 12 types of defects such as microcracks, conductive layer fractures and base material deformation is realized, and the detection precision reaches 99.2%. A dual-mode self-repairing mechanism is put forward, specifically, nano-silver conductive colloid is injected through a microfluid channel for the defects of the conductive layer, and 3D structure reconstruction is achieved through a controllable temperature field; for substrate damage, a photoresponse shape memory polymer patch is adopted, and molecular-level bonding repair is achieved after ultraviolet light activation. According to the scheme, the detection efficiency is improved by more than 5 times, and the radio frequency performance of the tag is recovered to 98.7% of the initial value after self-repairing.

The invention provides a self-adaptive fitting method and system for a substrate deformation measurement system based on a fiber bragg grating (FBG), and the method comprises the steps: reading an output signal of an FBG sensor network, respectively collecting the wavelength data of a grating sensor and the stress data of a stress sensor at the same position as the grating sensor, and constructing a stress-wavelength data set; fBG data points with most sensitive deformation response are automatically identified, and a dynamic sensitive point set is formed and then preprocessed; a set needing to be continuously monitored is analyzed and determined, a specific point is selected to execute an adaptive segmentation fitting algorithm, segmentation points and fitting polynomial coefficients of all subintervals are output, and a final fitting model is constructed; according to the sub-interval of the wavelength value measured by the FBG sensor, calling a sub-interval fitting model, calculating a corresponding stress value, and further obtaining the deformation quantity of the measured object. According to the invention, the contradiction between the monitoring efficiency and precision of the traditional uniform layout in a complex stress scene is solved, and the technical path and the application target have remarkable industry uniqueness.

The invention relates to a gold stamping packaging box production method and system, and the method comprises the following steps: S1, carrying out the humidity adjustment and flatness correction of a packaging box blank raw material, and enabling the humidity and flatness of the raw material to reach preset threshold values; s2, a gold stamping target area of the blank is recognized, and three-dimensional coordinates of the gold stamping target area are obtained; s3, based on the raw material characteristics, the environmental parameters and the positioning data, gold stamping temperature, pressure and speed parameters are calculated through a machine learning model; s4, according to the three-dimensional coordinates and the gold stamping parameters, a gold stamping plate is controlled to be attached to the green body for hot stamping; s5, performing defect detection on the gold-stamped green body, and dividing qualified products and unqualified products according to a detection result; and S6, the qualified product is subjected to cutting, film covering, impurity removal and collection. The method has the beneficial effects that substrate deformation caused by non-uniform humidity of raw materials and poor flatness is eliminated, the three-dimensional space coordinates of the gold stamping target area can be accurately recognized, and the gold stamping temperature, pressure and speed can be dynamically optimized based on a machine learning model.

Systems, apparatuses, and methods are provided for correcting the detected positions of alignment marks disposed on a substrate and aligning the substrate using the corrected data to ensure accurate exposure of one or more patterns on the substrate. An example method can include receiving measurement data indicative of an interference between light diffracted from a plurality of alignment marks disposed on a substrate or reflected from the substrate. The example method can further include determining substrate deformation data based on the measurement data. The example method can further include determining alignment mark deformation data based on the measurement data. The alignment mark deformation data can include alignment mark deformation spectral pattern data, alignment mark deformation amplitude data, and alignment mark deformation offset data. Subsequently, the example method can include determining a correction to the measurement data based on the substrate deformation data and the alignment mark deformation data.

Disclosed techniques include obtaining a wafer with a front side supporting deposited features and identifying first characteristics of one or more protective films and second characteristics of one or more stress-compensation layers (SCLs). The techniques further include forming the protective film(s) on the front side of the wafer and depositing the SCLs on the back side of the wafer. The techniques further include subjecting at least one SCL to a stress-modulation beam causing a saddle deformation of the wafer to be reduced and removing the protective film(s) from the one or more deposited features.

A system includes an electrostatic chuck. The electrostatic chuck includes a ceramic puck configured to support a substrate. The electrostatic chuck further includes a clamping electrode disposed within the ceramic puck and configured to electrostatically clamp the substrate to the ceramic puck responsive to being energized with a clamping voltage. The electrostatic chuck further includes one or more sensor electrodes disposed within the ceramic puck. The system further includes one or more electronic circuits coupled with the one or more sensor electrodes. The system further includes a processing device. The processing device is configured to receive, from the one or more electronic circuits, a signal indicative of substrate deformation. The processing device is further configured to adjust the clamping voltage based on the signal.

The invention discloses a twice exposure process preparation method, which comprises the following steps: S1, substrate pretreatment: coating a photoresist layer on the surface of a substrate, pre-drying, and presetting a periodic calibration mark array on the surface of the substrate; s2, first exposure: carrying out first exposure on the photoresist layer through a first mask plate; s3, dynamic alignment compensation: transferring the substrate to a secondary exposure station, collecting substrate deformation data and calibration mark offset in real time through a multi-mode sensor, generating a displacement correction signal by using a dynamic compensation algorithm in combination with initial coordinate data, and compensating alignment errors caused by thermal drift and mechanical vibration; s4, performing secondary exposure; s5, developing and etching; s6, carrying out post-treatment; according to the invention, the deformation and offset of the substrate are monitored in real time through the multi-mode sensor, and the Kalman filter and the neural network dynamic compensation algorithm are combined, so that the influence of thermal drift, mechanical vibration and environmental disturbance is effectively inhibited, and the superposition alignment error of the two exposure patterns is reduced.

Disclosed techniques include obtaining a wafer with a front side supporting deposited features and identifying first characteristics of one or more protective films and second characteristics of one or more stress-compensation layers (SCLs). The techniques further include forming the protective film(s) on the front side of the wafer and depositing the SCLs on the back side of the wafer. The techniques further include subjecting at least one SCL to a stress-modulation beam causing a saddle deformation of the wafer to be reduced and removing the protective film(s) from the one or more deposited features.

The present application relates to the technical field of precision measurement of geometric quantity, and discloses a kind of four-layer half-hole plate precision drilling trajectory measurement system, comprising: image acquisition module, deformation analysis unit and trajectory measurement module, image acquisition module gathers the random texture image of the surface of the drilling site and the dynamic projection profile of cutting tool;Deformation analysis unit identifies feature point displacement vector, to reconstruct non-uniform grid and convert substrate deformation into local coordinate offset of modified reference surface;Trajectory measurement module extracts gray gradient data to determine spindle deflection vector, and combines shadow shortening rate to identify depth zero position, the present application uses substrate local texture displacement and the inversion mechanism of rotating light shadow feature, eliminates the nonlinear residual caused by stress release, guarantees the spatial consistency of complex inner space motion trajectory measurement.

A substrate processing apparatus capable of preventing deformation of a substrate during processing includes a substrate supporting unit having a contact surface in contact with an edge of the substrate to be processed, in which the substrate supporting unit includes a protruding (e.g., embossed) structure protruding from a base to support deformation from an interior of the edge of the substrate to be processed.

The invention relates to the technical field of imprint, in particular to an imprint base, mask equipment, an imprint method and a design method. The imprinting base comprises a base body, the base body is provided with a containing area used for containing a substrate, the base body is further provided with a vacuum adsorption cavity and an air pressure cavity which are communicated with the containing area, the vacuum adsorption cavity and the air pressure cavity are independently arranged, the vacuum adsorption cavity is used for providing adsorption force for the containing area, and the air pressure cavity is used for providing adsorption force for the containing area. The air pressure cavity is used for providing supporting force opposite to the adsorption force for the containing area. According to the imprinting base disclosed by the invention, the deformation posture control of the substrate is realized through the vacuum fixation of the vacuum adsorption cavity on the substrate and the reverse pressurization of the air pressure cavity on the substrate, so that the influence of the deformation of the substrate on the processing quality of the substrate is reduced.

The invention discloses an additive and subtractive composite manufacturing online monitoring method, which comprises the following steps of: acquiring strain characteristics in an additive and subtractive process by utilizing a monitoring and feedback control system comprising a substrate, a strain gauge, a strain collector, a data processing computer, an additive and subtractive composite forming control system and a motion system; according to the method, real-time monitoring of substrate deformation in the additive and subtractive composite manufacturing process is achieved, whether process adjustment of additive and subtractive composite manufacturing needs to be carried out or not is judged by comparing strain signals with strain signal preset values in a process adjustment database, feedback control is achieved, the local large strain phenomenon in the additive and subtractive manufacturing process can be found in time, and the production efficiency is improved. The method has the advantages of preventing crack defects, monitoring the state of the cutter, optimizing the roughness and dimensional precision of the machined surface, solving the problem of part machining failure caused by hot cracks or low precision in additive and subtractive composite manufacturing, and having wide application prospects and remarkable technical advantages.

Disclosed systems and techniques that deploy machine learning models (MLMs) for mitigation of stresses and deformations of substrates. The techniques include obtaining a training input that includes a map of deformation of a substrate, processing the training input using the MLM to generate an MLM output, the MLM output predicting a dose map for a stress-modification beam (SMB) that, being applied to a stress-compensation layer (SCL) formed on the substrate, causes modification of the deformation of the substrate. The techniques further include training the MLM using the predicted dose map and deploying the trained MLM for processing of one or more additional substrates.

A system includes an electrostatic chuck. The electrostatic chuck includes a ceramic puck configured to support a substrate. The electrostatic chuck further includes a clamping electrode disposed within the ceramic puck and configured to electrostatically clamp the substrate to the ceramic puck responsive to being energized with a clamping voltage. The electrostatic chuck further includes one or more sensor electrodes disposed within the ceramic puck. The system further includes one or more electronic circuits coupled with the one or more sensor electrodes. The system further includes a processing device. The processing device is configured to receive, from the one or more electronic circuits, a signal indicative of substrate deformation. The processing device is further configured to adjust the clamping voltage based on the signal.

This application provides a fixing fixture and processing equipment, relating to the field of material processing, and solves the technical problem that rigid clamping methods can easily damage products during machining. The fixing fixture includes: a support component having at least one receiving space and a first opening connecting the receiving space to the outside, the first opening facing upwards; shape memory alloy particles disposed in the receiving space and extending from the first opening, so that the shape memory alloy particles support the product. The shape memory alloy particles can deform at the processing temperature to conform to the shape of the product after thermal expansion, thereby reducing the pressure of the shape memory alloy particles on the deformed product and lowering the risk of coating damage and substrate deformation.

The disclosed technology includes obtaining a wafer having front side support deposition features, and identifying first characteristics of one or more protective films and second characteristics of one or more stress compensation layers (SCLs). The technology further includes forming the protective films on a front side of the wafer, and depositing the SCLs on a back side of the wafer. The technology further includes subjecting at least one SCL to a stress-modulating beam, resulting in a reduction of a saddle distortion of the wafer, and removing the protective films from the one or more deposition features.

Disclosed is a method of determining a substrate deformation metric relating to at least one substrate, the substrate deformation metric describing deformation across the at least one substrate. The method comprises obtaining alignment data relating to measurement of a plurality of structures on said substrate using a plurality of illumination conditions; and determining substrate deformation metric values for the substrate deformation metric which minimizes the number of basis vectors which are required to expand dispersion due to structure deformation of said plurality of structures.

Embodiments of the present disclosure relate to substrate supports, transfer apparatuses, processing chambers, and related components and methods for substrate deformation (e.g., bending). In one or more implementations, a substrate used in connection with the present disclosure may be deformed (e.g., bent) prior to and / or during processing, such as epitaxial deposition. In one implementation, a substrate support suitable for use in a semiconductor manufacturing operation includes a support body. The support body includes an outer surface, a recessed surface recessed relative to the outer surface, and a pocket surface between the outer surface and the recessed surface. The recessed surface and the pocket surface at least partially define a pocket of the support body. The support body includes a plurality of supports protruding relative to the recessed surface. The substrate support includes a barrier layer interfacing with the plurality of supports. The barrier layer includes a plurality of barrier layer supports.

To provide an imprint device which is advantageous for overlap accuracy in imprint processing in a case where a portion of a pattern part of a mold is positioned outside of a substrate.SOLUTION: An imprint device for forming a pattern on a substrate using a mold comprises: a drive section which changes a relative tilt amount between opposed faces of the mold and the substrate; a mold deformation mechanism which deforms the mold in such a manner that a shape of the mold is projected toward the substrate; a substrate deformation mechanism which deforms the substrate in such a manner that a surface shape in at least a portion of the substrate is projected toward the mold; and a control section which determines a tilt amount by the drive section when starting contact between the mold and a non-cured imprint material on the substrate, a mold deformation correction amount for a predetermined mold deformation amount by the mold deformation mechanism and a substrate deformation amount by the substrate deformation mechanism in the order of the tilt amount, the mold deformation correction amount and the substrate deformation amount.SELECTED DRAWING: Figure 10

An imprint apparatus including a mold deformation mechanism configured to deform a mold by applying a pressure to the mold, a substrate deformation mechanism configured to deform the substrate by applying a pressure to the substrate, a measurement unit configured to measure a deformation amount of the mold and a deformation amount of the substrate during separating the mold from the cured imprint material on the substrate, and a control unit configured to control, during the separating, a pressure to be applied to the mold by the mold deformation mechanism and a pressure to be applied to the substrate by the substrate deformation mechanism based on the deformation amounts measured by the measurement unit such that a difference between the deformation amount of the mold and the deformation amount of the substrate falls within an allowable range.

The present application relates to a kind of double-coated brake disc ultra-high speed laser cladding process method, comprising the following steps: according to brake disc surface area, the calculation formula of total energy output value of cladding efficiency, determine the total energy output value under the binding force qualified threshold;Set control factor, deduce the coupling formula of power, powder feed rate, efficiency and thickness;Using double-layer time-lapse cladding, establish radius time line speed kinematics model, accurately describe the second layer linear velocity variation law;Determine the compensation factor of second layer cladding, obtain the real-time compensation formula of power, powder feed rate changes with linear velocity in second layer cladding process.The present application is around the technical goal of high efficiency and high quality collaborative optimization, systematic design is carried out in process modeling, parameter coupling and dynamic control, on the premise of ensuring coating bond strength, forming quality and substrate deformation controllable, realize efficiency maximization, with stronger implementability and replicability, be conducive to standardization, large-scale development.

This invention discloses an intelligent defect detection system and self-healing method for RFID tags on flexible substrates, belonging to the field of IoT electronic device manufacturing technology. The system integrates a high-resolution image acquisition module, a multispectral sensor array, and a robotic arm motion platform to construct a three-dimensional dynamic scanning system, capturing the surface and internal structural features of the flexible substrate in real time. A deep learning-based defect recognition algorithm, combined with multi-scale convolutional neural networks and transfer learning techniques, achieves accurate classification of 12 types of defects, including microcracks, conductive layer fractures, and substrate deformation, with a detection accuracy of 99.2%. A dual-mode self-healing mechanism is proposed: for conductive layer defects, nano-silver conductive colloid is injected through microfluidic channels, and 3D structural reconstruction is achieved using a controllable temperature field; for substrate damage, a photoresponsive shape memory polymer patch is used, which achieves molecular-level bonding repair after activation by ultraviolet light. This solution improves detection efficiency by more than 5 times, and the RF performance of the tag recovers to 98.7% of its initial value after self-healing.

Provided are a printing apparatus and a printing method that can realize improvement of drying properties, suppression of substrate deformation, and suppression of jetting failure. The printing apparatus includes a print head that jets an aqueous ink onto a substrate to form an image, a substrate moisture reduction unit that reduces moisture of the substrate before the image is formed by the print head, and an absolute humidity adjustment unit that adjusts an absolute humidity in a periphery of a nozzle surface of the print head.

The disclosed systems and techniques relate to correcting out-of-plane deformation (OPD) of a substrate. The technique includes the following operations: obtaining an OPD profile of the substrate using optical inspection data; and obtaining a polynomial representation of the OPD profile to determine a plurality of polynomial coefficients characterizing respective elemental deformation shapes of the substrate. The technique further includes the operations of: identifying one or more cylinder decomposition (cylinder decomposition) of a quadratic part (quadratic part) of the OPD profile, and identifying one or more cylinder decomposition (cylinder decomposition) of a quadratic part (quadratic part) of the OPD profile, the one or more cylinder decomposition (cylinder decomposition) of the quadratic part (quadratic part) of the OPD profile, the one or more cylinder decomposition (cylinder decomposition) of the OPD profile, and calculating one or more characteristics of a stress compensation layer (SCL) for the substrate using a selected one of the one or more cylinder decomposition. The technique further includes the operations of depositing the SCL on the substrate and exposing the SCL to a stress mitigation beam.

Disclosed techniques include obtaining a map of deformation of a substrate, depositing a stress-compensation layer (SCL) on the substrate, computing a dose map for a stress-modification beam, the dose map having a first feature of a first spatial scale and a second feature of a second spatial scale. The techniques further include forming a spatially modulated mask on the SCL, the spatially modulated mask having a first modulation along a first direction and a second modulation along a second direction. The techniques further include subjecting the spatially modulated mask and the SCL to the stress-modification beam to induce a spatial modulation of stress in the SCL, the spatial modulation of stress in the SCL causing modification of the deformation of the substrate.

The invention relates to the technical field of optical coating production, in particular to an optical coating method for preventing deformation and warping of a substrate and an optical filter, and the method comprises the steps: decomposing a target spectrum of the optical filter into a first spectrum and a second spectrum; designing a first film layer according to the first spectrum, and designing a second film layer according to the second spectrum; a first film layer is deposited on the front face of the substrate, a second film layer is deposited on the back face of the substrate, and the stress applied to the substrate by the first film layer and the stress applied to the substrate by the second film layer are mutually counteracted. The super-multilayer film is decomposed into the first film layer and the second film layer, and the first film layer is deposited on the front surface of the substrate and the second film layer is deposited on the back surface of the substrate respectively, so that the possibility of substrate deformation caused by overlarge stress due to the fact that the super-multilayer film is completely deposited on the same surface of the substrate is reduced; and meanwhile, the stresses applied to the substrate by the first film layer and the second film layer are approximately equal, so that the substrate is kept flat after the first film layer and the second film layer are deposited on the front surface and the back surface of the substrate respectively.

A system for measuring deformation of a substrate includes an illuminator, a camera, a modulator system, and a controller. An illuminator directs two radiation beams at each of a plurality of targets disposed on a substrate to produce two scattered radiation beams from each target. A camera detects an interference pattern of two scattered radiation beams from a plurality of targets and generates an interference pattern based on the interference pattern. The modulator system adjusts the interference pattern by adjusting the relative phase of the two radiation beams. A controller analyzes the measurement signal and determines a deformation of the substrate based on the interferogram and the adjustment to the relative phase.

Embodiments of the present disclosure relate to substrate supports, transfer devices, processing chambers, and related components and methods for substrate deformation (e.g., bending). In one or more embodiments, substrates used in connection with the present disclosure may be deformed (e.g., bent) before and / or during processing, such as epitaxial deposition. In one embodiment, a substrate support usable in a semiconductor manufacturing process includes a support body. The support body includes an outer surface, a concave surface recessed relative to the outer surface, and a pocket surface between the outer surface and the concave surface. The concave surface and the pocket surface at least partially define a pocket in the support body. The support body includes a plurality of supports protruding relative to the concave surface. The substrate support includes a barrier in contact with the plurality of supports. The barrier includes a plurality of barrier supports.

The invention discloses a substrate conveying device which is characterized in that a first detection piece is arranged at the front end of a track assembly to detect whether a substrate deforms and falls off a track and is conveyed to a designated position, and when the substrate is conveyed to the designated position of the track assembly, a controller controls a horizontal conveying assembly to act to clamp the substrate and convey the substrate to a termination position; and the substrate located at the ending position is adsorbed and fixed through the material ejecting assembly. Therefore, the problem that the substrate is blocked due to the fact that the substrate deforms and falls off the track or / and the horizontal conveying assembly performs the next action when the substrate is not conveyed to a designated position can be effectively avoided, the risk that the substrate is damaged is reduced, and the conveying quality is improved. The invention further discloses a substrate conveying method using the substrate conveying device.

To provide an adhesive sheet which contains thermally expandable microspheres, can express peeling property by heating, can reduce adherend damage when peeling, and is suppressed in substrate deformation by heat peeling.SOLUTION: An adhesive sheet comprises a substrate and an adhesive layer arranged on at least one side of the substrate. The adhesive sheet which can be peeled by laser beam irradiation and has expanding property is such that: a storage elastic modulus of the adhesive sheet at 0°C is 10 MPa-500 MPa; the adhesive layer contains thermally expandable microspheres; and a volume filling rate of the thermally expandable microspheres is 1%-28% in the adhesive layer.SELECTED DRAWING: Figure 1