49results about How to "Improve polishing uniformity" patented technology

Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.

The invention provides a rotary magnetic pole magnetorheology polishing device used for polishing the inner wall of a pipe-like workpiece. The rotary magnetic pole magnetorheology polishing device comprises a magnetorheology liquid feeding system, a workpiece supporting and driving mechanism and a magnetic pole rotating mechanism. Under the effect of a liquid pressure pump, magnetorheology liquidis pumped in an inner cavity of a pipe fitting from a liquid input pipe on a pipe fitting clamping device, by means of high pressure generated by the pressure pump, the magnetorheology liquid flows fast in the inner cavity of the pipe fitting, when flowing through a polishing area, the magnetorheology liquid generates the rheology effect due to the influence of the intensity of a magnetic field, shear yield stress and apparent viscosity are increased fast, under reciprocating motion of the workpiece and rotating motion of a rotating magnetic frame, compound motion between the workpiece and themagnetorheology liquid is achieved, and removal of materials on the inner surface of the workpiece is completed. The invention further provides a method adopting the device for carrying out polishing. The polishing device can polish the inner wall of a thin short non-magnetic pipe automatically, and has the advantages of being simple in structure, uniform in polishing, high in efficiency, high incontrollability of the polishing process, free of surface damage and the like.

A linear chemical mechanical polishing apparatus that is equipped with a programmable pneumatic support platen and a method for controlling the polishing profile on a wafer surface during a linear CMP process are disclosed. The programmable pneumatic support platen is positioned juxtaposed to a bottom surface of a continuous belt for the linear CMP apparatus and positioned corresponding to a position of the wafer carrier so as to force the polishing pad against the wafer surface to be polished. The support platen has a predetermined thickness, a plurality of apertures through the thickness and a plurality of openings in a top surface in fluid communication with a gas source through the plurality of apertures.

A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.

The invention discloses an improved wrench polishing machine, which comprises a wrench fixing device, a polishing device, a frame body and a moving seat mechanism. The frame body is provided with a moving seat mechanism and a polishing device located in front of the moving seat mechanism. The seat mechanism is provided with a wrench fixing device, and the wrench fixing device includes a lifting mechanism, an adjustable fixing mechanism for fixing the wrench head and a fixing device for fixing the free end of the wrench handle, and the moving seat mechanism is provided with a lifting mechanism and a fixing device, The lifting mechanism is provided with an adjustable fixing mechanism, and the adjustable fixing mechanism includes a shelving seat, two sliding rods, an adjusting screw, an adjusting plate, two pillars, a connecting body, two sliding bodies, a pressing body, two Compared with the prior art, a spring, two blocking bodies, a screw body, two supporting bodies, a mounting base and a rotating disc can be applied to wrenches of various sizes, thereby improving work efficiency and polishing uniformity.

The invention discloses a grinding roller of a polishing machine. According to the grinding roller, two separated grinding roller bodies are connected through a connection rod, and are rotated synchronously through a drive shaft, the connection rod is bent by adjusting the distance between the two separated grinding roller bodies, an arc groove is formed between the two grinding roller bodies, andthus plates can be polished and ground. The grinding roller of the polishing machine is characterized in that two supporting plates are arranged in the main grinding roller body and located at the two ends of the main grinding roller body separately; each supporting plate is formed by combining a center circular ring and four supporting arms arranged on the outer side wall of the center circularring at equal angles; the center circular rings and the main grinding roller body are coaxial; a rectangular protrusion is arranged on the inner side wall of each center circular ring, and the rectangular protrusions on the two supporting plates are located on the same straight line; a plurality of mounting grooves are formed in the outer side walls of the main grinding roller body and distributedalong the circumference and extend in the axial direction of the main grinding roller body; every three mounting grooves fall into one group, and the widths of the three mounting grooves of each group are gradually decreased; a chuck is disposed at the end face of one end of the main grinding roller body.

The invention discloses a high-efficiency workpiece polishing and polishing device. The high-efficiency workpiece polishing and polishing device comprises a base station main body; a grabbing manipulator, an abrasive belt mechanism and a polishing mechanism are arranged on the base station main body; and a cutting fluid circulation filtering system is arranged on one side of the base station mainbody, and the cutting fluid circulation filtering system communicates with the abrasive belt mechanism and the polishing mechanism through pipelines. The high-efficiency workpiece polishing and polishing device is novel in structural design, high in automation degree, and capable of rapidly grinding and polishing workpieces, good workpiece surface treatment uniformity is achieved, and the workpiece quality is improved.

The invention relates to a polishing device for a metal part. The polishing device comprises a polishing chamber, a reducing motor is perpendicularly arranged at the top end of the polishing chamber,the output end of the reducing motor is connected with a rotating shaft, the rotating shaft is perpendicularly provided with a plurality of hanging rod groups along the length direction, tapered sanddischarge openings are arranged at the lower end of the polishing chamber and positioned at two sides of the rotating shaft, a sand box is arranged at the lower end of the polishing chamber and positioned at the lower parts of the tapered sand discharging openings, two sides of the sand box are connected with transfer boxes through pipelines, the transfer boxes are fixedly arranged at two sides ofthe reducing motor at the upper end of the polishing chamber, the pipelines are fixedly provided with sand pumps, one sides of the transfer boxes are connected with sandblasting pipelines through pipelines, every transfer box and sandblasting pipeline connecting pipeline is provided with a pressure pump, the sandblasting pipelines are perpendicularly arranged at two sides of the polishing chamber, a plurality of sandblasting openings are perpendicularly arranged at one sides, facing the sidewall of the polishing chamber, of every sandblasting pipeline, and the plurality of sandblasting openings go through the sidewall of the polishing chamber, and extend into the polishing chamber. The polishing device for the metal part improves the overall polishing uniformity, shortens the polishing time and improves the overall polishing efficiency.

The invention discloses a planetary turnover type 3D curved glass polishing machine. The machine comprises a polishing mechanism and a planetary turnover type polishing carrier arranged right above the polishing mechanism; the planetary turnover type polishing carrier comprises a carrying plate containing chamber, a carrying plate, at least two sub-planetary carrying plates, and a transmission assembly, wherein the top of the carrying plate containing chamber is opened, the carrying plate is arranged in the carrying plate containing chamber, the at least two sub-planetary carrying plates are arranged on the carrying plate, and the transmission assembly is arranged right below the carrying plate contaning chamber. According to the machine, the machine is provided with the planetary turnovertype polishing carrier, it is ensured that the rotating angle and amplitude of every 3D curved glass is uniform, and thus the polishing uniformity is improved; polishing scraps can also be timely discharged; and the pressure applied to the 3D curved glass by a polishing disk is controlled in real time, so that the problem of insufficient polishing or excessive polishing is solved, and in this way, the surface quality of the 3D curved glass is improved.

There is provided an apparatus for polishing a substrate, including (a) a polishing pad formed with a plurality of through-holes through which polishing material is supplied to a surface of the polishing pad, (b) a level block on which the polishing pad is mounted, and (c) a rotatable carrier for supporting a substrate thereon, the carrier being positioned in facing relation with the level block, the level block being rotatable around a rotation axis thereof with the rotation axis being moved along an arcuate path, and causing the polishing pad to make contact with the substrate for polishing the substrate, the polishing pad having a first ring-shaped region concentric thereto where no through-holes are formed. For instance, the first ring-shaped region has a width greater than 10%, but smaller than 95% of a radius of the polishing pad. The apparatus enhances uniformity in polishing a substrate.

The invention discloses a polishing head and a chemical mechanical polishing device and method. The polishing head comprises a main body part which is used for clamping a wafer and enabling a to-be-polished surface of the wafer to face downwards so as to carry out chemical mechanical polishing, wherein the main body part is provided with an edge liquid supply loop, and the edge liquid supply loop is used for supplying liquid to the edge of the wafer in the chemical mechanical polishing process so as to change the concentration of a polishing solution at the edge of the wafer. According to the polishing head and the chemical mechanical polishing method, the concentration of the polishing solution on the edge of the wafer is changed by introducing the liquid from the edge of the wafer in the polishing process, so that the chemical mechanical polishing rate of the edge of the wafer is controlled, and the polishing uniformity of the wafer in the chemical mechanical polishing process is improved.

The invention discloses a push-type polishing mechanism based on a medical sliding block. The push-type polishing mechanism comprises a base, guide plates are fixedly mounted at one end of the base, the sliding block is clamped between the guide plates, a guide groove formed in one side of each guide plate, a rotating mechanism is mounted between the sliding block and the guide grooves, a positioning mechanism is mounted on the sliding block, the rotating mechanism is connected with the positioning mechanisms, and a push rod is connected to one side of the sliding block, a driving mechanism is installed at the top of the base, the push rod is connected with the driving mechanism, vertical plates are installed at the tops of the guide plates, polishing motors are fixedly installed on the outer wall of one vertical plate, and output shafts of the polishing motors rotationally penetrate through the vertical plates and are fixedly provided with polishing discs. Parts are positioned and clamped on the sliding block through the positioning mechanism, the driving mechanism drives the push rod to reciprocate at a constant speed, the push rod pushes the sliding block to slide between the guide plates, the sliding block drives the parts to rotate through the rotating mechanism during sliding, and when the polishing motors drive the polishing discs to polish the outer walls of the parts, the parts are kept in a reciprocating rotating state, and polishing is more uniform, and the surface cylindricity of polished cylindrical parts is kept unchanged.

The invention discloses an implementation method of a polishing machine machining path for a vacuum cup. The method mainly comprises the following steps of making an axis of a machined surface of a workpiece coincide with a spindle of a polishing machine; obtaining one bus of the machined surface; dividing the bus into N characteristic line segments in sequence, generating one characteristic pointby each characteristic line segment, collecting the characteristic points by using a teach pendant and then restoring the characteristic points into a continuous machining path in sequence; discretizing the continuous machining path to generate polishing cutting points; adaptively generating X-axis feed and Y-axis feed of polishing tools according to the polishing cutting points and generating deflection of the polishing tools or deflection of the workpiece, wherein the workpiece rotates around the spindle of the polishing machine and the polishing tools also rotate; and achieving polishing of the workpiece according to the speed difference between the workpiece and the polishing tools. As a result, the automation degree of polishing work of the vacuum cup is improved, the polishing machine is suitable for polishing of the vacuum cup with various buses, the flexibility of the polishing machine is improved and the method is simple in programming and short in elapsed time.

The invention discloses a wafer rotating chuck optimized on the basis of cathode spray head position change. A polishing current is regulated on the basis of position change in the cathode spray head moving process, and then the purpose of uniform polishing is achieved. According to the technical scheme, the radius of the chuck is larger than that of a wafer, a circular ring is arranged on the portion, exceeding the wafer, of the chuck, a wafer slot is formed in the middle of the chuck and used for adsorbing the wafer, and a power supply, a cathode spray head and an anode spray head are arranged below the chuck; the position of the anode spray head is constant relative to the wafer, the cathode spray head moves to the circular ring outside the wafer from the center of the wafer along the radius of the wafer, when the cathode spray head moves to the edge of the wafer, the intersection area of the cathode spray head and the wafer is decreased along with movement, and the polishing current on the cathode spray head is correspondingly decreased.