Novel electrochemical polishing device

Abstract

The invention discloses a novel electrochemical polishing device, which comprises: a wafer chuck, an electrolyte solution supply apparatus and a polishing power circuit formation apparatus. The wafer chuck clamps a wafer, and a metal layer is distributed on the wafer surface. The electrolyte solution supply apparatus includes a nozzle, which sprays the electrolyte solution to a metal layer on the wafer surface. The polishing power circuit formation apparatus consists of a polishing disk and a power supply. The polishing disk is made of a conductive material, the bottom surface of the polishing disk and the wafer surface are in parallel arrangement, the polishing disk and the nozzle are in synchronous movement, the anode of the power supply and the wafer chuck are in electric connection, and the cathode of the power supply and the polishing disk are in electric connection. According to the invention, the polishing disk is set and the polishing disk and the power supply are in electric connection so as to ensure that in any region of the wafer surface, a stable electric field can be formed between the polishing disk and wafer, and a current circuit is formed between the polishing disk and wafer through the electrolyte solution, thus improving the wafer surface polishing uniformity.

Description

technical field [0001] The invention relates to an integrated circuit manufacturing device, in particular to a novel electrochemical polishing device. Background technique [0002] With the rapid development of semiconductor technology, low dielectric constant media are used in the manufacture of integrated circuits. However, the application of low dielectric constant media has brought a lot of challenges to traditional chemical mechanical polishing technology. The fragility of low dielectric constant media is difficult to withstand the mechanical force applied by traditional chemical mechanical polishing technology. Therefore, it is imperative to seek a new planarization technology to solve the problem of planarization of low dielectric constant dielectrics. [0003] Electrochemical polishing technology has been gradually applied in the manufacture of very large scale integrated circuits and ultra large scale integrated circuits because it can overcome the defects of tradi...

AI Technical Summary

Problems solved by technology

However, when polishing the center of the wafer or the edge of the wafer, it is difficult to control the shape of the liquid column sprayed to the center of the wafer or the edge of the wafer stably, resulting in unstable polishing results, resulting in polishing uniformity in the entire wafer not ideal

Images