Wafer Spin Chuck Optimized Based on Cathode Shower Head Position Variation
A technology for rotating chucks and wafers, applied in the direction of working carriers, metal processing equipment, electrical components, etc., can solve problems such as uneven polishing, and achieve the effect of improving the uniformity of polishing and improving the effect
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[0021] The above-mentioned features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, components are not necessarily drawn to scale, and components with similar related properties or characteristics may have the same or similar reference numerals.
[0022] figure 1 A schematic diagram showing a wafer spin chuck in a stress-free polishing process. figure 2 A schematic diagram showing the starting position of the cathode shower head movement in the preferred embodiment of the wafer spin chuck optimized based on the position change of the cathode shower head of the present invention. image 3 A schematic diagram showing the termination position of the cathode showerhead movement in the preferred embodiment of the wafer spin chuck. Figure 4 A schematic diagram showing the cathode shower head moving to the edge of the wa...
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