Rotating adjusting type upper shaft mechanism for single-side polishing of large-size wafers

Abstract

The invention provides a rotating adjusting type upper shaft mechanism for single-side polishing of large-size wafers. The rotating adjusting type upper shaft mechanism comprises a cylinder, a rotating connector, a rotating shaft, a rotating motor, a rotating gear, a connecting shaft rod and an upper disc face, wherein the cylinder controls the upper disc face to rise and fall, the rotating motor controls the rotating gear, the rotating shaft, a rotating block, the connecting shaft rod and the upper disc face to rotate, an air tube inlet port is connected with a pneumatic electronic valve, and a water tube inlet port and a water tube outlet port are connected with a water tank. The rotating adjusting type upper shaft mechanism for single-side polishing of the large-size wafers is simple in structure and reasonable in design, a rubber sealing piece and a water leakage detection port are arranged, the sealing performance of the rotating connector is effectively improved, and monitoring is provided for monitoring water leakage situation of the rotating connector; meanwhile, in the polishing operation process, the upper disc face can be effectively cooled, the situation that due to the fact that temperature of the upper disc face rises, flatness of a ceramic disc and the surface of the upper disc face is changed, and the stability is destroyed is avoided, and then polishing uniformity is improved, and the flatness of the surfaces of the polished wafers is improved; and a vacuum layer between the ceramic disc and the bottom of the upper disc face is easy to remove, and wafers can be taken out more rapidly.

Description

technical field [0001] The invention relates to the field of photovoltaics, in particular to a rotary adjustment type upper shaft mechanism for single-side polishing of large-sized wafers. Background technique [0002] With the continuous advancement of technology, the size of wafers is getting bigger and bigger, and the specifications of wafers are ever-changing; the requirements for processing quality are becoming more and more stringent. [0003] However, in the single-side polishing of large-sized and different-sized wafers, it is facing huge challenges and tests; the efficiency of polishing determines the cost of processing, and the uniformity of polishing and grinding determines the quality of processing; reducing costs and improving quality also Become the goal and direction of technology research and development. [0004] In the traditional single-sided polishing, the polishing method of ceramic disc patch stuck into the upper disc surface and the polishing process ...

AI Technical Summary

Problems solved by technology

[0003] However, in the single-side polishing of large-sized and different-sized wafers, it is facing huge challenges and tests; the efficiency of polishing determines the cost of processing, and the uniformity of polishing and grinding determines the quality of processing; reducing costs and improving quality also Become the goal and direction of technology research and development

[0004] In the traditional single-sided polishing, the polishing method of ceramic disc patch stuck into the upper disc surface and the polishing process combining chemical and mechanical; due to the heat conduction effect, the temperature of the ceramic disc and the upper disc surface will increase with the increase of the polishing temperature. The principle of thermal expansion will lead to changes in the flatness of the surface of the ceramic disc and the upper disc surface; and the pressure of the upper axis acting on the single polished wafer will be unevenly distributed due to the change of the upper axis and the ceramic disc surface, resulting in wafer Uneven grinding, poor flatness of wafer surface after polishing

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