322results about "Grinding heads" patented technology

The invention discloses a steel structure butt welding adjusting device which comprises a supporting plate and supporting rods fixed to the four corners of the bottom of the supporting plate. A grinding part is arranged in the butt joint mechanism, in the butt joint process of the two steel structure bodies, the grinding part can make contact with the steel structure bodies along with continuous movement of a driving part, the grinding part comprises a coarse grinding plate, a fine grinding plate and a polishing plate, in the grinding process, a sliding plate slides on the top of a supporting plate along with a mounting plate driven by the driving part to move, and the grinding plate is in contact with the grinding part. The rough grinding plate firstly makes contact with the rotating steel structure main body and conducts comprehensive rough grinding on the end face of the steel structure main body through rotation of the steel structure main body, and due to the fact that a second gear at the bottom of a lead screw is meshed with a second rack at the bottom of a mounting shell, the lead screw can rotate, and therefore when a grinding piece moves to a certain degree, the grinding piece can rotate. And the rough grinding plate, the fine grinding plate and the polishing plate can sequentially treat the steel structure body and then move downwards into the second mounting frame.

The utility model relates to the technical field of polishing devices, in particular to a rare earth permanent magnet material high-precision polishing device which comprises a machining base, an installation vertical plate is fixedly installed on the machining base, a workpiece to be polished is placed on the machining base, and a grinding and polishing mechanism for rapidly grinding the workpiece to be polished is arranged on the installation vertical plate. And a grinding auxiliary mechanism for limiting and clamping a workpiece to be polished is arranged on the machining base, the grinding and polishing mechanism comprises a rotary round seat movably mounted on the mounting vertical plate, driving assemblies are symmetrically mounted on the rotary round seat, and a first grinding head and a second grinding head are arranged on the two driving assemblies correspondingly. By arranging the grinding and polishing mechanism, the grinding head can be automatically and rapidly replaced in the grinding and polishing process through mutual cooperation between the rotary round seat and the driving motor, the rare earth permanent magnet material can be roughly ground and finely ground, the integration degree is high, and workers do not need to manually replace the grinding head.

The utility model relates to a superhard material guide rail machining device which comprises a lathe bed. The working table is arranged above the machine body; the two ends of the cross beam are arranged on the workbench through stand columns; the X-axis linear motor module is arranged on the cross beam; the Z-axis linear module is arranged on the X-axis linear motor module; the spindle box is arranged on the Z-axis linear module, an electric spindle is arranged in the spindle box, and a grinding tool or a polishing tool is installed on the electric spindle; the Y-axis linear motor module is arranged on the workbench; and the workpiece carrying plate is arranged above the Y-axis linear motor module. Through multi-axis linkage of the X-axis linear motor module, the Y-axis linear motor module and the Z-axis linear motor module, the long guide rail is pressurized and polished through a small tool, the grinding amount is controlled through the dwell time and the polishing pressure, and high-precision machining of the long guide rail is achieved.

The invention discloses a precise steel pipe welding seam processing device and method, and belongs to the technical field of welding seam polishing. The welding seam processing device comprises a base for fixing a steel pipe, a guide rail extending along a steel pipe welding seam is arranged on the base, a sliding seat is slidably mounted on the guide rail, and a turbine rack concentric with the steel pipe is slidably connected into the sliding seat in an arc shape; a first driving mechanism used for driving the worm to reciprocate is arranged at one end of the worm, a supporting block is fixed to the worm gear rack, a supporting rod is movably connected into the supporting block in a limiting mode, a grinding disc is fixed to the end, close to the steel pipe, of the supporting rod, and the supporting rod moves to the limiting position in the direction close to the steel pipe so that the grinding disc can be attached to the steel pipe; second driving mechanisms are fixed to the ends, away from the steel pipes, of the supporting rods. The sliding seat slides along the guide rail, so that a steel pipe welding seam is polished through reciprocating motion of the grinding disc, and poor stability and cost increase caused by reciprocating rotation of the steel pipe are avoided.

The invention relates to the technical field of integrated circuit manufacturing, and provides wafer thinning equipment and a wafer thinning method. The wafer thinning equipment comprises a grinding device and an adsorption platform, the adsorption platform is used for bearing a wafer and driving the wafer to rotate, the grinding device is arranged above the adsorption platform in a lifting mode, and a grinding wheel used for grinding the wafer is arranged on the lower portion of the grinding device. The grinding wheel comprises a base material and a plurality of grinding blocks, and the grinding blocks are fixed to the base material through adhesive layers. The grinding block comprises spiral calcium carbonate containing a Si-O-Ca structure and is used for dispersing stress during grinding. According to the technical scheme, the problem that the flatness of the thinned wafer is poor in the prior art is solved.

The utility model discloses a high-speed photovoltaic glass edging machine, which relates to the technical field of photovoltaic glass processing equipment, and comprises a processing table, two sides of the processing table are respectively and fixedly provided with a polishing mechanism, one side of each polishing mechanism is provided with a feeding mechanism, the middle part of the processing table is fixedly provided with an adsorption mechanism, and the adsorption mechanism is provided with a feeding mechanism. The adsorption mechanism comprises a sliding rail, a sliding table, a mounting table, a first mounting frame and a vacuum adsorption assembly, and the sliding rail is fixedly mounted in the middle of the machining table. According to the photovoltaic glass polishing device, a vacuum suction cup in the vacuum adsorption assembly is attached to one side of the photovoltaic glass, a pump machine pumps out air at the contact point position of the vacuum suction cup and the photovoltaic glass, when the polishing mechanism polishes the edge of the photovoltaic glass, the photovoltaic glass is stably adsorbed to the upper portion of the first mounting frame, shaking and deviation cannot occur, and the polishing efficiency is improved. The grinding wheel grinding head can accurately and stably grind the edge of the photovoltaic glass, and the edge machining precision and quality are ensured.

The application provides a mechanical manufacturing output shaft surface grinding device, and relates to the grinding field. The mechanical manufacturing output shaft surface grinding device comprises a rack, a clamping and rotating mechanism for clamping and driving the rotation of an output shaft, a grinding wheel for grinding the surface of the output shaft, an elliptical profile of the grinding wheel enables the grinding wheel to form a point contact with the surface of the output shaft, a fixing frame fixed relative to the rack, and a connecting piece rotatably installed on the fixing frame. The mechanical manufacturing output shaft surface grinding device adopts an elliptical grinding wheel to realize a point contact grinding mode, so that the grinding wheel is always single-point attached to the output shaft, the grinding area is open, and the grinding dust is removed by cooperating with the cooling liquid and the flexible magnetic dust collection device, thereby avoiding the surface scratches and the pulling caused by the grinding dust being rolled into and crushed, greatly improving the surface quality of the workpiece, and the elliptical grinding wheel can swing with the grinding depth to form a continuously changing point contact, thereby reducing the single-point grinding force and the thermal stress concentration.

This invention relates to the technical field of granite workpiece processing, and in particular to a granite workpiece grinding device and method. The device includes a frame, a gantry frame mounted on the frame via a traveling mechanism, a lifting mechanism mounted on the gantry frame, a sliding mechanism mounted on the lifting mechanism, and a grinding mechanism mounted on the sliding mechanism via a mounting mechanism. The grinding mechanism includes a granite grinding plate, a handle mounted on the granite grinding plate, and multiple diamond-shaped grooves formed on the end face of the granite grinding plate away from the handle. This invention achieves high surface grinding precision and efficiency for granite workpieces.

The utility model discloses a quick-change polishing head, which comprises a polishing seat and a polishing tool, the polishing seat comprises a seat body and a rod body connected to the back surface of the seat body, the front surface of the seat body is recessed inwards to form a positioning cavity, a hook surface body of a magic tape is arranged in the positioning cavity, the polishing tool comprises a buffer pad and abrasive paper, and the buffer pad is arranged on the rod body. A rough surface body of a hook-and-loop fastener is arranged on the upper face of the buffer pad, the buffer pad is positioned in the positioning cavity through the attachment of the rough surface body and the hook surface body, the grinding tool is quickly and accurately adhered to the grinding seat through the positioning of the positioning cavity, and during grinding, the grinding tool is limited through the positioning cavity, so that the grinding tool is prevented from being damaged. The condition that the grinding tool shakes or falls off in the grinding process is prevented, and then the grinding stability and safety are improved; meanwhile, the abrasive paper covers the lower surface and the peripheral surface of the buffer pad, so that the tool can polish the plane and the side surface of the workpiece at the same time, and the application range is greatly expanded; in addition, the grinding tool is quickly connected and detached with the grinding seat through the hook-and-loop fastener, so that the grinding tool is conveniently and quickly replaced, and the working efficiency is effectively improved.

To provide a polishing machine which can perform polishing to a needed portion of a workpiece to attain highly accurate flatness regardless of the worker's skill level.SOLUTION: A polishing machine includes: a motor provided within a main part 10; a polishing part 40 which is rotated by a motor to polish a surface of a workpiece; and a universal joint 24 and a ball joint 30 which transmit rotation of the motor to the polishing part 40. The universal joint 24 and the ball joint 30 transmit rotation of the motor to the polishing part 40, regardless of an inclination of a rotation axis of the motor relative to a rotation axis of the polishing part 40.SELECTED DRAWING: Figure 3

The invention belongs to the technical field of glass polishing, and particularly relates to a glass ceramic continuous polishing machine which comprises a positioning mechanism, a polishing mechanism and a polishing mechanism. The lifting mechanism is fixed at the top of the positioning mechanism; the polishing mechanism is fixed to the top of the lifting mechanism; the positioning mechanism comprises a lower plate and lower frames, and the lower plate is fixed to the ends of the multiple lower frames. The first driving part is fixed to the top of the lower plate; and the protective cylinder is fixed in the middle of the plurality of lower frames. The planetary gear is composed of the inner gear ring, the pinions and the center gear, the pinions and the supporting disc are fixed and cannot horizontally revolve, the rotating direction of the inner gear ring is opposite to the rotating direction of the synchronous cylinder, the rotating directions of the front polishing plate and the back polishing plate are opposite, the front polishing plate and the back polishing plate rub glass ceramics in two directions, and the polishing effect is improved. Glass ceramics can be polished by rotating in two directions, and the polishing effect is good.

The invention provides an output shaft surface grinding device for mechanical manufacturing, and relates to the field of grinding. The output shaft surface grinding device for mechanical manufacturing comprises a machine frame and a clamping and rotating mechanism used for clamping and driving an output shaft to rotate, and further comprises a grinding wheel used for grinding the surface of the output shaft, a fixing frame fixed relative to the machine frame, and a clamping and rotating mechanism used for clamping and driving the clamping and rotating mechanism to rotate, the connecting piece is rotationally mounted on the fixing frame; according to the output shaft surface grinding device for mechanical manufacturing, an elliptical grinding wheel is adopted in a point contact grinding mode, the grinding wheel is always attached to the output shaft in a single-point mode, a grinding area is open, cooling liquid chip flushing and flexible magnetic suction chip collecting are matched, surface scratching and galling caused by winding and rolling of grinding chips are avoided, the surface quality of a workpiece is greatly improved, and the grinding efficiency is improved. The oval grinding wheel can swing along with the grinding depth, continuously-changing point contact is formed, and single-point grinding force and thermal stress concentration are reduced.

The polishing device comprises a base, a two-dimensional driving mechanism is installed above the base through a support and drives a vertical electric cylinder to move forwards, backwards, leftwards and rightwards, a pressure sensor is installed at the lower end of a telescopic shaft of the vertical electric cylinder, and the two-dimensional driving mechanism drives the vertical electric cylinder to move forwards, backwards, leftwards and rightwards. A mounting plate is mounted at the bottom of the pressure sensor, and a detachable composite buffering polishing head is mounted at the bottom of the mounting plate. Mixed liquid nozzles are mounted on the left side and the right side of the composite buffer polishing head; according to the polishing device for manufacturing the ultrathin single crystal diamond substrate, chemical and mechanical cooperative polishing and flexible buffering compensation are achieved, a rectangular hole of the mounting frame allows the polishing head to move slightly, local stress concentration is eliminated, polishing uniformity is improved, the green manufacturing characteristic is achieved, modular maintenance is achieved, the detachable composite buffering polishing head and a bolt are designed to be replaced quickly, and maintenance is convenient.

A new polishing tool comprises: a main support member; a polishing head support member; a first drive mechanism; and a second drive mechanism. The polishing head support member is coupled to the main support member such that the polishing head support member is linearly movable relative to the main support member in a first direction and a second direction that is different to the first direction. The first and second directions may be mutually orthogonal. The first drive mechanism is operable to move the polishing head support member relative to the main support member in the first direction. The second drive mechanism operable to move the polishing head support member relative to the main support member in the second direction. The new polishing head uses linear actuators rather than a rotary motor and, as a result, is advantageous over known polishing tools.

This invention relates to the field of automotive pipe processing technology, and discloses a port grinding device for automotive top tubes, including a base plate, a main body plate fixedly connected to the top of the base plate, and a grinding mechanism on the main body plate. Through the design of the grinding mechanism, a new grinding rod is inserted into a socket on the outside of one of the conveyor belts for backup. In use, the grinding rod is mounted at the bottom of the mounting rod. After the grinding rod rotates, it can evenly grind the outside of the pipe port or the inside of the insertion port, thus grinding both the inner and outer sides of the pipe. When it is necessary to replace the grinding rod, the old grinding rod is inserted into a socket on the remaining conveyor belt, and the mounting rod is controlled to swing and align with the side of the socket storing the new grinding rod before insertion. This quickly achieves the docking and installation of the mounting rod and the grinding rod, thus completing the replacement quickly. Compared with manual replacement, this method is more labor-saving and convenient, and helps to ensure grinding efficiency and quality.

The utility model discloses a double-grinding-wheel grinding head connecting structure which aims to overcome the defect that when a linear guide rail is ground, grinding wheels need to be trimmed in the process of switching from coarse grinding to fine grinding, and working efficiency is affected. The device comprises a rotating head and a grinding head, the grinding head is arranged on the rotating head, a coarse grinding wheel and a fine grinding wheel are arranged on the grinding head to form a double-grinding-wheel structure, the coarse grinding wheel and the fine grinding wheel are axially arranged at intervals, and grinding surfaces are arranged on the outer edges of the coarse grinding wheel and the fine grinding wheel. According to the double-grinding-wheel grinding head connecting structure, the coarse grinding wheel and the fine grinding wheel are arranged on the grinding head, in the grinding process of the linear guide rail, the grinding wheels can be directly switched when coarse grinding is switched to fine grinding, the grinding wheels do not need to be trimmed, and the working efficiency is improved.

The application discloses an automatic replacement device and method for end face grinding combined grinding head grinding wheel pieces, wherein the bottom of the grinding head is circularly distributed with a plurality of grinding wheel fixing blocks; a wedge-shaped groove is formed in the grinding wheel fixing block, and the wedge-shaped grooves in the bottom of the grinding head all extend along the radial direction of the grinding head; a wedge-shaped boss is connected to the grinding wheel piece, and the wedge-shaped boss is inserted and matched with the wedge-shaped groove; the tool magazine mechanism is spaced apart from the grinding head, the tool magazine mechanism comprises a rotatable grinding wheel disc, a plurality of grinding wheel fixing blocks are circularly distributed on the grinding wheel disc, the wedge-shaped grooves on the grinding wheel disc all extend along the radial direction of the grinding wheel disc, and a plurality of grinding wheel pieces are stored in the tool magazine mechanism through the plurality of grinding wheel fixing blocks; the moving mechanism comprises a guide rail, a tool changing mechanism is movably installed on the guide rail, and a plurality of clamping assemblies rotatable are arranged in the tool changing mechanism. The grinding head and the tool magazine mechanism in the application adopt the cooperation of the wedge-shaped groove and the wedge-shaped boss to store and place the grinding wheel pieces, so that the grinding wheel pieces can be conveniently replaced through the cooperation of the tool changing mechanism and the moving mechanism.

The utility model discloses a metal surface burr treatment device, which belongs to the technical field of metal surface processing, and comprises a groove frame, a conveying mechanism body is fixedly connected in the groove frame, a shell is fixedly connected to the top of the groove frame, through grooves are formed in two sides of the shell, two fixing blocks are fixedly connected to two sides of the groove frame, and the fixing blocks are fixedly connected to the two sides of the groove frame. Every two fixing blocks form one set, and electric push rods are arranged on the two sets of fixing blocks in a penetrating mode. Through the combined action of a conveying mechanism body, a limiting cylinder, a driving motor and a grinding roller, the effect of overall grinding and deburring of the surface of a metal plate can be completed in the metal plate conveying process, the metal plate burr treatment efficiency is improved, through the combined action of a first movable plate, a second movable plate, a stud, a cross-shaped groove hole and a cross-shaped inserting block, the metal plate can be conveniently conveyed, and the metal plate burr treatment efficiency is improved. And the grinding roller is fixed in a clamping and clamping mode, so that the fixing structure is simple, and the grinding roller is convenient to disassemble and replace.

The present application relates to a ceramic tile polishing head and a production device thereof. The ceramic tile polishing head comprises a polishing head, the polishing head comprising a polishing base and a polishing body; the polishing base is made of metal and is disc-shaped, and the polishing base is provided with a center hole coaxial with the center line of the disc-shaped polishing base; the polishing body is made of metal powder and is cuboid, the cross section of the cuboid is square, and the thickness of the polishing body is smaller than the width of the polishing body; the manufacturing method of the polishing head is as follows: after the bottom end surface of the polishing body and / or the top end of the polishing base is smeared with silver brazing agent; the polishing body is uniformly distributed around the axis of the polishing base along the edge of the polishing base, so that the thickness direction of the polishing body points to the axis of the polishing base; the edge of the polishing base is heated to a range of 610 to 640 DEG C through induction heating, so that the polishing body is welded and fixed with the polishing base. The present application can improve the production efficiency and reduce the cost.

Provided in the present invention are a polishing device and a polishing apparatus for removing a film from the surface of a substrate. The polishing device comprises: a polishing table configured to hold and rotate the substrate; and a polishing head provided with a polishing pad for coming into contact with and being pressed against the substrate to polish the film on the surface of the substrate, the area of the polishing pad being less than or equal to the area of the substrate. The substrate is divided into at least two regions in a circumferential direction based on the thickness distribution of the film on the surface of the substrate. The at least two regions include a first region and a second region. During the process of polishing the surface of the substrate, the substrate keeps rotating, and the polishing head is configured to polish the first region at a first polishing rate and polish the second region at a second polishing rate, the first polishing rate being different from the second polishing rate. In the present application, the polishing device controls the polishing rate on the basis of the local position of the polishing head on the surface of the substrate, thereby precisely controlling the profile of the film on the entire surface of the substrate.

The invention relates to a niobium alloy surface treatment device which comprises a bottom frame. The two polishing mechanisms are arranged on the bottom frame and are perpendicular to each other; the turn-over mechanism is arranged between the two polishing mechanisms; the polishing mechanism comprises a supporting panel fixed to the top of the bottom frame, and a long groove is formed in the plate face of the supporting panel in the blank advancing direction. The polishing wheel set is arranged above the supporting panel and is used for polishing the top surface of the blank; the left side baffle and the right side baffle are arranged on the two sides of the bottom frame and used for guiding and polishing the two side faces of the blank; the feeding mechanism is used for driving the blank to advance on the supporting panel; according to the device, polishing treatment of the six surfaces of the niobium alloy plate can be automatically completed in the one-time clamping process, the risk of time waste and surface scratching caused by multiple times of turning over and positioning is fundamentally eliminated, and the machining efficiency and the product consistency are greatly improved.

The invention provides a wafer thinning device and a wafer thinning method. The wafer thinning equipment comprises a grinding wheel for wafer thinning, the grinding wheel is provided with a grinding wheel base body made of a metal composite sheet, the metal composite sheet is formed by alternately overlapping a first metal material layer and a second metal material layer, the sum of the number of the first metal material layer and the number of the second metal material layer is an odd number, and the adjacent first metal material layer and the adjacent second metal material layer are connected in a metallurgical bonding mode. The top surface and the bottom surface which are oppositely arranged in the metal composite sheet serve as the top surface and the bottom surface of the grinding wheel base body; the first metal material layer is made of an alloy material or a metal material of which the CTE does not exceed 10 ppm / DEG C and the heat conductivity coefficient is not lower than 130 W / m.K; and the second metal material layer is made of an iron-nickel-based alloy material with CTE not exceeding 6.0 ppm / DEG C. According to the wafer thinning equipment, the thermal expansion matching performance of the grinding wheel base body and the silicon wafer and the stability of the thinned TSV structure in the wafer thinning process can be improved, and high precision and low damage of 3D IC thinning are achieved.

The invention relates to the technical field of workpiece polishing and grinding, and discloses a plate-shaped workpiece surface polishing and grinding device which comprises a support, the bottom end of the support is fixedly connected with a bottom plate, one side of the top end of the bottom plate is rotatably connected with a first polishing roller, and the other side of the top end of the bottom plate is slidably connected with a sliding plate. The top end of the sliding plate is rotationally connected with a second polishing roller, a push-pull plate is fixedly arranged on one side of the top end of the sliding plate, and two air cylinders for driving the push-pull plate to horizontally move are fixedly installed on one side of the support. The first polishing roller and the second polishing roller are driven through the driving assembly, the first polishing roller and the second polishing roller can conduct double-face polishing and grinding on a plate-shaped workpiece, the machining efficiency of the plate-shaped workpiece is improved, in the polishing process, the first polishing roller and the second polishing roller can support and limit the two sides of the plate-shaped workpiece, and the supporting assembly can support the bottom end of the plate-shaped workpiece; and the stability of the plate-shaped workpiece can be kept.

The present application belongs to the field of precision grinding, and discloses a wafer grinding method, which can obtain extremely high wafer surface quality and maintain extremely high wafer grinding efficiency without changing the grinding platform. The wafer is placed on a rotating predetermined grinding surface, a grinding liquid film is injected between the predetermined grinding surface and the wafer, the wafer and the predetermined grinding surface are separated by the grinding liquid film, and the two are made to rotate relatively. A concave mirror surface recessed towards the predetermined grinding surface is arranged directly below the predetermined grinding surface, and an upwardly emitting laser beam is arranged directly below the concave mirror surface, the laser beam is diffused through the concave mirror surface to form an auxiliary heating light spot covering the grinding liquid film, so that the auxiliary heating light spot heats the grinding liquid film, and the predetermined grinding surface grinds the wafer. The present application also discloses a wafer grinding device for implementing the above grinding method, and the device has a simple structure.

The application provides a polishing robot intelligent polishing head with rigid-flexible coupling structure and a wall surface detection method, which is composed of a base, a distance sensor fixing seat, a pressure sensor one fixing seat, a pressure sensor one, a motor fixing seat, a motor, a motor output shaft connecting sheet, a damping compression spring, a polishing sheet, a damping force measuring unit and a distance sensor, the damping force measuring unit is composed of a compression spring group, a compression spring slide, a connecting plate, a sensor fixing seat, a connecting bolt, a pressure sensor array and a universal wheel, the distance sensor fixing seat and the pressure sensor one fixing seat are fixed on the base in sequence, the bottom of the pressure sensor one is fixed on the pressure sensor one fixing seat, the motor fixing seat is fixed on the top of the pressure sensor one, the bottom of the motor is fixed on the motor fixing seat, the motor output shaft connecting sheet is fixed on the motor output shaft, the bottom end of the damping compression spring is fixed on the motor output shaft connecting sheet, and the top end is fixed on the polishing sheet. The polishing head can measure the distance and the force to realize intelligent polishing of a large plane.

The application relates to the technical field of integrated circuit manufacturing, and discloses wafer thinning equipment and a thinning method. The wafer thinning equipment comprises a grinding device and an adsorption platform. The adsorption platform is used for supporting a wafer and driving the wafer to rotate. The grinding device is arranged above the adsorption platform in a lifting mode. The lower part of the grinding device is provided with a grinding wheel used for grinding the wafer. The grinding wheel comprises a base material and a plurality of grinding blocks. The grinding blocks are fixed to the base material through an adhesive layer. The grinding blocks comprise a gel ceramic combination body which has a staggered spiral stacking structure and is used for dispersing stress during grinding. The raw material of the gel ceramic combination body is a ceramic gel bonding agent which comprises calcium carbonate / calcium phosphate composite gel and chitin nanocrystals. The above technical scheme solves the problems of large total thickness deviation of the thinned wafer and easy formation of a subsurface damage layer in the related art.

The invention relates to an end effector for attaching to a robotic or positioning device. The end effector comprises a first end effector sub-section having a fastener configured to be fastened to the robotic or positioning device. Furthermore, the end effector comprises at least one first pivot bearing, which is attached to the first end effector sub-section, and a second end effector sub-section, which is connected to the first end effector sub-section via the at least one first pivot bearing such that the second end effector sub-section can be pivoted relative to the first end effector sub-section about a first axis of rotation. The second end effector sub-section has a tool holder and a tool held by the tool holder, wherein the tool is designed to machine a surface of a workpiece. The at least one first pivot bearing is designed such that, when the end effector is placed on a workpiece, the first axis of rotation extends at the workpiece surface or on the side of the workpiece surface facing the workpiece at a distance of less than (10) mm from the workpiece surface or extends on the side of the workpiece surface facing away from the workpiece at a distance of less than (50) mm from the workpiece surface, in each case as viewed in the normal direction to the workpiece surface.

The invention relates to a high-precision grinding mechanism, which relates to the technical field of metal cutting machine tools, and comprises an upper and lower grinding wheel movement and tray planar movement combined mechanism. By creating an automatic grinding wheel plane grinding technology, the abrasion uniformity of the grinding wheel is greatly improved, the cost of the grinding wheel is remarkably saved, the high precision of the grinding wheel plane is kept for a long time, and the grinding flatness precision, the free height precision and the perpendicularity precision stability are greatly improved.

The abrasive assembly (1) for the surface machining of ceramic and / or stone artifacts, comprisese: - a supporting body (2) associable with a rotating head (30) of a machine tool and configured to rotate around a relevant axis of work (X), wherein the supporting body (2) defines a perimeter surface (3) substantially parallel to said axis of work (X) and on which is obtained a plurality of seats (4) arranged radially with respect to the axis of work (X), each of the seats (4) defining a relevant base wall (14) which develops parallel to the axis of work (X); - a plurality of abrasive tools (8) each of which is inserted within one of the seats (4) in a removable manner; wherein the coupling between the abrasive tools (8) and the seats (4) is of the interlocking type, wherein the seats (4) are of the through type and have at least one set of containment walls (9, 10, 19) contiguous to each other, of which at least one lateral containment wall (9, 19) develops perpendicular to the base wall (14) and at least one upper containment wall (10) arranged facing and parallel to the base wall (14), and wherein the abrasive tools (8) have at least one coupling portion (11) insertable by interlocking within said seat (4), the coupling portion (11) defining at least one abutment surface (12) adapted to interact with the upper containment wall (10), the latter being adapted to prevent the abrasive tool (8) from escaping from the seat (4) along a direction perpendicular to the axis of work (X).