482results about "Grinding heads" patented technology

The invention relates to the technical field of grinding machines, and discloses a surface grinding machine which comprises a rotary type grinding mechanism and a linkage type pressure applying mechanism. A hollow rotating column which can rotate along with the second butt-joint plate and is in a hollow state, a fifth butt-joint plate which can axially move along the hollow rotating column and rotate along with the hollow rotating column, and a spiral spring which generates downward elastic pressure on the fifth butt-joint plate are arranged in the second butt-joint plate. According to the surface grinding machine, the basic circular motion type grinding effect of the plane grinding disc on the surface of an object is utilized, and the relative motion of the built-in grinding block around the petal-shaped closed sliding groove is combined, so that the grinding block can generate radial reciprocating motion relative to the rotating axis on the surface of the object, and the grinding efficiency of the object is improved; the two kinds of grinding movement are from the same driving motor, and therefore the effective utilization rate of the driving motor can be effectively increased.

The invention belongs to the technical field of semiconductor device manufacturing and processing, and particularly relates to semiconductor device manufacturing processing equipment which comprises a base and a mechanical arm fixedly arranged at the top of the base, a dust removal mechanism is fixedly arranged at one end of the mechanical arm, and a wafer polishing mechanism is fixedly arranged at the bottom end of the dust removal mechanism. A pneumatic lifting mechanism is fixedly arranged at the top of the base, when a wafer clamped by the wafer clamping mechanism needs to be turned over, the clamping air bag is inflated through the air nozzle, the wafer is clamped through the clamping air bag, then a valve on the air outlet is closed, at the moment, the air pressure in the hollow stand column can be continuously increased, and the wafer can be turned over. The piston assembly in the pneumatic lifting mechanism is pushed by air pressure to be jacked upwards, the ejector rod can be synchronously driven to ascend when the piston assembly is jacked upwards, the wafer clamping mechanism can be jacked up synchronously through the ejector rod, a wafer needing to be polished can be turned over conveniently, and the back face of the wafer can be polished conveniently.

A robotic system for modifying a surface is presented. The system includes a motive robot arm with an arm movement mechanism. The system also includes a tool coupled to the arm movement mechanism. The tool is configured to removably couple to an article configured to contact the surface. The system also includes a first actuator that causes the arm movement mechanism to move the tool into a pickup position with respect to the article. The system also includes a second actuator that causes a shearing motion, during an article attachment step, between the article and the tool. The coupling between the article and the tool comprises a hook and loop system.

The invention relates to the technical field of flange welding, in particular to a flange production welding device and method.The flange production welding device comprises a welding device body and a supporting platform distributed around the welding device body, the supporting platform is horizontally arranged, and a driving assembly for driving an arc-shaped plate to move is arranged on the supporting platform; a supporting assembly is arranged between every two adjacent supporting platforms. In the moving process of the arc-shaped plate, the arc-shaped plate is in extrusion contact with the grinding assembly, the grinding effect is achieved, self-positioning can be assisted, the grinding assembly guides the end of the arc-shaped plate to move along a specific track, the arc-shaped plate is supported and guided from the inner side and the outer side in combination with the driving assembly and the extrusion adjusting assembly, and shaking or deviation is reduced; the end of the arc-shaped plate can be accurately aligned with the end of the adjacent arc-shaped plate, high-precision position guarantee is provided for follow-up welding operation, and the flange splicing quality and the production efficiency are improved.

The invention discloses a wall polishing device for placement house building construction, and belongs to the field of wall polishing devices.The wall polishing device comprises a base used for supporting the whole equipment, a lifting module, a polishing module and a dust removal module, and a moving assembly used for moving the equipment is arranged at the bottom of the base; the top of the base is connected with the grinding module through the lifting module, the grinding module comprises a sand disc used for grinding a wall, the lifting module is used for adjusting the height of the sand disc, and the dust removal mechanism is used for removing dust generated by grinding the wall. The wall polishing device has the effect of achieving efficient, accurate and low-dust wall polishing operation.

The invention discloses a steel structure butt welding adjusting device which comprises a supporting plate and supporting rods fixed to the four corners of the bottom of the supporting plate. A grinding part is arranged in the butt joint mechanism, in the butt joint process of the two steel structure bodies, the grinding part can make contact with the steel structure bodies along with continuous movement of a driving part, the grinding part comprises a coarse grinding plate, a fine grinding plate and a polishing plate, in the grinding process, a sliding plate slides on the top of a supporting plate along with a mounting plate driven by the driving part to move, and the grinding plate is in contact with the grinding part. The rough grinding plate firstly makes contact with the rotating steel structure main body and conducts comprehensive rough grinding on the end face of the steel structure main body through rotation of the steel structure main body, and due to the fact that a second gear at the bottom of a lead screw is meshed with a second rack at the bottom of a mounting shell, the lead screw can rotate, and therefore when a grinding piece moves to a certain degree, the grinding piece can rotate. And the rough grinding plate, the fine grinding plate and the polishing plate can sequentially treat the steel structure body and then move downwards into the second mounting frame.

A polishing device for silicon carbide wafers disclosed by the present invention relates to the technical field of wafer polishing, and includes a polishing mechanism. A matching mechanism is installed on the polishing mechanism. The polishing mechanism includes a box body. A sliding frame is reciprocally slidably installed on the box body. A matching slider is slidably installed on the sliding frame. An adsorption component is rotatably installed on the matching slider. Trigger rod 1 and trigger rod 2 are respectively located at both ends of the sliding frame. Trigger rod 1 and trigger rod 2 cooperate with the adsorption component. By setting the polishing mechanism in the present invention, the wafer is initially roughly polished and then finely polished, realizing automatic replacement of the polishing disc, with high linkage and improved work efficiency. At the same time, the automatic loading and unloading are realized through the matching mechanism, and the degree of automation is high.

The invention discloses an ultraviolet light-assisted chemical mechanical polishing device which comprises a polishing disc assembly, a polishing solution supply part, a carrying disc and an optical fiber, the first end of the optical fiber is connected with an ultraviolet light source, the second end of the optical fiber is rotationally connected with the carrying disc, and a light-transmitting substrate is arranged in the carrying disc and located below the second end of the optical fiber. The polishing method comprises the steps that S1, a workpiece is fixedly installed on the bottom face of the light-transmitting substrate; s2, the carrying disc is placed on a polishing disc assembly and clamped into a blocking arm, so that the carrying disc can be driven by friction force between the polishing disc assembly and the workpiece to rotate; s3, turning on the ultraviolet light source and adjusting the ultraviolet light irradiation range until the bottom surface of the light-transmitting substrate is completely illuminated; s4, the polishing disc assembly is started, and the polishing liquid supply part drips polishing liquid into the polishing disc assembly for current-stage polishing; and S5, after the surface roughness value of the workpiece reaches the upper limit of the current polishing stage, the polishing disc assembly and the polishing solution are replaced, and then the step S4 is executed till the surface roughness value of the workpiece reaches the target value.

The invention discloses an ultrasonic vibration auxiliary electrochemical mechanical thinning method and device for a large-diameter wafer, and belongs to the technical field of large-diameter semiconductor wafer thinning, and the device comprises a grinding system, an electrochemical system and an electrolyte circulating system. The grinding system comprises a micro-feeding unit, a main shaft rotating unit and an ultrasonic vibration unit, and the main shaft rotating unit and the ultrasonic vibration unit drive the cup-shaped grinding wheel to rotate and axially vibrate. The electrochemical system takes a cup-shaped grinding wheel as a cathode and a wafer as an anode, and an electrolyte is supplied between the cathode and the anode to generate electrochemical reaction. In the thinning process, the surface of the wafer is subjected to anodic oxidation modification to generate a modification layer easy to remove, meanwhile, the generated modification layer is removed by the grinding wheel, the grinding wheel with ultrasonic vibration facilitates chip removal and heat dissipation, circulation of electrolyte can be enhanced, and then the electrochemical modification effect is improved; the annular structure of the grinding wheel has better removal uniformity under the vibration condition, and efficient, high-precision and low-damage large-diameter wafer thinning can be achieved.

The utility model relates to the technical field of polishing devices, in particular to a rare earth permanent magnet material high-precision polishing device which comprises a machining base, an installation vertical plate is fixedly installed on the machining base, a workpiece to be polished is placed on the machining base, and a grinding and polishing mechanism for rapidly grinding the workpiece to be polished is arranged on the installation vertical plate. And a grinding auxiliary mechanism for limiting and clamping a workpiece to be polished is arranged on the machining base, the grinding and polishing mechanism comprises a rotary round seat movably mounted on the mounting vertical plate, driving assemblies are symmetrically mounted on the rotary round seat, and a first grinding head and a second grinding head are arranged on the two driving assemblies correspondingly. By arranging the grinding and polishing mechanism, the grinding head can be automatically and rapidly replaced in the grinding and polishing process through mutual cooperation between the rotary round seat and the driving motor, the rare earth permanent magnet material can be roughly ground and finely ground, the integration degree is high, and workers do not need to manually replace the grinding head.

The utility model relates to a superhard material guide rail machining device which comprises a lathe bed. The working table is arranged above the machine body; the two ends of the cross beam are arranged on the workbench through stand columns; the X-axis linear motor module is arranged on the cross beam; the Z-axis linear module is arranged on the X-axis linear motor module; the spindle box is arranged on the Z-axis linear module, an electric spindle is arranged in the spindle box, and a grinding tool or a polishing tool is installed on the electric spindle; the Y-axis linear motor module is arranged on the workbench; and the workpiece carrying plate is arranged above the Y-axis linear motor module. Through multi-axis linkage of the X-axis linear motor module, the Y-axis linear motor module and the Z-axis linear motor module, the long guide rail is pressurized and polished through a small tool, the grinding amount is controlled through the dwell time and the polishing pressure, and high-precision machining of the long guide rail is achieved.

The present invention relates to a combined process of ultra-precision grinding and photochemical mechanical polishing of laser crystal slices. The process comprises the following steps: using a coarse-grained grinding wheel for rough grinding to achieve rapid thinning and determine the depth of the subsurface damage layer, providing a reference for the grinding wheel feed rate in the fine grinding stage; using a fine-grained grinding wheel for fine grinding to remove the damage layer introduced in the rough grinding stage, and obtaining higher surface / subsurface quality and surface accuracy by optimizing process parameters; using aluminum oxide (Al2O3) abrasives to prepare a special polishing liquid for photochemical mechanical polishing, and performing semi-fine polishing on the laser crystal slices to quickly remove the surface damage caused in the grinding stage; using zirconium oxide (ZrO2) abrasives to prepare a special polishing liquid for photochemical mechanical polishing, and performing fine polishing on the laser crystal slices to further optimize the surface quality and surface accuracy; and using an ultrasonic cleaner to clean the laser crystal slices, with anhydrous ethanol as the cleaning agent. The present invention can simultaneously achieve high surface integrity and high-efficiency processing of laser crystal slices.

The invention relates to the technical field of stone grinding, and discloses a stone grinding machine with a grinding head convenient to replace, the stone grinding machine comprises a mounting plate I and a turnover mechanism, the mounting plate I is rotatably connected with a rotating shaft, the bottom of the rotating shaft is provided with a mounting disc, the top of the mounting disc is provided with a convex column, and the outer wall of the mounting disc is provided with a plurality of replacement ports at equal intervals; a rotating mechanism is arranged on the mounting disc, a plurality of pairs of first fixing plates are arranged on the rotating mechanism at equal intervals, a second fixing column is rotationally connected between each pair of first fixing plates through a torsional spring, an L-shaped overturning plate is rotationally connected to the outer wall of each second fixing column, and one end of each L-shaped overturning plate is semicircular; the other ends of the L-shaped overturning plates are fixedly connected with first fixing columns. The L-shaped overturning plates are arranged over all the replacement openings, the first grinding head or the second grinding head can be automatically replaced according to requirements, the situation of halting for disassembly and replacement in the past is completely eradicated, and the working efficiency is greatly improved.

The invention particularly relates to inner diameter grinding equipment for cylindrical aluminum alloy machining, and belongs to the technical field of inner diameter grinding equipment.The inner diameter grinding equipment comprises a fixed adjusting base, a stable mounting plate is designed at one end of the fixed adjusting base, a grinding driving part is mounted at the upper end of the stable mounting plate, and a diameter adjusting structure is fixedly mounted at the output end of the grinding driving part; an extending grinding piece is arranged at one end of the diameter adjusting structure, mirror image adjusting and controlling structures are evenly installed in the fixed adjusting base, stable clamping structures are designed at the two ends of each mirror image adjusting and controlling structure, the combined extending grinding piece is adopted, and based on a splicing sleeve and a guide rail sliding structure, the device can be rapidly matched with materials of different lengths; the extension unit is accurately locked through a positioning pin, the convenience and flexibility of multi-size grinding are remarkably improved, meanwhile, through an integrated stable clamping structure, the convenience, accuracy and stability of material installation are improved, and then the machining effect of the device on raw materials is improved.

The invention provides a method for judging the grinding track uniformity of a non-standard grinding tool of a floor machine based on a discrete coefficient, which comprises the following steps of: observing the morphological characteristics of abrasive particles on the surface of the non-standard grinding tool to obtain characterization parameters of the abrasive particles, and simulating the randomness of the quantity of the abrasive particles with different particle sizes on the surface of the abrasive material through a distribution theory to obtain the uniformity of the grinding track of the non-standard grinding tool. Calculating the number of abrasive particles with different particle sizes so as to establish an abrasive surface abrasive particle distribution model; according to a motion transmission structure of the floor machine, a grinding disc kinematics model is established, a grinding track equation of a grinding disc is deduced, and therefore a grinding track curve of all grinding particles is drawn; and grid division is carried out on the ground area, and the average value of the number of track points of a grid, the standard deviation of track uniformity and the discrete coefficient CV of the track uniformity are calculated so as to judge the uniformity of the track in the whole area. The method can be used for judging the uniformity of the grinding track of the non-standard grinding material, and a reasonable basis is provided for kinematics design of a grinding disc of a floor machine.

The invention discloses an automatic round hole grinding device for furniture manufacturing, and relates to the field of round hole wall grinding, the automatic round hole grinding device comprises a big-end-up circular truncated cone head, the circular truncated cone head is connected with a driving part through a shaft barrel, the driving part is used for driving the circular truncated cone head to lift and rotate, and the automatic round hole grinding device further comprises a plurality of grinding parts annularly distributed around the circular truncated cone head; a sliding groove which obliquely extends up and down is formed along the outer surface of the circular truncated cone head, the grinding piece is in sliding connection with the sliding groove, the grinding piece is provided with a lug plate which extends horizontally, and when the circular truncated cone head penetrates through the circular hole downwards, the lug plate abuts against the top of the circular hole, so that the grinding piece moves upwards along the sliding groove. And in the process, the grinding piece and the sliding groove move relatively to enable the grinding piece to move and expand, the outline of the frosted face is kept to be matched with the size of the round hole, the grinding size does not need to be manually adjusted, round holes of different sizes can be automatically matched and arranged, and the grinding machining efficiency is improved.

The present invention relates to the technical field of metal cutting, and particularly to a high-precision numerically controlled vertical grinding machine, which includes a column module, a bed module, and a grinding head module. The column module is connected to the bed module. A turntable is arranged on the bed, and a spindle box is slidably arranged on the column. A main shaft is arranged in the spindle box, and the main shaft is connected to the grinding head module. A topology repair module is also arranged in the spindle box; through the linkage design of the centering unit by the fixed seat, the centering plate, the pushing sub-unit, and the centering rod, it directly acts on the outer periphery of the main shaft to compensate the center deviation of the main shaft in real time; the pushing sub-unit is controlled by the control unit and can adjust the displacement of the centering plate according to the instruction output by the error repair model, so as to correct the radial offset of the main shaft caused by insufficient rigidity or assembly error; it solves the problems of large surface roughness and cumulative roundness error of the processed surface caused by vibration and center offset of the traditional grinding machine, and realizes high-precision deep hole processing.

The invention discloses a precise steel pipe welding seam processing device and method, and belongs to the technical field of welding seam polishing. The welding seam processing device comprises a base for fixing a steel pipe, a guide rail extending along a steel pipe welding seam is arranged on the base, a sliding seat is slidably mounted on the guide rail, and a turbine rack concentric with the steel pipe is slidably connected into the sliding seat in an arc shape; a first driving mechanism used for driving the worm to reciprocate is arranged at one end of the worm, a supporting block is fixed to the worm gear rack, a supporting rod is movably connected into the supporting block in a limiting mode, a grinding disc is fixed to the end, close to the steel pipe, of the supporting rod, and the supporting rod moves to the limiting position in the direction close to the steel pipe so that the grinding disc can be attached to the steel pipe; second driving mechanisms are fixed to the ends, away from the steel pipes, of the supporting rods. The sliding seat slides along the guide rail, so that a steel pipe welding seam is polished through reciprocating motion of the grinding disc, and poor stability and cost increase caused by reciprocating rotation of the steel pipe are avoided.

The invention relates to the technical field of integrated circuit manufacturing, and provides wafer thinning equipment and a wafer thinning method. The wafer thinning equipment comprises a grinding device and an adsorption platform, the adsorption platform is used for bearing a wafer and driving the wafer to rotate, the grinding device is arranged above the adsorption platform in a lifting mode, and a grinding wheel used for grinding the wafer is arranged on the lower portion of the grinding device. The grinding wheel comprises a base material and a plurality of grinding blocks, and the grinding blocks are fixed to the base material through adhesive layers. The grinding block comprises spiral calcium carbonate containing a Si-O-Ca structure and is used for dispersing stress during grinding. According to the technical scheme, the problem that the flatness of the thinned wafer is poor in the prior art is solved.

A method for abrading comprises: providing an abrasive article (ART1), which comprises a machine-readable code (QR1), selecting a target result (RM1,T), retrieving a performance model (MODEL31,GEN1, MODEL41,GEN1) from a database (DBM) based on the code (QR1), determining one or more usage parameters (GM1,GEN1) from the target result (RM1,T) by using the performance model (MODEL31,GEN1, MODEL41,GEN1), and abrading with the first abrasive article (ART1) according to the determined usage parameters (GM1,GEN1)

The utility model relates to the technical field of building construction, in particular to a building terrace polishing construction dust removal device which comprises an installation shell, a polishing disc is movably installed at the bottom of an inner cavity of the installation shell, a water spraying transmission assembly is installed at the top of the installation shell, and the water spraying transmission assembly comprises a water pump. A first branch pipe and a second branch pipe are mounted at the water outlet end of the water pump, detachable dust falling assemblies are mounted on the left side and the right side of the top of the mounting shell, each detachable dust falling assembly comprises a mounting base and a hollow sleeve, and a positioning rod is fixedly connected to one side of each mounting base. Through the arrangement of the detachable dust falling assembly, the dust falling device has the advantage of flexible dust falling, the perforated plate with the proper aperture can be selected according to the scrap splashing range during floor polishing construction, the perforated plate is moved upwards to be placed in the conveying frame, the perforated plate is supported and installed through the check block, and in the state, under the working state of the water pump, the dust falling efficiency is greatly improved. And the water flow can be sprayed out from the porous plate.

The invention discloses seamless steel tube inner hole coping equipment, which belongs to the technical field of seamless steel tube coping, and structurally comprises a frame and a sliding table, the frame can extend into a seamless steel tube, a guide part is used for controlling the frame to move along the axis direction of the seamless steel tube, a plurality of cross rods are arranged in the middle of the frame, and the sliding table is connected with the plurality of cross rods. A guide cylinder is connected to the sliding table, a disc seat is rotatably mounted on the inner side of the guide cylinder, a plurality of polishing strips are slidably mounted on the outer side of the guide cylinder, the polishing strips are integrally arc-shaped, and the outer side surfaces of the polishing strips abut against the inner wall of the seamless steel pipe in a surface contact manner; the polishing device can extend into the seamless steel pipe with the small inner diameter size, efficient polishing operation of the whole circumferential area of the inner wall of the seamless steel pipe is achieved through circumferential synchronous operation of the multiple polishing heads, on the basis, secondary scratching during polishing operation is avoided through self-cleaning treatment of the outer surfaces of the polishing heads, and the use stability is good.

The utility model discloses a high-speed photovoltaic glass edging machine, which relates to the technical field of photovoltaic glass processing equipment, and comprises a processing table, two sides of the processing table are respectively and fixedly provided with a polishing mechanism, one side of each polishing mechanism is provided with a feeding mechanism, the middle part of the processing table is fixedly provided with an adsorption mechanism, and the adsorption mechanism is provided with a feeding mechanism. The adsorption mechanism comprises a sliding rail, a sliding table, a mounting table, a first mounting frame and a vacuum adsorption assembly, and the sliding rail is fixedly mounted in the middle of the machining table. According to the photovoltaic glass polishing device, a vacuum suction cup in the vacuum adsorption assembly is attached to one side of the photovoltaic glass, a pump machine pumps out air at the contact point position of the vacuum suction cup and the photovoltaic glass, when the polishing mechanism polishes the edge of the photovoltaic glass, the photovoltaic glass is stably adsorbed to the upper portion of the first mounting frame, shaking and deviation cannot occur, and the polishing efficiency is improved. The grinding wheel grinding head can accurately and stably grind the edge of the photovoltaic glass, and the edge machining precision and quality are ensured.

The application provides a mechanical manufacturing output shaft surface grinding device, and relates to the grinding field. The mechanical manufacturing output shaft surface grinding device comprises a rack, a clamping and rotating mechanism for clamping and driving the rotation of an output shaft, a grinding wheel for grinding the surface of the output shaft, an elliptical profile of the grinding wheel enables the grinding wheel to form a point contact with the surface of the output shaft, a fixing frame fixed relative to the rack, and a connecting piece rotatably installed on the fixing frame. The mechanical manufacturing output shaft surface grinding device adopts an elliptical grinding wheel to realize a point contact grinding mode, so that the grinding wheel is always single-point attached to the output shaft, the grinding area is open, and the grinding dust is removed by cooperating with the cooling liquid and the flexible magnetic dust collection device, thereby avoiding the surface scratches and the pulling caused by the grinding dust being rolled into and crushed, greatly improving the surface quality of the workpiece, and the elliptical grinding wheel can swing with the grinding depth to form a continuously changing point contact, thereby reducing the single-point grinding force and the thermal stress concentration.

This invention relates to the technical field of granite workpiece processing, and in particular to a granite workpiece grinding device and method. The device includes a frame, a gantry frame mounted on the frame via a traveling mechanism, a lifting mechanism mounted on the gantry frame, a sliding mechanism mounted on the lifting mechanism, and a grinding mechanism mounted on the sliding mechanism via a mounting mechanism. The grinding mechanism includes a granite grinding plate, a handle mounted on the granite grinding plate, and multiple diamond-shaped grooves formed on the end face of the granite grinding plate away from the handle. This invention achieves high surface grinding precision and efficiency for granite workpieces.

The utility model discloses a quick-change polishing head, which comprises a polishing seat and a polishing tool, the polishing seat comprises a seat body and a rod body connected to the back surface of the seat body, the front surface of the seat body is recessed inwards to form a positioning cavity, a hook surface body of a magic tape is arranged in the positioning cavity, the polishing tool comprises a buffer pad and abrasive paper, and the buffer pad is arranged on the rod body. A rough surface body of a hook-and-loop fastener is arranged on the upper face of the buffer pad, the buffer pad is positioned in the positioning cavity through the attachment of the rough surface body and the hook surface body, the grinding tool is quickly and accurately adhered to the grinding seat through the positioning of the positioning cavity, and during grinding, the grinding tool is limited through the positioning cavity, so that the grinding tool is prevented from being damaged. The condition that the grinding tool shakes or falls off in the grinding process is prevented, and then the grinding stability and safety are improved; meanwhile, the abrasive paper covers the lower surface and the peripheral surface of the buffer pad, so that the tool can polish the plane and the side surface of the workpiece at the same time, and the application range is greatly expanded; in addition, the grinding tool is quickly connected and detached with the grinding seat through the hook-and-loop fastener, so that the grinding tool is conveniently and quickly replaced, and the working efficiency is effectively improved.

To provide a polishing machine which can perform polishing to a needed portion of a workpiece to attain highly accurate flatness regardless of the worker's skill level.SOLUTION: A polishing machine includes: a motor provided within a main part 10; a polishing part 40 which is rotated by a motor to polish a surface of a workpiece; and a universal joint 24 and a ball joint 30 which transmit rotation of the motor to the polishing part 40. The universal joint 24 and the ball joint 30 transmit rotation of the motor to the polishing part 40, regardless of an inclination of a rotation axis of the motor relative to a rotation axis of the polishing part 40.SELECTED DRAWING: Figure 3

The disclosed subject matter relates to a polishing head for pressing a polishing tool against a substrate, such as a wafer. Further, the disclosed subject matter relates to a polishing apparatus for polishing a substrate with such a polishing head. A polishing head includes an annular elastic member configured to press a polishing tool against the substrate, and a pressing-tool body having a pressing surface configured to press the polishing tool against the substrate via the elastic member, wherein the pressing surface has a first fitting groove in which a first portion of the elastic member fits, the first portion (41) protrudes from the pressing surface, the elastic member is put on the pressing-tool body (43) with the elastic member elastically deformed, and the polishing head is configured to press the polishing tool against the substrate by the first portion.

The invention belongs to the technical field of glass polishing, and particularly relates to a glass ceramic continuous polishing machine which comprises a positioning mechanism, a polishing mechanism and a polishing mechanism. The lifting mechanism is fixed at the top of the positioning mechanism; the polishing mechanism is fixed to the top of the lifting mechanism; the positioning mechanism comprises a lower plate and lower frames, and the lower plate is fixed to the ends of the multiple lower frames. The first driving part is fixed to the top of the lower plate; and the protective cylinder is fixed in the middle of the plurality of lower frames. The planetary gear is composed of the inner gear ring, the pinions and the center gear, the pinions and the supporting disc are fixed and cannot horizontally revolve, the rotating direction of the inner gear ring is opposite to the rotating direction of the synchronous cylinder, the rotating directions of the front polishing plate and the back polishing plate are opposite, the front polishing plate and the back polishing plate rub glass ceramics in two directions, and the polishing effect is improved. Glass ceramics can be polished by rotating in two directions, and the polishing effect is good.

The invention provides an output shaft surface grinding device for mechanical manufacturing, and relates to the field of grinding. The output shaft surface grinding device for mechanical manufacturing comprises a machine frame and a clamping and rotating mechanism used for clamping and driving an output shaft to rotate, and further comprises a grinding wheel used for grinding the surface of the output shaft, a fixing frame fixed relative to the machine frame, and a clamping and rotating mechanism used for clamping and driving the clamping and rotating mechanism to rotate, the connecting piece is rotationally mounted on the fixing frame; according to the output shaft surface grinding device for mechanical manufacturing, an elliptical grinding wheel is adopted in a point contact grinding mode, the grinding wheel is always attached to the output shaft in a single-point mode, a grinding area is open, cooling liquid chip flushing and flexible magnetic suction chip collecting are matched, surface scratching and galling caused by winding and rolling of grinding chips are avoided, the surface quality of a workpiece is greatly improved, and the grinding efficiency is improved. The oval grinding wheel can swing along with the grinding depth, continuously-changing point contact is formed, and single-point grinding force and thermal stress concentration are reduced.