1387results about "Grinding heads" patented technology

The invention provides an LED package and a backlight device incorporating the LED lens. The LED package has a bottom surface and a light exiting surface cylindrically extended around a central axis of the package from the bottom surface. Also, a reflecting surface is positioned on an opposite side of the bottom surface and symmetrical around the central axis such that light incident from the bottom surface is reflected toward the light exiting surface. Further, a scattering area is formed on the reflecting surface. According to the invention, by applying scattering materials on the reflecting surface of the LED package, a reflecting paper does not need to be attached, thereby simplifying a process and reducing the manufacture time and cost.

This invention provides polishing pad tiles which, by virtue of their geometry and surface features, can be arranged to form mosaic pads having channels at the seams which facilitate the flow of polishing fluid during polishing of a workpiece.

A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a polishing pad composition comprising a high modulus phase component and a low modulus phase component. The multi-phase polishing pads are very efficient and effective in providing high performance polishing along an entire polishing surface interface.

A grinding wheel has a disc having a connection hole formed at a center thereof, to which a rotation axis of a grinder is connected, and a plurality of abrasive segments detachably connected to a surface of the disc. A plurality of fixing recesses are radially formed on the surface of the disc at an interval and fixing protrusions having a shape corresponding to the fixing recess are formed on bottom surfaces of the abrasive segments, so that the abrasive segments are connected to the disc by inserting the fixing protrusions into the fixing recesses. According to the grinding wheel, when the abrasive segment is worn away or inferior as it is used for a long time, it has only to replace the corresponding abrasive segment only. Accordingly, an economical efficiency is high.

A grinding machine abrasive unit holder with the use of springs, gases or fluids allows each abrasive unit to be in contact with the floor, independently at all times. This action allows the finishing of the high and low spots of the floor in the same operation.

To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding device in which the load of the fastening plate 6 also is a load on the grindstone 14 that does the grinding, there is little deflection in the thickness distribution of the substrates that are obtained, even if they are semiconductor substrates having a large substrate diameter of 450 mm.

Polishing pads are provided having a polishing surface formed from a hydrophilic material. The polishing surface has a topography produced by a thermoforming process. The topography consists of large and small features that facilitate the flow of polishing fluid and facilitate smoothing and planarizing.

A manipulator includes a controlling seat, a robot arm assembly and a polishing mechanism. The robot arm assembly is rotatably connected to the controlling seat; and the polishing mechanism is mounted on the robot arm assembly. The polishing mechanism includes a housing with a first mounting portion and a second mounting portion, a pair of magnetic valves mounted in the housing and electrically connected to the controlling seat, a first polishing assembly partially received in the first mounting portion, and a second polishing assembly partially received in the second mounting portion. The first polishing assembly and the second polishing assembly define an angle therebetween and are respectively connected to the pair of magnetic valves, such that the pair of magnetic valves controls the first and the second polishing assembly respectively to polish one or more workpiece. The present invention further discloses a polishing mechanism of the manipulator.

Disclosed is an improvement in a grinding machine comprising at least a turn table, rotary chuck tables for holding work pieces to be machined, a first grinding means for grinding the work piece held on the chuck table and a second grinding means for grinding the first-ground work piece held on the chuck table. The first grinding means comprises at least a first grinding wheel having pieces of grindstone set so as to define together a first grinding plane, and a first spindle fixed to the first grinding wheel. Likewise, the second grinding means comprises a second grinding wheel having pieces of grindstone set so as to define together a second grinding plane and a second spindle fixed to the second grinding wheel. The first and second grinding means are so arranged that the first angle formed between the linear line connecting from the center of rotation of the turn table to the center of rotation of a selected chuck table and the linear line connecting from the center of rotation of the selected chuck table to the center of rotation of the first spindle is equal to the second angle formed between the linear line connecting from the center of rotation of the turn table to the center of rotation of the selected chuck table and the linear line connecting from the center of rotation of the selected chuck table to the center of rotation of the second spindle. This arrangement assures that all finished work pieces have on and same thickness.

This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrofoil polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

A spindle assembly for force controlled operation in applications such as the chemical mechanical planarization of semiconductor wafers includes an axially and rotatably movable spindle driven by a force producing device. The force producing device is controlled by a position feedback loop in a first mode of operation and a spindle force control feedback loop in a second mode of operation so that the same force producing device controls spindle movement in the first mode of operation and maintains a constant pressure on a workpiece based on the detected applied pressure in the second mode of operation.

The present invention discloses a high-efficiency, stable polishing and grinding device, the transmission system and the lubricating system of which are characterized by simplicity, reliability, convenient maintenance and low failure rate. The polishing and grinding device is composed of a turnplate-revolving mechanism, a turnplate-lifting mechanism and multiple groups of high-speed rotating grinding mechanisms mounted on a turnplate; wherein, each high-speed rotating grinding mechanism is composed of a roller type grinding head, a grinding head motor and driving mechanisms thereof; the roller type grinding head is mounted on the lower side of the turnplate; the grinding head motor is mounted on the upper side of the turnplate; through a group of driving mechanisms, the grinding head motor drives the roller type grinding head to rotate at a high speed. The polishing and grinding device is mainly applied to the polishing and grinding of the surfaces of flat building materials such as polished ceramic tiles and stones.

A method and apparatus for finishing cured concrete floors using a riding trowel to which large diameter pans are rotationally secured, the pans having abraders releasably secured to their undersides. The individual abraders are preferably individually removably secured to the pans by hook-and-loop fasteners, wherein the fasteners are selectively disposed on the flat bottom surfaces of the pans or within shallow depressions in the bottom surfaces of the pans. The riding trowel further comprises a vacuum system in fluid communication with a contained space formed by a shroud having a rigid upper portion and a flexible lower portion where it contacts the finished cured concrete floor surface.

A system, apparatus and method capable of grinding and polishing fabricated vertical surfaces of varying shapes and sizes without the use of hand tools. The system comprises a frame which can be affixed to the surface and which supports a grinding and polishing apparatus. The grinding and polishing apparatus uses air pressure to force a rotating grinding or polishing disc against the surface being worked on. The frame is designed so that the grinding and polishing apparatus can be moved (via, e.g., tracking) both vertically and horizontally to any desired point within the frame. The grinding and polishing apparatus optionally includes a water nozzle and vacuum system to spray and recapture water used to cool the surface being operated on.

A surface grinding machine generally consisting of a drive means provided with an output shaft; a planetary disk mounted on the shaft; and at least two grinding head units mounted on the planetary disk, each including a housing mounted on the planetary disk, a shaft having a flange portion, journaled in the unit housing, resilient means interposed between the housing and the flange portion of the unit shaft and a disk provided with a grit surface disposed on an outer side of the flange, portion of the unit shaft.