202results about "Grinding heads" patented technology

The invention discloses a steel structure butt welding adjusting device which comprises a supporting plate and supporting rods fixed to the four corners of the bottom of the supporting plate. A grinding part is arranged in the butt joint mechanism, in the butt joint process of the two steel structure bodies, the grinding part can make contact with the steel structure bodies along with continuous movement of a driving part, the grinding part comprises a coarse grinding plate, a fine grinding plate and a polishing plate, in the grinding process, a sliding plate slides on the top of a supporting plate along with a mounting plate driven by the driving part to move, and the grinding plate is in contact with the grinding part. The rough grinding plate firstly makes contact with the rotating steel structure main body and conducts comprehensive rough grinding on the end face of the steel structure main body through rotation of the steel structure main body, and due to the fact that a second gear at the bottom of a lead screw is meshed with a second rack at the bottom of a mounting shell, the lead screw can rotate, and therefore when a grinding piece moves to a certain degree, the grinding piece can rotate. And the rough grinding plate, the fine grinding plate and the polishing plate can sequentially treat the steel structure body and then move downwards into the second mounting frame.

The utility model relates to the technical field of polishing devices, in particular to a rare earth permanent magnet material high-precision polishing device which comprises a machining base, an installation vertical plate is fixedly installed on the machining base, a workpiece to be polished is placed on the machining base, and a grinding and polishing mechanism for rapidly grinding the workpiece to be polished is arranged on the installation vertical plate. And a grinding auxiliary mechanism for limiting and clamping a workpiece to be polished is arranged on the machining base, the grinding and polishing mechanism comprises a rotary round seat movably mounted on the mounting vertical plate, driving assemblies are symmetrically mounted on the rotary round seat, and a first grinding head and a second grinding head are arranged on the two driving assemblies correspondingly. By arranging the grinding and polishing mechanism, the grinding head can be automatically and rapidly replaced in the grinding and polishing process through mutual cooperation between the rotary round seat and the driving motor, the rare earth permanent magnet material can be roughly ground and finely ground, the integration degree is high, and workers do not need to manually replace the grinding head.

The application provides a mechanical manufacturing output shaft surface grinding device, and relates to the grinding field. The mechanical manufacturing output shaft surface grinding device comprises a rack, a clamping and rotating mechanism for clamping and driving the rotation of an output shaft, a grinding wheel for grinding the surface of the output shaft, an elliptical profile of the grinding wheel enables the grinding wheel to form a point contact with the surface of the output shaft, a fixing frame fixed relative to the rack, and a connecting piece rotatably installed on the fixing frame. The mechanical manufacturing output shaft surface grinding device adopts an elliptical grinding wheel to realize a point contact grinding mode, so that the grinding wheel is always single-point attached to the output shaft, the grinding area is open, and the grinding dust is removed by cooperating with the cooling liquid and the flexible magnetic dust collection device, thereby avoiding the surface scratches and the pulling caused by the grinding dust being rolled into and crushed, greatly improving the surface quality of the workpiece, and the elliptical grinding wheel can swing with the grinding depth to form a continuously changing point contact, thereby reducing the single-point grinding force and the thermal stress concentration.

This invention relates to the technical field of granite workpiece processing, and in particular to a granite workpiece grinding device and method. The device includes a frame, a gantry frame mounted on the frame via a traveling mechanism, a lifting mechanism mounted on the gantry frame, a sliding mechanism mounted on the lifting mechanism, and a grinding mechanism mounted on the sliding mechanism via a mounting mechanism. The grinding mechanism includes a granite grinding plate, a handle mounted on the granite grinding plate, and multiple diamond-shaped grooves formed on the end face of the granite grinding plate away from the handle. This invention achieves high surface grinding precision and efficiency for granite workpieces.

The invention provides an output shaft surface grinding device for mechanical manufacturing, and relates to the field of grinding. The output shaft surface grinding device for mechanical manufacturing comprises a machine frame and a clamping and rotating mechanism used for clamping and driving an output shaft to rotate, and further comprises a grinding wheel used for grinding the surface of the output shaft, a fixing frame fixed relative to the machine frame, and a clamping and rotating mechanism used for clamping and driving the clamping and rotating mechanism to rotate, the connecting piece is rotationally mounted on the fixing frame; according to the output shaft surface grinding device for mechanical manufacturing, an elliptical grinding wheel is adopted in a point contact grinding mode, the grinding wheel is always attached to the output shaft in a single-point mode, a grinding area is open, cooling liquid chip flushing and flexible magnetic suction chip collecting are matched, surface scratching and galling caused by winding and rolling of grinding chips are avoided, the surface quality of a workpiece is greatly improved, and the grinding efficiency is improved. The oval grinding wheel can swing along with the grinding depth, continuously-changing point contact is formed, and single-point grinding force and thermal stress concentration are reduced.

The polishing device comprises a base, a two-dimensional driving mechanism is installed above the base through a support and drives a vertical electric cylinder to move forwards, backwards, leftwards and rightwards, a pressure sensor is installed at the lower end of a telescopic shaft of the vertical electric cylinder, and the two-dimensional driving mechanism drives the vertical electric cylinder to move forwards, backwards, leftwards and rightwards. A mounting plate is mounted at the bottom of the pressure sensor, and a detachable composite buffering polishing head is mounted at the bottom of the mounting plate. Mixed liquid nozzles are mounted on the left side and the right side of the composite buffer polishing head; according to the polishing device for manufacturing the ultrathin single crystal diamond substrate, chemical and mechanical cooperative polishing and flexible buffering compensation are achieved, a rectangular hole of the mounting frame allows the polishing head to move slightly, local stress concentration is eliminated, polishing uniformity is improved, the green manufacturing characteristic is achieved, modular maintenance is achieved, the detachable composite buffering polishing head and a bolt are designed to be replaced quickly, and maintenance is convenient.

A new polishing tool comprises: a main support member; a polishing head support member; a first drive mechanism; and a second drive mechanism. The polishing head support member is coupled to the main support member such that the polishing head support member is linearly movable relative to the main support member in a first direction and a second direction that is different to the first direction. The first and second directions may be mutually orthogonal. The first drive mechanism is operable to move the polishing head support member relative to the main support member in the first direction. The second drive mechanism operable to move the polishing head support member relative to the main support member in the second direction. The new polishing head uses linear actuators rather than a rotary motor and, as a result, is advantageous over known polishing tools.

The utility model discloses a double-grinding-wheel grinding head connecting structure which aims to overcome the defect that when a linear guide rail is ground, grinding wheels need to be trimmed in the process of switching from coarse grinding to fine grinding, and working efficiency is affected. The device comprises a rotating head and a grinding head, the grinding head is arranged on the rotating head, a coarse grinding wheel and a fine grinding wheel are arranged on the grinding head to form a double-grinding-wheel structure, the coarse grinding wheel and the fine grinding wheel are axially arranged at intervals, and grinding surfaces are arranged on the outer edges of the coarse grinding wheel and the fine grinding wheel. According to the double-grinding-wheel grinding head connecting structure, the coarse grinding wheel and the fine grinding wheel are arranged on the grinding head, in the grinding process of the linear guide rail, the grinding wheels can be directly switched when coarse grinding is switched to fine grinding, the grinding wheels do not need to be trimmed, and the working efficiency is improved.

The application discloses an automatic replacement device and method for end face grinding combined grinding head grinding wheel pieces, wherein the bottom of the grinding head is circularly distributed with a plurality of grinding wheel fixing blocks; a wedge-shaped groove is formed in the grinding wheel fixing block, and the wedge-shaped grooves in the bottom of the grinding head all extend along the radial direction of the grinding head; a wedge-shaped boss is connected to the grinding wheel piece, and the wedge-shaped boss is inserted and matched with the wedge-shaped groove; the tool magazine mechanism is spaced apart from the grinding head, the tool magazine mechanism comprises a rotatable grinding wheel disc, a plurality of grinding wheel fixing blocks are circularly distributed on the grinding wheel disc, the wedge-shaped grooves on the grinding wheel disc all extend along the radial direction of the grinding wheel disc, and a plurality of grinding wheel pieces are stored in the tool magazine mechanism through the plurality of grinding wheel fixing blocks; the moving mechanism comprises a guide rail, a tool changing mechanism is movably installed on the guide rail, and a plurality of clamping assemblies rotatable are arranged in the tool changing mechanism. The grinding head and the tool magazine mechanism in the application adopt the cooperation of the wedge-shaped groove and the wedge-shaped boss to store and place the grinding wheel pieces, so that the grinding wheel pieces can be conveniently replaced through the cooperation of the tool changing mechanism and the moving mechanism.

The present application relates to a ceramic tile polishing head and a production device thereof. The ceramic tile polishing head comprises a polishing head, the polishing head comprising a polishing base and a polishing body; the polishing base is made of metal and is disc-shaped, and the polishing base is provided with a center hole coaxial with the center line of the disc-shaped polishing base; the polishing body is made of metal powder and is cuboid, the cross section of the cuboid is square, and the thickness of the polishing body is smaller than the width of the polishing body; the manufacturing method of the polishing head is as follows: after the bottom end surface of the polishing body and / or the top end of the polishing base is smeared with silver brazing agent; the polishing body is uniformly distributed around the axis of the polishing base along the edge of the polishing base, so that the thickness direction of the polishing body points to the axis of the polishing base; the edge of the polishing base is heated to a range of 610 to 640 DEG C through induction heating, so that the polishing body is welded and fixed with the polishing base. The present application can improve the production efficiency and reduce the cost.

Provided in the present invention are a polishing device and a polishing apparatus for removing a film from the surface of a substrate. The polishing device comprises: a polishing table configured to hold and rotate the substrate; and a polishing head provided with a polishing pad for coming into contact with and being pressed against the substrate to polish the film on the surface of the substrate, the area of the polishing pad being less than or equal to the area of the substrate. The substrate is divided into at least two regions in a circumferential direction based on the thickness distribution of the film on the surface of the substrate. The at least two regions include a first region and a second region. During the process of polishing the surface of the substrate, the substrate keeps rotating, and the polishing head is configured to polish the first region at a first polishing rate and polish the second region at a second polishing rate, the first polishing rate being different from the second polishing rate. In the present application, the polishing device controls the polishing rate on the basis of the local position of the polishing head on the surface of the substrate, thereby precisely controlling the profile of the film on the entire surface of the substrate.

The invention relates to a niobium alloy surface treatment device which comprises a bottom frame. The two polishing mechanisms are arranged on the bottom frame and are perpendicular to each other; the turn-over mechanism is arranged between the two polishing mechanisms; the polishing mechanism comprises a supporting panel fixed to the top of the bottom frame, and a long groove is formed in the plate face of the supporting panel in the blank advancing direction. The polishing wheel set is arranged above the supporting panel and is used for polishing the top surface of the blank; the left side baffle and the right side baffle are arranged on the two sides of the bottom frame and used for guiding and polishing the two side faces of the blank; the feeding mechanism is used for driving the blank to advance on the supporting panel; according to the device, polishing treatment of the six surfaces of the niobium alloy plate can be automatically completed in the one-time clamping process, the risk of time waste and surface scratching caused by multiple times of turning over and positioning is fundamentally eliminated, and the machining efficiency and the product consistency are greatly improved.

The invention relates to the technical field of workpiece polishing and grinding, and discloses a plate-shaped workpiece surface polishing and grinding device which comprises a support, the bottom end of the support is fixedly connected with a bottom plate, one side of the top end of the bottom plate is rotatably connected with a first polishing roller, and the other side of the top end of the bottom plate is slidably connected with a sliding plate. The top end of the sliding plate is rotationally connected with a second polishing roller, a push-pull plate is fixedly arranged on one side of the top end of the sliding plate, and two air cylinders for driving the push-pull plate to horizontally move are fixedly installed on one side of the support. The first polishing roller and the second polishing roller are driven through the driving assembly, the first polishing roller and the second polishing roller can conduct double-face polishing and grinding on a plate-shaped workpiece, the machining efficiency of the plate-shaped workpiece is improved, in the polishing process, the first polishing roller and the second polishing roller can support and limit the two sides of the plate-shaped workpiece, and the supporting assembly can support the bottom end of the plate-shaped workpiece; and the stability of the plate-shaped workpiece can be kept.

The present application belongs to the field of precision grinding, and discloses a wafer grinding method, which can obtain extremely high wafer surface quality and maintain extremely high wafer grinding efficiency without changing the grinding platform. The wafer is placed on a rotating predetermined grinding surface, a grinding liquid film is injected between the predetermined grinding surface and the wafer, the wafer and the predetermined grinding surface are separated by the grinding liquid film, and the two are made to rotate relatively. A concave mirror surface recessed towards the predetermined grinding surface is arranged directly below the predetermined grinding surface, and an upwardly emitting laser beam is arranged directly below the concave mirror surface, the laser beam is diffused through the concave mirror surface to form an auxiliary heating light spot covering the grinding liquid film, so that the auxiliary heating light spot heats the grinding liquid film, and the predetermined grinding surface grinds the wafer. The present application also discloses a wafer grinding device for implementing the above grinding method, and the device has a simple structure.

The application provides a polishing robot intelligent polishing head with rigid-flexible coupling structure and a wall surface detection method, which is composed of a base, a distance sensor fixing seat, a pressure sensor one fixing seat, a pressure sensor one, a motor fixing seat, a motor, a motor output shaft connecting sheet, a damping compression spring, a polishing sheet, a damping force measuring unit and a distance sensor, the damping force measuring unit is composed of a compression spring group, a compression spring slide, a connecting plate, a sensor fixing seat, a connecting bolt, a pressure sensor array and a universal wheel, the distance sensor fixing seat and the pressure sensor one fixing seat are fixed on the base in sequence, the bottom of the pressure sensor one is fixed on the pressure sensor one fixing seat, the motor fixing seat is fixed on the top of the pressure sensor one, the bottom of the motor is fixed on the motor fixing seat, the motor output shaft connecting sheet is fixed on the motor output shaft, the bottom end of the damping compression spring is fixed on the motor output shaft connecting sheet, and the top end is fixed on the polishing sheet. The polishing head can measure the distance and the force to realize intelligent polishing of a large plane.

The application relates to the technical field of integrated circuit manufacturing, and discloses wafer thinning equipment and a thinning method. The wafer thinning equipment comprises a grinding device and an adsorption platform. The adsorption platform is used for supporting a wafer and driving the wafer to rotate. The grinding device is arranged above the adsorption platform in a lifting mode. The lower part of the grinding device is provided with a grinding wheel used for grinding the wafer. The grinding wheel comprises a base material and a plurality of grinding blocks. The grinding blocks are fixed to the base material through an adhesive layer. The grinding blocks comprise a gel ceramic combination body which has a staggered spiral stacking structure and is used for dispersing stress during grinding. The raw material of the gel ceramic combination body is a ceramic gel bonding agent which comprises calcium carbonate / calcium phosphate composite gel and chitin nanocrystals. The above technical scheme solves the problems of large total thickness deviation of the thinned wafer and easy formation of a subsurface damage layer in the related art.

The invention relates to a high-precision grinding mechanism, which relates to the technical field of metal cutting machine tools, and comprises an upper and lower grinding wheel movement and tray planar movement combined mechanism. By creating an automatic grinding wheel plane grinding technology, the abrasion uniformity of the grinding wheel is greatly improved, the cost of the grinding wheel is remarkably saved, the high precision of the grinding wheel plane is kept for a long time, and the grinding flatness precision, the free height precision and the perpendicularity precision stability are greatly improved.

The present invention provides a workpiece grinding method capable of preventing excessive consumption of a grinding tool and also capable of achieving reduction of grinding load. The workpiece grinding method is a grinding method for thinning a workpiece to a finished thickness using a grinding device, and includes a first grinding step of grinding the workpiece to a predetermined thickness while supplying grinding water capable of suppressing consumption of the grinding tool, and a second grinding step of grinding the workpiece to the finished thickness while supplying grinding water of a second grinding water amount that is lower than the first grinding water amount and increases consumption of the grinding tool to promote self-sharpening, after the first grinding step is performed, and promoting sharpening of the grinding tool to prepare for processing of a next workpiece.

A tool for ultrasonic impact grinding apparatus driven to vibrate along a longitudinal axis at an applied operating frequency includes a tool body disposed on the longitudinal axis, a first tip extending from an output end of the tool body, and a second tip extending in parallel to the first tip from the output end of the tool body. The first tip has a first length. The second tip has a second length greater than the first length. A mass of the first and second tip is substantially balanced across the output end of the tool body and with respect to the longitudinal axis.

The invention discloses a catalysis-conduction integrated gel polishing disc and application of the catalysis-conduction integrated gel polishing disc in electro-Fenton polishing. According to the gel polishing disc, a three-dimensional network framework is constructed by utilizing the gelation characteristic of modified polyvinyl alcohol under a freezing condition, and modified phenolic resin is introduced as a binding agent, so that a soft substrate with good heat resistance and mechanical strength is formed; then, functional components such as conductive copper powder, graphene oxide-ferroferric oxide composite powder and diamond abrasive particles are added, so that catalysis, conductivity and grinding performance needed by electro-Fenton polishing are achieved; during polishing, strong oxidizing groups are generated on the surface of the gel polishing disk by utilizing the electro-Fenton effect, the surface of the workpiece is softened, a modified layer easy to remove is formed, and then the gel polishing disk is used for mechanical removal, so that high-efficiency and low-damage polishing of the hard and brittle workpiece is realized; and the solid-phase Fenton catalyst is directly doped into the gel polishing disc, so that the dependence on electrolyte and polishing liquid can be reduced during polishing, and the environmental pollution is reduced.

To enable changing of a ring width or the like without changing a grinding wheel when a workpiece is ground by a TAIKO grinding technique.SOLUTION: A method for grinding a workpiece comprises: a rotation-shaft direction grinding step of bringing a grinding wheel having a circle diameter defined by the outer peripheral side surfaces of a plurality of grindstones is equal to or smaller than a radius of the workpiece and a chuck table holding the front surface side of the workpiece close to each other along an axis of a rotary shaft of the chuck table to grind the back side of the workpiece; and a radial grinding step of moving the grinding wheel and the chuck table relative to each other in the radial direction of the chuck table. The radial grinding step includes one or both of an inside-direction grinding step of moving from a position where a moving track of the bottom surfaces of the grindstones and the axis of the chuck table do not overlap each other to a position where they overlap and an outside-direction grinding step of moving from the position where the moving track and the axis overlap each other to the position where they do not overlap each other.SELECTED DRAWING: Figure 1

The invention discloses a thinning device for monocrystalline silicon wafer processing, and relates to the technical field of wafer silicon wafer thinning processing, and the thinning device comprises a bottom plate, the bottom plate is provided with a limiting column, the upper end of the limiting column is provided with a top plate, the top plate is provided with a thinning head, and the top plate is provided with a thinning driving member. The thinning driving part is used for driving the thinning head to thin a monocrystalline silicon wafer, the thinning head is connected with the thinning driving part through a replacement assembly, a jacking part is arranged on the bottom plate, a supporting column is arranged at the output end of the jacking part, a first fixing plate is arranged on the supporting column and located above the bottom plate, and a second fixing plate is arranged on the first fixing plate and located above the bottom plate. The first fixing plate is connected to the limiting column in a sliding mode. The replacement assembly is arranged between the thinning head and the thinning driving part, the thinning head and the thinning driving part are connected through the replacement assembly, the problem that replacement is inconvenient due to the fact that a traditional grinding wheel and a driving structure are fixedly connected is solved, and different thinning operation requirements are met.

The application belongs to the technical field of metal processing, and discloses a metal forming rolling equipment, a manufacturing method and application in high-purity aluminum target material. The metal forming rolling equipment comprises a support frame, a polishing assembly is connected to the support frame, a rolling assembly is connected to one side of the polishing assembly, a detection assembly is connected to one end of the rolling assembly, and a regulating part is further connected to the support frame. The regulating part can regulate the polishing assembly. The mutual cooperation between the polishing assembly and the rolling assembly ensures the stable movement of the metal plate on the rolling equipment, cleans the impurities on the surface of the metal plate, ensures the rolling efficiency of the metal plate when passing through the rolling assembly, reduces the damage of impurities to the rolling assembly, improves the rolling precision, and reduces the frequency of subsequent maintenance and replacement of the rolling assembly.

A polishing apparatus includes: a main shaft having a grinding wheel in a lower portion of the main shaft; a housing surrounding the main shaft; and a movable damper, where the movable damper includes: a lower bracket disposed between a perimeter of the main shaft and an inner perimeter of the housing, where the main shaft passes through the lower bracket; an upper bracket which is separated from the lower bracket in the vertical direction and is provided above the lower bracket; and a first damper disposed between the upper bracket and the lower bracket and between the main shaft and the housing, and configured to move along the lower bracket, in which the first damper includes a damper plate including an inner plate and an outer plate, an elastic member, and a variable portion.

Embodiments of the present disclosure relate to the technical field of curtain wall plate processing equipment. An embodiment of the present disclosure provides a curtain wall plate polishing device, comprising: a disc body having an axial direction and a radial direction; a plurality of polishing brushes, each having a sliding part and a brush part, the sliding part being arranged in the disc body along the axial direction of the disc body, and the brush part being located outside the disc body for polishing the curtain wall plate; and a flinger, which is arranged on the disc body along the radial direction of the disc body and can slide away from the center of the disc body after the disc body rotates; wherein the flinger has a first pushing slope, the sliding part has a first pushed slope, the first pushing slope and the first pushed slope are in abutment, and the flinger can push the polishing brush to slide and approach the curtain wall plate through the first pushing slope and the first pushed slope. Through the above technical solution, the technical problems of insufficient polishing pressure and uneven polishing disc wear of a large-size stone-imitating curtain wall plate in related technologies are solved.

To provide a processing device capable of processing high-hardness workpieces with high quality. [Solution] In a plan view from a direction parallel to the first direction, three linear guides are positioned at locations corresponding to the three vertices of a triangle. A machining unit is supported by the linear guides so as to be able to move up and down in the first direction. A feed mechanism moves the machining unit up and down in the first direction. A holding mechanism holds the workpiece below the machining unit. The machining unit supports a grinding wheel so as to face the workpiece held by the holding mechanism, and includes a rotation mechanism that rotates the grinding wheel around a center of rotation parallel to the first direction. The center of gravity of the machining unit is located inside the triangle in a plan view, and when the grinding wheel is rotated around the center of rotation, the grinding wheel does not coincide with the center of gravity of the triangle and passes through a position shifted from the center of gravity of the triangle toward the point where a force in the upward direction is applied to the machining unit by the feed mechanism.

This invention provides a grinding wheel, a grinding apparatus, and a wafer manufacturing method. The grinding wheel includes a main body and a grinding part. The top surface of the grinding part is a plane perpendicular to the axis of the main body. The bottom surface of the grinding part has a first grinding surface inclined away from the top surface and a second grinding surface inclined towards the top surface, with one end connected to the first grinding surface. The other end of the second grinding surface is connected to the main body. The distance from the end of the first grinding surface near the main body to the top surface of the grinding part is greater than the distance from the end of the second grinding surface near the main body to the top surface of the grinding part. The first grinding surface has a first acute angle with a reference plane, and the second grinding surface has a second acute angle with the reference plane, the second acute angle being smaller than the first acute angle. The reference plane is perpendicular to the axis of the main body. The grinding wheel is used to grind the wafer in the wafer manufacturing process to achieve edge removal. The application of the grinding wheel can improve the edge quality of the manufactured wafer.