602results about "Grinding heads" patented technology

The invention relates to the technical field of grinding machines, and discloses a surface grinding machine which comprises a rotary type grinding mechanism and a linkage type pressure applying mechanism. A hollow rotating column which can rotate along with the second butt-joint plate and is in a hollow state, a fifth butt-joint plate which can axially move along the hollow rotating column and rotate along with the hollow rotating column, and a spiral spring which generates downward elastic pressure on the fifth butt-joint plate are arranged in the second butt-joint plate. According to the surface grinding machine, the basic circular motion type grinding effect of the plane grinding disc on the surface of an object is utilized, and the relative motion of the built-in grinding block around the petal-shaped closed sliding groove is combined, so that the grinding block can generate radial reciprocating motion relative to the rotating axis on the surface of the object, and the grinding efficiency of the object is improved; the two kinds of grinding movement are from the same driving motor, and therefore the effective utilization rate of the driving motor can be effectively increased.

The invention belongs to the technical field of semiconductor device manufacturing and processing, and particularly relates to semiconductor device manufacturing processing equipment which comprises a base and a mechanical arm fixedly arranged at the top of the base, a dust removal mechanism is fixedly arranged at one end of the mechanical arm, and a wafer polishing mechanism is fixedly arranged at the bottom end of the dust removal mechanism. A pneumatic lifting mechanism is fixedly arranged at the top of the base, when a wafer clamped by the wafer clamping mechanism needs to be turned over, the clamping air bag is inflated through the air nozzle, the wafer is clamped through the clamping air bag, then a valve on the air outlet is closed, at the moment, the air pressure in the hollow stand column can be continuously increased, and the wafer can be turned over. The piston assembly in the pneumatic lifting mechanism is pushed by air pressure to be jacked upwards, the ejector rod can be synchronously driven to ascend when the piston assembly is jacked upwards, the wafer clamping mechanism can be jacked up synchronously through the ejector rod, a wafer needing to be polished can be turned over conveniently, and the back face of the wafer can be polished conveniently.

The invention relates to an ultra-precision grinding and photochemical mechanical polishing combined process for a laser crystal sheet. Comprising the following steps that coarse grinding is conducted through a coarse-grained grinding wheel, rapid thinning is achieved, the depth of a subsurface damaged layer is determined, and reference is provided for the grinding wheel feeding amount in the accurate grinding stage; a fine-grained grinding wheel is adopted for accurate grinding, a damaged layer introduced in the coarse grinding stage is removed, and high surface / subsurface quality and surface precision are obtained by optimizing technological parameters; a special polishing solution for photochemical mechanical polishing is prepared from an aluminum oxide (Al2O3) grinding material, semi-fine polishing is carried out on a laser crystal sheet, and surface damage caused in the grinding stage is rapidly removed; a special polishing solution for photochemical mechanical polishing is prepared from a zirconium oxide (ZrO2) grinding material, and the laser crystal sheet is finely polished, so that the surface quality and the surface precision are further optimized; an ultrasonic cleaning instrument is adopted to clean the laser crystal slice, and a cleaning agent is absolute ethyl alcohol. According to the invention, high-surface integrity and high-efficiency processing of the laser crystal slice can be synchronously realized.

The invention provides concrete forming equipment and a forming method for a prefabricated box girder, and belongs to the technical field of concrete prefabricated box girders. The device comprises a guide table, a box girder body and a box girder prefabricated template used for forming the box girder body, and further comprises a partition lubricating assembly and a detection driving assembly. Through cooperation of the speed reducer, the lead screw and the hydraulic cylinder, the positions of the scraping plate and the grinding disc can be adjusted, the surface of the box girder is scraped and polished, and flatness and smoothness are ensured; the movable disc is matched with the spring, can adjust and buffer impact according to the surface fluctuation of the box girder, protects the box girder and prolongs the service life of the millstone and the movable disc; the partition lubricating assembly realizes precise lubrication by using a special nozzle and a nano channel; the low-viscosity nano lubricant guarantees timely lubrication, the detection driving assembly intelligently controls the lubrication degree according to feedback of a friction force sensor, the utilization rate is improved, the grinding disc condition can be inferred by analyzing sensor data, grinding disc parameters are adjusted in time when friction force is abnormal, and damage to a box girder and excessive abrasion of the grinding disc are prevented.

A robotic system for modifying a surface is presented. The system includes a motive robot arm with an arm movement mechanism. The system also includes a tool coupled to the arm movement mechanism. The tool is configured to removably couple to an article configured to contact the surface. The system also includes a first actuator that causes the arm movement mechanism to move the tool into a pickup position with respect to the article. The system also includes a second actuator that causes a shearing motion, during an article attachment step, between the article and the tool. The coupling between the article and the tool comprises a hook and loop system.

The embodiment of the invention provides a polishing method, polishing equipment and a silicon wafer, the polishing method comprises the following steps: a polishing head is used for holding the silicon wafer, and under the condition that the silicon wafer is held by the polishing head, the polishing head is used for polishing the silicon wafer; the first surface of the silicon wafer is exposed, and the second surface, opposite to the first surface, of the silicon wafer is adjacent to a gasket assembly of the polishing head; and the temperature of the liner assembly is adjusted, so that the liner assembly is deformed to be at least partially attached to the second surface of the kept silicon wafer, and therefore in the polishing process, pressure borne by the liner assembly is transmitted to the silicon wafer through the portion, attached to the second surface of the silicon wafer, of the liner assembly.

The invention relates to the technical field of flange welding, in particular to a flange production welding device and method.The flange production welding device comprises a welding device body and a supporting platform distributed around the welding device body, the supporting platform is horizontally arranged, and a driving assembly for driving an arc-shaped plate to move is arranged on the supporting platform; a supporting assembly is arranged between every two adjacent supporting platforms. In the moving process of the arc-shaped plate, the arc-shaped plate is in extrusion contact with the grinding assembly, the grinding effect is achieved, self-positioning can be assisted, the grinding assembly guides the end of the arc-shaped plate to move along a specific track, the arc-shaped plate is supported and guided from the inner side and the outer side in combination with the driving assembly and the extrusion adjusting assembly, and shaking or deviation is reduced; the end of the arc-shaped plate can be accurately aligned with the end of the adjacent arc-shaped plate, high-precision position guarantee is provided for follow-up welding operation, and the flange splicing quality and the production efficiency are improved.

The invention discloses sofa board surface processing equipment, and relates to the technical field of board surface processing. The device comprises a machining table, linear sliding rail modules are installed on the front face and the back face of the machining table, a grinding assembly is fixedly installed between the two linear sliding rail modules, the grinding assembly is located above the machining table, and the grinding assembly comprises a grinding cover fixedly installed between the two linear sliding rail modules; a negative pressure hole is formed in the inner wall of the polishing cover, and the negative pressure hole and the adsorption hole are connected with external negative pressure equipment through a negative pressure connecting pipe. Through the arrangement of the abrasive paper mounting roller, abrasive paper can be quickly unloaded, the abrasive paper is tightly adsorbed on the abrasive paper mounting roller through negative pressure along with rotation of the abrasive paper mounting roller in the replacement cover, quick replacement of long abrasive paper is completed, abrasive paper with different granularities can be replaced according to needs, the equipment adaptability is high, manual operation replacement is not needed, and the automation degree is high.

The invention discloses a wall polishing device for placement house building construction, and belongs to the field of wall polishing devices.The wall polishing device comprises a base used for supporting the whole equipment, a lifting module, a polishing module and a dust removal module, and a moving assembly used for moving the equipment is arranged at the bottom of the base; the top of the base is connected with the grinding module through the lifting module, the grinding module comprises a sand disc used for grinding a wall, the lifting module is used for adjusting the height of the sand disc, and the dust removal mechanism is used for removing dust generated by grinding the wall. The wall polishing device has the effect of achieving efficient, accurate and low-dust wall polishing operation.

The invention discloses a steel structure butt welding adjusting device which comprises a supporting plate and supporting rods fixed to the four corners of the bottom of the supporting plate. A grinding part is arranged in the butt joint mechanism, in the butt joint process of the two steel structure bodies, the grinding part can make contact with the steel structure bodies along with continuous movement of a driving part, the grinding part comprises a coarse grinding plate, a fine grinding plate and a polishing plate, in the grinding process, a sliding plate slides on the top of a supporting plate along with a mounting plate driven by the driving part to move, and the grinding plate is in contact with the grinding part. The rough grinding plate firstly makes contact with the rotating steel structure main body and conducts comprehensive rough grinding on the end face of the steel structure main body through rotation of the steel structure main body, and due to the fact that a second gear at the bottom of a lead screw is meshed with a second rack at the bottom of a mounting shell, the lead screw can rotate, and therefore when a grinding piece moves to a certain degree, the grinding piece can rotate. And the rough grinding plate, the fine grinding plate and the polishing plate can sequentially treat the steel structure body and then move downwards into the second mounting frame.

The invention belongs to the field of ceramic tiles, and particularly relates to a ceramic tile with a bright and sub combination effect on the surface and a preparation method thereof. The ceramic tile comprises a green body layer, a ground glaze layer, an ink-jet functional ink layer containing bright matte ink and a cover glaze layer containing dry particles which are sequentially stacked, the dry granules with the granularity of 250-400 meshes comprise the following components in percentage by mass: 17%-20% of Al2O3, 4.5%-6.5% of SrO and 14%-17% of BaO; the gray level of the matte ink is 30%-60%, and the gray level of the bright ink is 50%-100%. After the specific dry granular glaze and the brilliant functional ink are fired at a high temperature and interact with each other, the obtained ceramic tile has a better brilliant effect and a multi-dimensional three-dimensional luster effect, and also has the characteristics of better surface flatness, color development capability, friction coefficient, skid resistance, wear resistance, antifouling property and the like; the preparation method is simple and easy to implement and stable in production, and has great popularization value.

A polishing device for silicon carbide wafers disclosed by the present invention relates to the technical field of wafer polishing, and includes a polishing mechanism. A matching mechanism is installed on the polishing mechanism. The polishing mechanism includes a box body. A sliding frame is reciprocally slidably installed on the box body. A matching slider is slidably installed on the sliding frame. An adsorption component is rotatably installed on the matching slider. Trigger rod 1 and trigger rod 2 are respectively located at both ends of the sliding frame. Trigger rod 1 and trigger rod 2 cooperate with the adsorption component. By setting the polishing mechanism in the present invention, the wafer is initially roughly polished and then finely polished, realizing automatic replacement of the polishing disc, with high linkage and improved work efficiency. At the same time, the automatic loading and unloading are realized through the matching mechanism, and the degree of automation is high.

The invention discloses an ultraviolet light-assisted chemical mechanical polishing device which comprises a polishing disc assembly, a polishing solution supply part, a carrying disc and an optical fiber, the first end of the optical fiber is connected with an ultraviolet light source, the second end of the optical fiber is rotationally connected with the carrying disc, and a light-transmitting substrate is arranged in the carrying disc and located below the second end of the optical fiber. The polishing method comprises the steps that S1, a workpiece is fixedly installed on the bottom face of the light-transmitting substrate; s2, the carrying disc is placed on a polishing disc assembly and clamped into a blocking arm, so that the carrying disc can be driven by friction force between the polishing disc assembly and the workpiece to rotate; s3, turning on the ultraviolet light source and adjusting the ultraviolet light irradiation range until the bottom surface of the light-transmitting substrate is completely illuminated; s4, the polishing disc assembly is started, and the polishing liquid supply part drips polishing liquid into the polishing disc assembly for current-stage polishing; and S5, after the surface roughness value of the workpiece reaches the upper limit of the current polishing stage, the polishing disc assembly and the polishing solution are replaced, and then the step S4 is executed till the surface roughness value of the workpiece reaches the target value.

The invention discloses an ultrasonic vibration auxiliary electrochemical mechanical thinning method and device for a large-diameter wafer, and belongs to the technical field of large-diameter semiconductor wafer thinning, and the device comprises a grinding system, an electrochemical system and an electrolyte circulating system. The grinding system comprises a micro-feeding unit, a main shaft rotating unit and an ultrasonic vibration unit, and the main shaft rotating unit and the ultrasonic vibration unit drive the cup-shaped grinding wheel to rotate and axially vibrate. The electrochemical system takes a cup-shaped grinding wheel as a cathode and a wafer as an anode, and an electrolyte is supplied between the cathode and the anode to generate electrochemical reaction. In the thinning process, the surface of the wafer is subjected to anodic oxidation modification to generate a modification layer easy to remove, meanwhile, the generated modification layer is removed by the grinding wheel, the grinding wheel with ultrasonic vibration facilitates chip removal and heat dissipation, circulation of electrolyte can be enhanced, and then the electrochemical modification effect is improved; the annular structure of the grinding wheel has better removal uniformity under the vibration condition, and efficient, high-precision and low-damage large-diameter wafer thinning can be achieved.

The utility model relates to the technical field of polishing devices, in particular to a rare earth permanent magnet material high-precision polishing device which comprises a machining base, an installation vertical plate is fixedly installed on the machining base, a workpiece to be polished is placed on the machining base, and a grinding and polishing mechanism for rapidly grinding the workpiece to be polished is arranged on the installation vertical plate. And a grinding auxiliary mechanism for limiting and clamping a workpiece to be polished is arranged on the machining base, the grinding and polishing mechanism comprises a rotary round seat movably mounted on the mounting vertical plate, driving assemblies are symmetrically mounted on the rotary round seat, and a first grinding head and a second grinding head are arranged on the two driving assemblies correspondingly. By arranging the grinding and polishing mechanism, the grinding head can be automatically and rapidly replaced in the grinding and polishing process through mutual cooperation between the rotary round seat and the driving motor, the rare earth permanent magnet material can be roughly ground and finely ground, the integration degree is high, and workers do not need to manually replace the grinding head.

The utility model relates to a superhard material guide rail machining device which comprises a lathe bed. The working table is arranged above the machine body; the two ends of the cross beam are arranged on the workbench through stand columns; the X-axis linear motor module is arranged on the cross beam; the Z-axis linear module is arranged on the X-axis linear motor module; the spindle box is arranged on the Z-axis linear module, an electric spindle is arranged in the spindle box, and a grinding tool or a polishing tool is installed on the electric spindle; the Y-axis linear motor module is arranged on the workbench; and the workpiece carrying plate is arranged above the Y-axis linear motor module. Through multi-axis linkage of the X-axis linear motor module, the Y-axis linear motor module and the Z-axis linear motor module, the long guide rail is pressurized and polished through a small tool, the grinding amount is controlled through the dwell time and the polishing pressure, and high-precision machining of the long guide rail is achieved.

The present invention relates to a combined process of ultra-precision grinding and photochemical mechanical polishing of laser crystal slices. The process comprises the following steps: using a coarse-grained grinding wheel for rough grinding to achieve rapid thinning and determine the depth of the subsurface damage layer, providing a reference for the grinding wheel feed rate in the fine grinding stage; using a fine-grained grinding wheel for fine grinding to remove the damage layer introduced in the rough grinding stage, and obtaining higher surface / subsurface quality and surface accuracy by optimizing process parameters; using aluminum oxide (Al2O3) abrasives to prepare a special polishing liquid for photochemical mechanical polishing, and performing semi-fine polishing on the laser crystal slices to quickly remove the surface damage caused in the grinding stage; using zirconium oxide (ZrO2) abrasives to prepare a special polishing liquid for photochemical mechanical polishing, and performing fine polishing on the laser crystal slices to further optimize the surface quality and surface accuracy; and using an ultrasonic cleaner to clean the laser crystal slices, with anhydrous ethanol as the cleaning agent. The present invention can simultaneously achieve high surface integrity and high-efficiency processing of laser crystal slices.

The invention relates to the technical field of stone grinding, and discloses a stone grinding machine with a grinding head convenient to replace, the stone grinding machine comprises a mounting plate I and a turnover mechanism, the mounting plate I is rotatably connected with a rotating shaft, the bottom of the rotating shaft is provided with a mounting disc, the top of the mounting disc is provided with a convex column, and the outer wall of the mounting disc is provided with a plurality of replacement ports at equal intervals; a rotating mechanism is arranged on the mounting disc, a plurality of pairs of first fixing plates are arranged on the rotating mechanism at equal intervals, a second fixing column is rotationally connected between each pair of first fixing plates through a torsional spring, an L-shaped overturning plate is rotationally connected to the outer wall of each second fixing column, and one end of each L-shaped overturning plate is semicircular; the other ends of the L-shaped overturning plates are fixedly connected with first fixing columns. The L-shaped overturning plates are arranged over all the replacement openings, the first grinding head or the second grinding head can be automatically replaced according to requirements, the situation of halting for disassembly and replacement in the past is completely eradicated, and the working efficiency is greatly improved.

The utility model discloses a brake disc polishing device which comprises a main body, an installation base is installed on the outer wall of the top of the main body through bolts, telescopic cylinders are installed on the two sides of the outer wall of the top of the installation base through bolts, a push plate is installed at the output ends of the telescopic cylinders through bolts, and an installation box is arranged in the center of the outer wall of the top of the push plate. A worm extending out of the mounting box is movably mounted in the mounting box through a bearing, screws extending into the push plate are movably mounted on the two sides of the inner wall of the bottom of the mounting box through bearings, and worm wheels meshed with the screws are mounted on the outer walls, close to a worm thread layer, of the screws through bolts. Through the arranged worm, when the worm is rotated, the worm can drive a screw rod and a lifting plate to move under the action of a worm gear, the lifting plate drives a limiting column to be inserted into a grinding plate under the action of a curved bar, and therefore the fixing function of the grinding plate is achieved, and through the arrangement of a magnet, the butt joint function of an operator on the grinding plate can be effectively facilitated; and the operation of a user is facilitated.

The invention particularly relates to inner diameter grinding equipment for cylindrical aluminum alloy machining, and belongs to the technical field of inner diameter grinding equipment.The inner diameter grinding equipment comprises a fixed adjusting base, a stable mounting plate is designed at one end of the fixed adjusting base, a grinding driving part is mounted at the upper end of the stable mounting plate, and a diameter adjusting structure is fixedly mounted at the output end of the grinding driving part; an extending grinding piece is arranged at one end of the diameter adjusting structure, mirror image adjusting and controlling structures are evenly installed in the fixed adjusting base, stable clamping structures are designed at the two ends of each mirror image adjusting and controlling structure, the combined extending grinding piece is adopted, and based on a splicing sleeve and a guide rail sliding structure, the device can be rapidly matched with materials of different lengths; the extension unit is accurately locked through a positioning pin, the convenience and flexibility of multi-size grinding are remarkably improved, meanwhile, through an integrated stable clamping structure, the convenience, accuracy and stability of material installation are improved, and then the machining effect of the device on raw materials is improved.

The invention discloses a grinding head device of a double-face machining grinding machine. Comprising a box body part, an upper grinding head assembly, a lower grinding head assembly, an upper main shaft driving device and a lower main shaft driving device, wherein the upper grinding head assembly and the lower grinding head assembly are symmetrically arranged up and down and are supported and mounted in the box body part by adopting a hard rail sliding rail pair; the upper main shaft driving device and the lower main shaft driving device are symmetrically arranged behind the box body part and respectively provide grinding power for the upper grinding head assembly and the lower grinding head assembly; the two groups of Z-axis feeding parts are fixed in the box body part and are used for respectively providing Z-axis feeding force for the upper grinding head assembly and the lower grinding head assembly; the upper grinding head assembly comprises a main shaft box, an upper main shaft limited in the main shaft box through a lower end cylindrical roller bearing, a bidirectional thrust angular contact ball bearing and a cylindrical roller bearing, a rotary joint connected with the upper end of the upper main shaft through a joint seat, and a driven belt wheel connected with the upper main shaft through a spline structure and an unloading device arranged on the main shaft box; the upper spindle flange is arranged at the lower end of the upper spindle. The invention has the advantages of good main shaft rigidity and capability of improving the dynamic rigidity of the whole machine.

Provided is a grinding processing system capable of firmly fixing a main body portion of a glass plate, and capable of performing grinding processing on a peripheral edge of the main body portion while preventing sideslip (lateral deviation) of the main body portion of the glass plate in a case where the peripheral edge of the main body portion of the glass plate is ground by biting in of a side surface (cylindrical portion) of a rotating disk-shaped grinding stone of a grinding device. A grinding processing system 10a includes a magnet installed on a table sucker 130 and located immediately below a lower surface of a main body portion of a glass plate placed on a grinding processing table, a magnetic weight material located on a side of an upper surface of the main body portion of the glass plate and attracted to the magnet, first fixing means for causing the table sucker 130 to abut on the lower surface of the main body portion of the glass plate to attract and hold the lower surface of the main body portion before starting of grinding processing on a peripheral edge of the main body portion of the glass plate, and second fixing means for causing the magnet located immediately below the lower surface of the main body portion and the magnetic weight material abutting on the upper surface of the main body portion and attracted to the magnet to sandwich the main body portion before starting of the grinding processing on the peripheral edge of the main body portion of the glass plate.

The invention provides a method for judging the grinding track uniformity of a non-standard grinding tool of a floor machine based on a discrete coefficient, which comprises the following steps of: observing the morphological characteristics of abrasive particles on the surface of the non-standard grinding tool to obtain characterization parameters of the abrasive particles, and simulating the randomness of the quantity of the abrasive particles with different particle sizes on the surface of the abrasive material through a distribution theory to obtain the uniformity of the grinding track of the non-standard grinding tool. Calculating the number of abrasive particles with different particle sizes so as to establish an abrasive surface abrasive particle distribution model; according to a motion transmission structure of the floor machine, a grinding disc kinematics model is established, a grinding track equation of a grinding disc is deduced, and therefore a grinding track curve of all grinding particles is drawn; and grid division is carried out on the ground area, and the average value of the number of track points of a grid, the standard deviation of track uniformity and the discrete coefficient CV of the track uniformity are calculated so as to judge the uniformity of the track in the whole area. The method can be used for judging the uniformity of the grinding track of the non-standard grinding material, and a reasonable basis is provided for kinematics design of a grinding disc of a floor machine.

The invention discloses an automatic round hole grinding device for furniture manufacturing, and relates to the field of round hole wall grinding, the automatic round hole grinding device comprises a big-end-up circular truncated cone head, the circular truncated cone head is connected with a driving part through a shaft barrel, the driving part is used for driving the circular truncated cone head to lift and rotate, and the automatic round hole grinding device further comprises a plurality of grinding parts annularly distributed around the circular truncated cone head; a sliding groove which obliquely extends up and down is formed along the outer surface of the circular truncated cone head, the grinding piece is in sliding connection with the sliding groove, the grinding piece is provided with a lug plate which extends horizontally, and when the circular truncated cone head penetrates through the circular hole downwards, the lug plate abuts against the top of the circular hole, so that the grinding piece moves upwards along the sliding groove. And in the process, the grinding piece and the sliding groove move relatively to enable the grinding piece to move and expand, the outline of the frosted face is kept to be matched with the size of the round hole, the grinding size does not need to be manually adjusted, round holes of different sizes can be automatically matched and arranged, and the grinding machining efficiency is improved.

An embodiment sanding device includes a housing mountable on an arm of a robot, a sanding tool assembly rotatably installed on the housing by a spindle shaft, and a sanding pressure regulating unit coaxially connected to the spindle shaft and configured to regulate sanding pressure of the sanding tool assembly applied to a coating film while reciprocating the spindle shaft in an axial direction.

The invention discloses a sample preparation method for Micro-LED cross section surface potential test and application of the sample preparation method. The Micro-LED cross section active region surface potential testing method comprises the following steps: preparing a Micro-LED cross section sample, and polishing the cross section of the sample by using an argon ion beam polishing process to form a test sample with the surface roughness of nanoscale; a Kelvin probe microscope (KPFM) is used for testing the surface potential of the test sample, and the KPFM not only can represent the surface appearance of the sample, but also can obtain the electrical property-surface potential of the surface of the sample by manufacturing a section sample and simulating the etching process, so that the difference of the surface potential of different areas can be compared more intuitively. Furthermore, the work function of the semiconductor material can be measured and calculated, and meanwhile, an energy band model can be established to analyze the transport condition of carriers on the surface.

The present invention relates to the technical field of metal cutting, and particularly to a high-precision numerically controlled vertical grinding machine, which includes a column module, a bed module, and a grinding head module. The column module is connected to the bed module. A turntable is arranged on the bed, and a spindle box is slidably arranged on the column. A main shaft is arranged in the spindle box, and the main shaft is connected to the grinding head module. A topology repair module is also arranged in the spindle box; through the linkage design of the centering unit by the fixed seat, the centering plate, the pushing sub-unit, and the centering rod, it directly acts on the outer periphery of the main shaft to compensate the center deviation of the main shaft in real time; the pushing sub-unit is controlled by the control unit and can adjust the displacement of the centering plate according to the instruction output by the error repair model, so as to correct the radial offset of the main shaft caused by insufficient rigidity or assembly error; it solves the problems of large surface roughness and cumulative roundness error of the processed surface caused by vibration and center offset of the traditional grinding machine, and realizes high-precision deep hole processing.

The invention discloses a precise steel pipe welding seam processing device and method, and belongs to the technical field of welding seam polishing. The welding seam processing device comprises a base for fixing a steel pipe, a guide rail extending along a steel pipe welding seam is arranged on the base, a sliding seat is slidably mounted on the guide rail, and a turbine rack concentric with the steel pipe is slidably connected into the sliding seat in an arc shape; a first driving mechanism used for driving the worm to reciprocate is arranged at one end of the worm, a supporting block is fixed to the worm gear rack, a supporting rod is movably connected into the supporting block in a limiting mode, a grinding disc is fixed to the end, close to the steel pipe, of the supporting rod, and the supporting rod moves to the limiting position in the direction close to the steel pipe so that the grinding disc can be attached to the steel pipe; second driving mechanisms are fixed to the ends, away from the steel pipes, of the supporting rods. The sliding seat slides along the guide rail, so that a steel pipe welding seam is polished through reciprocating motion of the grinding disc, and poor stability and cost increase caused by reciprocating rotation of the steel pipe are avoided.

The invention relates to the technical field of integrated circuit manufacturing, and provides wafer thinning equipment and a wafer thinning method. The wafer thinning equipment comprises a grinding device and an adsorption platform, the adsorption platform is used for bearing a wafer and driving the wafer to rotate, the grinding device is arranged above the adsorption platform in a lifting mode, and a grinding wheel used for grinding the wafer is arranged on the lower portion of the grinding device. The grinding wheel comprises a base material and a plurality of grinding blocks, and the grinding blocks are fixed to the base material through adhesive layers. The grinding block comprises spiral calcium carbonate containing a Si-O-Ca structure and is used for dispersing stress during grinding. According to the technical scheme, the problem that the flatness of the thinned wafer is poor in the prior art is solved.

A method for abrading comprises: providing an abrasive article (ART1), which comprises a machine-readable code (QR1), selecting a target result (RM1,T), retrieving a performance model (MODEL31,GEN1, MODEL41,GEN1) from a database (DBM) based on the code (QR1), determining one or more usage parameters (GM1,GEN1) from the target result (RM1,T) by using the performance model (MODEL31,GEN1, MODEL41,GEN1), and abrading with the first abrasive article (ART1) according to the determined usage parameters (GM1,GEN1)