371results about How to "High polishing precision" patented technology

A polishing apparatus is configured to simultaneously polish both surfaces of a work, and includes a pair of stools rotating in opposite directions, a pair of detecting units configured to detect rotation rates of the stools, a pressurizing unit configured to compress the work between the pair of the stools, a slurry supply unit configured to supply a slurry to the stool, and a control unit configured to reduce, when determining that a frictional force between the polishing surface and the work exceeds a threshold, at least one of a load applied by the pressurizing unit, the rotation rate of the stool, and a supply amount of the slurry supplied by the slurry supply unit.

The invention belongs to the technical field of materials, and particularly relates to a polishing solution for stainless steel surface machining. The polishing solution is prepared from, by weight, 10-15 parts of modified silicon dioxide pellets, 5-10 parts of metallic oxide, 0.5-1.5 parts of sodium benzoate, 1-3 parts of sodium hexametaphosphate, 3-5 parts of a pH conditioning agent, 5-8 parts of a surface active agent, 2-4 parts of a corrosion inhibitor, 1-3 parts of ethyl silicon oil, 5-10 parts of auxiliaries and the balance deionized water. The prepared polishing solution is easy to prepare, low in cost, good in polishing effect and high in polishing precision and polishing efficiency, and has the advantages of removing oil stain, resisting rust, being easy to clean and non-toxic, doing no harm to human bodies or environment and being suitable for large-scale production.

A polishing apparatus is configured to simultaneously polish both surfaces of a work and includes a sun gear provided around a rotational axis of one of a pair of polishing surfaces, a carrier having a hole configured to house the work, and including teeth so as to serve as a planetary gear which rotates and revolves around the sun gear, and a first dustproof mechanism that includes a first elastic member that contacts one surface of the carrier opposite to one of the polishing surfaces between the sun gear and the hole in the carrier.

To eliminate the unevenness of the film thickness of the wafers, and increase the polishing efficiency, reduce the running cost and enhance the production yield. A CMP apparatus 1 includes a film thickness measuring means 6 that measures the film thickness of the wafers before polishing, a polishing recipe preparing means 7 that prepares polishing conditions so that the polishing conditions such as polishing speed, polishing pressure, and the like for the wafers become optimal, a polishing time forecasting means that forecasts the polishing time of the wafer on the basis of the optimal polishing condition and the measured value, a polishing time measuring means that measures the actual polishing time of the wafer, and a computer 9 that controls the polishing condition on the basis of the measured value and the like of the polishing time. Further, the computer 9 includes a calculating unit 23 that calculate the difference between the measured value of the polishing time and the forecasted value thereof, and a polishing condition correcting/changing unit 24 that corrects/changes the polishing conditions so that the calculated difference becomes minimal, and thereby, the correction/change of the polishing conditions is carried out in real time.

The invention discloses a numerical control polishing method for the profile of a blade of an integrated blade disk. The method for selecting a polishing wheel, determining a polishing row pitch, planning a polishing route and making a program is adopted. The numerical control polishing method comprises steps of performing parametric modeling on the blade, partitioning the blade at equal intervals, fitting a line segment set and determining a polishing trace. The step of performing parametric modeling on the blade is performed in a direction vertical to a runner line; the step of partitioningthe blade at equal intervals is performed along the direction of the runner line, and a partitioning distance is a quarter of the diameter of the polishing wheel; partitioning points are interpolatedon each partitioning line of the profile of the blade at equal intervals; a distance between two adjacent position points is calculated by sequentially selecting two adjacent partitioning lines to obtain a fitted straight texture face; and the straight texture face produces an equal-interval face to determine the polishing trace. By the method, the characteristic of the profile of the blade is fitted fully, so that high contact between the polishing wheel and the profile of the blade is guaranteed; therefore, the precision of the profile of the blade of the integrated blade disk is ensured and the polishing efficiency of the integrated blade disk is improved.

In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

The invention provides a fragile hollow micro-sphere polishing machine and a polishing method, and belongs to the technical field of polishing. The polishing machine comprises a working table, a bottom disc, a top disc and an electric control system, and a cavity is arranged at the top end of the working table; the bottom disc and the top disc are arranged inside or above the cavity, and the rotation axis of the bottom disc and the rotation axis of the top disc are both arranged vertically; and the bottom disc and the top disc are driven by a motor; the top disc is arranged above the bottom disc, and at least one vertical through hole used for containing to-be-polished spheres is arranged on the top disc; and the electric control system is electrically connected with the motor and is used for controlling the rotating speed of the motor. The polishing method is used in the polishing machine, the bottom disc and the top disc are rotated at the same time to achieve speed changing and/or direction-changing motion of the to-be-polished spheres, polishing is achieved though relative friction of the to-be-polished spheres at random, the polishing accuracy is higher, and the polishing machine and the polishing method are particularly suitable for fragile hollow micro-spheres with poor mechanical strength.

The invention discloses a Schmidt roof prism processing method and a positioning tool thereof, and belongs to the technical field of optical prisms. In the positioning tool, a first backrest positioning block with a first backrest positioning surface and a second backrest positioning block with a second backrest positioning surface are fixed on the upper surface of a substrate, the first backrestpositioning surface and the second backrest positioning surface are perpendicular to the upper surface of the substrate, and a prism side processing block is positioned above the substrate and provided with a prism side processing surface perpendicular to the upper surface of the substrate. The processing method includes the steps: firstly, processing a first side surface of a prism, and positioning and processing a second side surface of the prism through the positioning tool; secondly, positioning and initially processing two roof surfaces through the positioning tool; finally, taking one roof surface as a standard to grind the other reference surface, and enabling the accuracy of a roof angle to be within 1''. According to the method, process steps are optimized without changing an existing processing device, the method ensures that the processed roof angle is within 1'', the accuracy of surfaces is high, technical requirements are low, and production efficiency is high.

The invention discloses an abrasive fiber polishing disk which comprises a lower installation disk, an upper installation disk and an abrasive fiber bundle, wherein, a plurality of holes are alternately arranged in the peripheral direction of the upper installation disk, and the upper installation disk is detachably arranged on the lower installation disk; and the abrasive fiber bundle is formed by a plurality of the fiber bundles with abrasive and is arranged in the holes of the upper installation disk. The embodiment of the invention can further improve the polishing effect, simplify the process, lower the energy consumption, save the cost and prolong the service life of the polishing disk. The invention further discloses a polishing machine with the abrasive fiber polishing disk and a polishing method using the same.

The invention discloses cerium oxide polishing powder. The purity TREO of cerium oxide CeO2 is more than or equal to 99.95%; cerium oxide is CeO2 powder with crystal form being a uniphase cubic crystal system; cerium oxide is shaped like a round cake with the average particle size of 1mum. The invention further discloses a preparation method for the cerium oxide polishing powder. The preparation method comprises the steps of preparation of cerium chloride, precipitation, dehydration, roasting, smashing and the like. Compared with the existing preparation method, the polishing powder prepared by adopting the method is cerium oxide powder, F is not required for introduction in the preparation process, and the preparation method has the advantages of being simple in process, low in cost, and free from waste water; the cerium oxide polishing powder has the advantages of having no scratch in the polishing process of products, being high in polishing precision and the like.

A hemispherical harmonic oscillator flow channel constraint-shear rheological polishing method comprises the following steps that (1) a non-Newtonian fluid polishing solution with the shear rheological effect is prepared and added into a polishing solution station; (2) a hemispherical harmonic oscillator is connected to a polishing machine workpiece spindle through a clamp, and the rotation axis of the hemispherical harmonic oscillator is adjusted to be coaxial with the rotation axis of the workpiece spindle; (3) the spherical surface of a polishing head is adjusted to be concentric with the spherical surface of the hemispherical harmonic oscillator, and a polishing solution circulating system is started; and (4) the workpiece spindle is started, the polishing head rotates relative to thehemispherical harmonic oscillator, the polishing solution forms two shear rheological flow fields in gaps between a constraint flow channel and the surface of the polishing head-harmonic oscillator, and efficient polishing of the hemispherical harmonic oscillator is achieved by controlling the flow speed of the polishing solution and the rotating speed of the workpiece spindle. A hemispherical harmonic oscillator flow channel constraint-shear rheological polishing device is provided. By means of the hemispherical harmonic oscillator flow channel constraint-shear rheological polishing method and device, on the premise that the grinding surface shape precision of the hemispherical harmonic oscillator is kept, a damage layer on the grinding surface can be efficiently removed, and efficient and high-quality polishing is achieved.

The present invention provides an apparatus and a method for polishing a substrate having a film formed thereon. The method includes: rotating a polishing table supporting a polishing pad by a table motor; pressing the substrate against the polishing pad by a top ring; obtaining a signal containing a thickness information of the film; producing from the signal a polishing index value that varies in accordance with a thickness of the film; monitoring a torque current value of the table motor and the polishing index value; and determining a polishing end point based on a point of time when the torque current value has reached a predetermined threshold value or a point of time when a predetermined distinctive point of the polishing index value has appeared, whichever comes first.

The invention discloses an aluminum oxide polishing powder and a production method thereof. The aluminum oxide polishing powder is characterized in that a D50 particle size is smaller than 2.0 microns and satisfies that D10 is no less than 0.5 times of D50, D90 is no more than 2 times of D50 and D100 is no less than 3 times of D50. The preparation method comprises the following steps of pulping raw materials of alpha-aluminum oxide with water, carrying out classification and obtaining a product. The aluminum oxide polishing powder has the advantages of small median particle diameter, narrow granularity distribution range, easy control of the polishing accuracy stability and small fluctuation of the product quality, can be used for accurate polishing processing of electronic product components including glasses for liquid crystal display screens, flat plane displays, optical elements, ultrathin glass substrates and glass magnetic discs and can also be used for preparing aluminum oxide polishing solution for polishing chemical machinery.

A polishing apparatus includes: a polishing table 12 for holding a polishing pad; a first electric motor 14 that rotationally drives the polishing table 12; a first rotary joint 40 that has a rotating body 41 that is rotationally driven by the first electric motor 14, a housing 42 provided around the rotating body 41, and a seal portion 44 that seals between the rotating body 41 and the housing 42; a second current sensor 31 that detects a current which is correlated with driving load of the first electric motor 14; a friction detecting unit 50 that detects sliding friction in the seal portion 44 of the first rotary joint 40; and an end point detecting apparatus 60 that detects a polishing end point of the polishing target on the basis of the current and the sliding friction.

The invention discloses a double-face polishing machine for a large-caliber optical element, and belongs to the technical field of optical element machining. An upper polishing disc structure capable of swinging and rotating is adopted, an upper polishing disc carries out swing polishing and annular polishing on a workpiece at the same time, the polishing efficiency is improved, the polishing track becomes more uniform, and the problem that side treading and corner uplifting are likely to appear in the surface shape is solved; a lower polishing disc carries out annular polishing on the lower surface of the workpiece, a correction disc is adopted to carry out correction keeping on the surface shape of the lower polishing disc, the surface shape precision of the polishing discs is improved, the surface shape precision of the optical element is improved, and the small-size manufacturing error of the optical surface can be reduced; an adjustable clamp structure is adopted, adjustable technology parameters are increased, the polishing rack is further uniform, and the double-face polishing precision and the production efficiency are improved; the polishing machine is suitable for double-face polishing of the large-caliber optical element with the caliber reaching 600 mm and the special requirements for the depth of parallelism, reflective wavefront and transmission wavefront.

The invention discloses a five-shaft numerical control polishing machine. The five-shaft numerical control polishing machine comprises a machine base, an electric box, a hood, a sliding door, an operation panel, an alarming light, a Y-shaft servo module mechanism, an X-shaft servo module mechanism, a Z-shaft rotating mechanism, a jig, an upright post mechanism, a rotating power mechanism, a wax spraying gun and a wire passing pipe. According to the five-shaft numerical control polishing machine, hardware products can be horizontally moved and longitudinally moved, accurate polishing processing treatment can be carried out on the hardware products of different sizes, swinging polishing of different angles can be carried out on the hardware products, a polishing wheel can perform rotating polishing on the hardware products in different directions under driving of the rotating mechanism, three-dimensional polishing can be carried out on the hardware products, polishing effect is good, polishing precision is high, the problems of polished products that chamfers are sunken, local colors are inconsistent, and colors of the products are different are solved, polishing efficiency is high, the five-shaft numerical control polishing machine is suitable for polishing of the hardware products of different sizes, entire polishing process is operated fully automatically, and utilization is convenient and quick.

The invention relates to a meter-stage large-opening-diameter optical element CO2 laser polishing device. On the basis that an optical element does constant-speed motion on a worktable, laser penetrates through a hole in a support, through a reflecting mirror, a light beam is transmitted to a vibrating mirror system composed of a vibrating mirror and a focusing mirror, machining of the optical element is systematically achieved, the reflecting mirror, the vibrating mirror and the focusing mirror which are integrated are mounted on the support and do linear motion in the direction where the laser is incident from the hole, light path transmission cannot be affected by motion of the vibrating mirror system, motion track rough positioning formed by worktable motion and vibrating mirror systemmotion can be achieved well, the self motion of the vibrating mirror system achieves precise positioning of the motion track, according to the device, through the manner of spiral track machining andchanging of parameters, the optical element is scanned, through a fusion and gasifying combined manner, the surface of the optical element is polished, and the device can achieve linear or circumference motion of the meter stage or above.

The invention discloses a motor shaft fully automatic polishing machine, which comprises a machine frame, wherein a material feeding conveying machine is arranged in front of the machine frame and is connected with a material conveying device arranged on a machine frame table top; a mechanical hand used for clamping processing parts is arranged on the material conveying device in an array way; an inner circle grinding device is arranged right behind the mechanical hand; an outer circle grinding device is arranged right above the mechanical hand; a discharging device is arranged at the side edge of the machine frame; the material conveying device comprises a mechanical hand, a connecting plate and a feeding big air cylinder; the inner circle grinding device comprises a telescopic air cylinder, a first motor and a cutter rotating rod, the outer circle grinding device comprises a grinding wheel, a second motor, a movable frame, a fixed frame, a feeding motor and a height air cylinder; the discharging device comprises a fixed recessed plate and a movable recessed plate; the bottom of the movable recessed plate is connected with an upper pushing air cylinder; the upper pushing air cylinder is connected with a lateral pushing air cylinder. The motor shaft fully automatic polishing machine has the advantages that the mass fully automatic polishing on the motor shaft can be realized; the polishing precision is high; the efficiency is high; the processing precision of a bearing can be greatly improved; the processing speed of the bearing can be greatly accelerated.

The invention provides hand-imitating silicon carbide dissociating abrasive polishing equipment and method. The equipment comprises a robot base, a robot, an end-of-arm tool, a workpiece placing tableand a clamping mechanism, wherein the end-of-arm tool is composed of a connecting flange, a spindle holding seat, a high-speed spindle and a wool wheel and is used for polishing a silicon carbide part, the required optimal speed can be obtained by changing the rotating speed of the high-speed spindle, and the wool wheel can be replaced with a diamond grinding wheel so as to grind the part. The clamping mechanism is fixed on the workpiece placing table and used for positioning and clamping the silicon carbide part, and the clamping mechanism comprises a fixed part, a movable part, a telescopiccylinder used for enabling the movable part to act, a guide rail and a sliding block, wherein the telescopic cylinder is fixed to the workpiece placing table through a mounting support, the part canbe quickly clamped and positioned, the fixed part and the movable part are provided with rubber, and thus the silicon carbide part can be prevented from being damaged during clamping.

A high-precision automatic polishing device comprises a tool driving system, a guide rail and adjusting system, a workpiece driving and adjusting system, an on-machine detecting system and a tool finishing system. According to the device, precise oilstone serves as a polishing tool, and precision finishing is conducted on the working surface of the oilstone through tri-plane mutual abrasion; an adjustable-speed motor drives the oilstone supported by an oilstone retaining rack elastically to conduct autorotation-free revolution on the guide rail working surface by means of a parallelogram mechanism with passive constraint; the guide rail working surface of the oilstone is adjusted to be aligned with the bus of a workpiece by means of a ball micrometer head; the bus, aligned with the guide rail surface, of the shaft workpiece is also subjected to precise machining while the guide rail surface of the oilstone is polished, and a driving workpiece rotates around a high-precision center hole to machine the shaft workpiece. By the adoption of the device, the precision reaches the submicron order, the number of error sources is small, automatic continuous micro-feeding is achieved, polishing precision is high, the guide rail flatness error, shaft part total run-out error and surface roughness can be reduced at the same time, and on-machine polishing and precise repair can be achieved.