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Hemispherical harmonic oscillator flow channel constraint-shear rheological polishing method and device

A hemispherical resonator and resonator technology, used in surface polishing machine tools, grinding/polishing equipment, metal processing equipment, etc., can solve problems such as low efficiency, poor surface quality, and low precision, and achieve high polishing efficiency, flow Road structure optimization, the effect of small normal force

Pending Publication Date: 2020-12-22
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the deficiencies of low precision, poor surface quality and low efficiency of the prior art hemispherical harmonic oscillator polishing method, the present invention provides a hemispherical harmonic oscillator channel constraint-shear with high precision, high surface quality and high efficiency. Tangential rheological polishing method and device

Method used

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  • Hemispherical harmonic oscillator flow channel constraint-shear rheological polishing method and device
  • Hemispherical harmonic oscillator flow channel constraint-shear rheological polishing method and device
  • Hemispherical harmonic oscillator flow channel constraint-shear rheological polishing method and device

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Embodiment 1

[0035] refer to Figure 1 to Figure 6 , a hemispherical harmonic oscillator channel confinement-shear rheological polishing method, comprising the following steps:

[0036] (1) Prepare non-Newtonian fluid polishing fluid 7 with shear rheological effect. The non-Newtonian fluid base fluid is a non-Newtonian fluid composed of polyhydroxy polymer and water. The abrasive is selected from 3000# diamond and aluminum oxide mixed abrasives, and the concentrations are respectively 5% and 12%, the additives are selected from guar gum and potassium sorbate, and the prepared polishing solution is added to the polishing solution station 9;

[0037] (2) The hemispherical resonator 3 is glued on the hemispherical resonator 3 with the circular plane on the thin-walled edge of the hemispherical resonator as the positioning surface. Figure 6On the fixture 2 shown, it is required that the flange transfer surface of the fixture is perpendicular to the axis of the fixture. The fixture 2 is trans...

Embodiment 2

[0048] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the abrasive grains in the shear rheological polishing fluid 7 described in step (1) are aluminum oxide, diamond, silicon carbide, silicon oxide, cerium oxide, boron carbide, One or a mixture of at least two of zirconia, the additives include one or a mixture of at least two of dispersants, surfactants, pH regulators, and chemical active agents. Other steps and parameters are the same as in Example 1.

Embodiment 3

[0049] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the connection mode between the hemispherical resonator 3 and the fixture 2 in step (2) is vacuum adsorption or self-centering chuck clamping. Other steps and parameter are identical with embodiment 1 or 2.

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Abstract

A hemispherical harmonic oscillator flow channel constraint-shear rheological polishing method comprises the following steps that (1) a non-Newtonian fluid polishing solution with the shear rheological effect is prepared and added into a polishing solution station; (2) a hemispherical harmonic oscillator is connected to a polishing machine workpiece spindle through a clamp, and the rotation axis of the hemispherical harmonic oscillator is adjusted to be coaxial with the rotation axis of the workpiece spindle; (3) the spherical surface of a polishing head is adjusted to be concentric with the spherical surface of the hemispherical harmonic oscillator, and a polishing solution circulating system is started; and (4) the workpiece spindle is started, the polishing head rotates relative to thehemispherical harmonic oscillator, the polishing solution forms two shear rheological flow fields in gaps between a constraint flow channel and the surface of the polishing head-harmonic oscillator, and efficient polishing of the hemispherical harmonic oscillator is achieved by controlling the flow speed of the polishing solution and the rotating speed of the workpiece spindle. A hemispherical harmonic oscillator flow channel constraint-shear rheological polishing device is provided. By means of the hemispherical harmonic oscillator flow channel constraint-shear rheological polishing method and device, on the premise that the grinding surface shape precision of the hemispherical harmonic oscillator is kept, a damage layer on the grinding surface can be efficiently removed, and efficient and high-quality polishing is achieved.

Description

technical field [0001] The invention belongs to precision ultra-precision processing technology, in particular to a hemispherical harmonic oscillator shear rheological polishing method and device. Background technique [0002] The hemispherical resonator is the core part of the hemispherical resonant gyroscope, and its processing quality directly restricts the performance of the gyroscope device and system. The hemispherical resonator is a special-shaped part, using hard and brittle materials such as high-purity fused silica and sapphire. The main structure is a hemispherical shell with a central support rod (anchor), which is small in size and thin in wall. The main technical indicators of its processing include sphericity, coaxiality, surface quality, uniformity of thickness distribution in the circumferential direction, etc. At present, hemispherical harmonic oscillators are mostly prepared by milling, fine grinding, and polishing processes: milling to obtain rough parts...

Claims

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Application Information

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IPC IPC(8): B24B1/00B24B29/02B24B57/02B24B57/00
CPCB24B1/00B24B29/02B24B57/00B24B57/02
Inventor 王金虎洪腾袁巨龙吕冰海陈泓谕王旭杭伟王思学
Owner ZHEJIANG UNIV OF TECH
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