94 results about "Harmonic oscillator" patented technology

The invention discloses a hemispherical gyroscope phase-locking control optimization method and device, and the method comprises the steps: changing the vibration mode azimuth angles of a hemispherical resonator gyroscope, collecting the phase-locking frequency in real time for each vibration mode azimuth angle, and calculating the phase-locking optimization control force in real time according to the collection result, substituting the phase locking frequency and the phase locking optimization control force into an electrode driving excitation model to calculate a driving signal in real time and transmit the driving signal to a driving electrode, and after the phase locking frequency is stable, collecting a stable phase locking optimization control force corresponding to the vibration mode azimuth angle; according to all the vibration mode azimuth angles and the corresponding stable phase-locking optimization control force, constructing a relation model of the two, solving the relation model to obtain phase-locking optimization parameters, calculating the phase-locking optimization control force according to the phase-locking optimization parameters and the relation model, and substituting the phase-locking optimization control force into an electrode driving excitation model to calculate a driving signal. Therefore, the compensation for the driving signal when the hemispherical resonator gyroscope works normally is realized. According to the invention, the influence of the circumferential frequency difference on the output precision of the harmonic oscillator can be eliminated.

The invention discloses a hemispherical harmonic oscillator inner surface processing path correction method, a hemispherical harmonic oscillator inner surface processing method and a hemispherical harmonic oscillator inner surface processing device. The correction method comprises the following steps: processing the inner surface of a hemispherical harmonic oscillator test article based on a set processing path; measuring the radius of the inner sphere of the processed test article, calculating the deviation of the radius of the inner sphere based on the measured value and the design size, obtaining the compensation amount of the Z-axis direction of the processing route based on the deviation, and performing reverse compensation on the Z-axis coordinate of the terminal point of the processing route to obtain a first corrected processing route; reprocessing the hemispherical resonator test article based on the first correction processing route; and measuring the diameter of an inner support column of the test article, calculating translation deviation based on a measured value and a design size, taking the translation deviation as the compensation amount of the X-axis direction of the machining route, and performing reverse compensation on the X-axis coordinates of all points of the first correction machining route to obtain a second correction machining route. The machining method can ensure that the size and the geometrical shape of the machined hemispherical harmonic oscillator are within the design tolerance range.

The hemispherical harmonic oscillator grinding and polishing integrated device comprises an X feeding motion shaft moving in the X direction and a Z feeding motion shaft moving in the Z direction, and a workpiece main shaft used for clamping a hemispherical harmonic oscillator workpiece is installed on a sliding table of the X feeding motion shaft. A tool spindle used for clamping a grinding tool or a polishing tool is installed on the sliding table of the Z feeding motion shaft, a tool setting measuring head is further installed on the sliding table of the X feeding motion shaft, and the position where the tool setting measuring head is located serves as a tool setting point to achieve automatic tool setting after the grinding tool or the polishing tool clamped by the tool spindle is replaced. According to the invention, shafting linkage as few as possible is used on the same device to complete the processes of grinding, polishing and the like of all structures of the harmonic oscillator, so that the workpiece machining error caused by tool size, form and position errors or abrasion can be overcome, and the influence of grinding / polishing force fluctuation on the machining consistency can also be overcome; and the precision, the production efficiency and the yield of workpieces can be effectively improved and guaranteed.

The invention relates to a hemispherical resonator and hemispherical gyroscope parameter and defect identification system and method, and belongs to the technical field of hemispherical resonator gyroscopes. According to the invention, automatic identification of damping non-uniformity, rigidity non-uniformity and 1-3-order quality defect parameters is respectively carried out on the fused quartz hemispherical resonator before and after film coating and the gyroscope header after base assembly, so that the full-flow coverage test of the hemispherical resonator gyroscope is realized; various parameters are identified in the whole process from harmonic oscillator machining forming to the gauge outfit state, the testing precision, the system reusability, the operation convenience and consistency are greatly improved, and the production efficiency is improved.

The invention discloses a detection device and a detection system for harmonic oscillator capacitors of a hemispherical resonator gyroscope, and relates to the technical field of capacitor detection, the detection device comprises a signal detection circuit, a modulation compensation circuit, a differential amplification circuit and a control circuit, the signal detection circuit is connected with the output ends of the two harmonic oscillator capacitors; the modulation compensation circuit is correspondingly connected with two input ends of the signal detection circuit; the differential amplification circuit is correspondingly connected with two output ends of the signal detection circuit; the control circuit is configured to output modulation voltage to the two input ends of the modulation compensation circuit according to a voltage signal of the output end of the differential amplification circuit, and zero setting is carried out on voltage at the connecting positions of the two output ends of the modulation compensation circuit and the two input ends of the signal detection circuit. According to the invention, the modulation compensation circuit is adopted to enable the output ends of the two harmonic oscillator capacitors to work near zero voltage, the circuit has the characteristics of ultrahigh linearity, extremely low temperature drift, rapidness and stability, errors caused by power supply drift can be eliminated, and the detection precision is improved.

The invention discloses a laser ablation and parameter optimization system and method for a hemispherical harmonic oscillator. The system comprises a laser, a control system, a frequency difference test module, a vacuum cavity, and an electric rotating base, a working platform, a vibration test clamp, an electric control excitation hammer and a vibration stopping damper which are arranged in the vacuum cavity, the working platform is mounted on the electric rotating base; the vibration stopping damper, the vibration testing clamp and the electrically-controlled excitation hammer are all installed on the working platform. By means of the parameter optimization method of the ablation system, the fitting matching degree is judged according to experimental samples added in real time, and the fitting function is dynamically updated. Laser trimming parameters are determined according to the fitting function, the accuracy of the ablation amount is guaranteed, and the trimming efficiency and convergence are improved. The method is widely suitable for the size of the harmonic oscillator, and provides technical support for engineering development of the high-precision hemispherical harmonic oscillator.

A recurrent neural network includes a plurality of n damped harmonic oscillators (DHOi), each of the n damped harmonic oscillators being one cell (nci) of the neural network, an input unit (IU) that receives and inputs time-series input data (S (t)), a recurrent connection unit (RCU) that includes, for each of the cells (nci), at least one connection (wi,j) between the input / output node (IOi) of the corresponding cell (nci) and the input / output node (IOj) of at least another one of the cells (ncj) for transmitting the resulting damped harmonic oscillation (hi) output from the input / output node of the corresponding cell (nci) to the input / output node of the another one of the cells (ncj).

The invention discloses a hemispherical resonator three-dimensional quality finishing system and method, and the method comprises the steps: measuring the spherical thickness error data of a hemispherical resonator, decomposing the spherical thickness error data into a harmonic thickness error, selecting an ion beam diameter, and obtaining a corresponding removal function; carrying out edge continuation equivalent to the diameter of the removal function on the harmonic thickness error data to obtain a thickness error matrix, expanding the dimension of the removal function to be the same as the dimension of the thickness error matrix to obtain a material removal matrix, and correcting the thickness error matrix according to an incident angle of the removal function; residence time is solved according to the corrected thickness error matrix and the material removal matrix, then path planning is carried out according to the residence time, a machining G code is generated, and finally the machining G code is used for machining the hemispherical harmonic oscillator. The invention provides an efficient trimming method for harmonic oscillator spherical surface annular domain thickness errors, and solves the problems that coupling vibration is difficult to decouple and three-dimensional mass error distribution cannot be identified during quality trimming according to performance test feedback in a traditional method.

In order to solve the problems that in an existing hemispherical harmonic oscillator quality leveling technology, the inherent rigid axis positioning efficiency is low, and manual intervention is relied on, the invention provides a method for rapidly positioning the azimuth of an inherent rigid axis of a hemispherical harmonic oscillator based on pulse broadband excitation and quasi standing wave response and a corresponding leveling device. Through an analytical expression of a main standing wave and an auxiliary wave in a second-order four-amplitude resonance working mode, a double-excitation vibration stopping system (comprising two knocking hammers and a vibration stopping hammer with the azimuth difference of 22.5 degrees odd times) is ingeniously designed, and the azimuth of an inherent rigid shaft is quickly positioned by combining orthogonal detection signals. According to the method, the limitation on the excitation direction and the detection direction is relaxed, and through the design of the vibration stopping hammer, the positioning efficiency of the inherent rigid shaft is improved, and the extraction precision of residual vibration on the characteristic parameters can be avoided. The formed hemispherical resonator leveling device provides reliable technical support for batch production of high-precision hemispherical resonator gyroscopes.

The invention discloses an automatic compensable grinding and polishing machining method for a hemispherical harmonic oscillator. The method comprises the steps that a diamond grinding wheel with the first granularity is used for conducting generating method machining on a workpiece according to the first feeding speed; replacing a diamond grinding wheel with a second granularity, performing tool setting to obtain an actual position of machining feeding, and performing generating method machining on the workpiece again according to a second feeding speed from the actual position; the polishing wheel is replaced, tool setting is carried out to obtain the actual position of machining feeding, generating method force control polishing is carried out on the workpiece from the actual position, workpiece in-place measurement is carried out after polishing, compensation polishing is carried out according to the in-place measurement result till the requirement is met, and the hemispherical harmonic oscillator is obtained. The problem of automatic tool changing in the generating method hemispherical harmonic oscillator machining process can be solved, the tolerance requirement for tool manufacturing is lowered, the process time is saved, the machining procedure is completed on the premise of one-time clamping, and the requirement for coaxiality among an inner ball, an outer ball and a supporting rod of a workpiece is met.

Disclosed are a quantum state preparation method and apparatus, which belong to the field of quantum computing. The method comprises: using different spin states as targets, and sequentially performing two instances of quantum state preparation on a harmonic oscillator; performing spin state detection on a spin state corresponding to the harmonic oscillator; and when the spin state does not meet a condition, repeating the quantum state preparation and the spin state detection until the spin state meets the condition, so as to obtain a harmonic oscillator of a target quantum state. By means of a cyclic process involving quantum state preparation and spin state detection, it is ensured that a harmonic oscillator is finally prepared into a target quantum state, thereby ensuring the preparation effect.

A film coating process optimization method for improving uniformity of a film on the inner wall of a hemispherical resonator comprises the steps that a finite element simulation model in the film coating process of the hemispherical resonator is established, and multi-angle deposition parameters are obtained; discretizing the process into a time step sequence, and establishing an accumulated film thickness state space; a reinforcement learning framework based on near-end strategy optimization (PPO) is constructed, a state space is designed as the current accumulated film thickness and distribution, and an action space is an optimal angle selected from predefined deposition angles; generating an action strategy through a neural network, and performing iterative optimization to a target thickness; defining a reward function to minimize film thickness uniformity as a target; dynamically adjusting a deposition angle selection strategy; and an optimal strategy with the minimum film thickness uniformity value is screened out, and a corresponding deposition angle and a time distribution scheme thereof are output. The deposition angle and time distribution are dynamically optimized through reinforcement learning, the non-uniformity of the film thickness is remarkably reduced, and the method is suitable for film coating process optimization of harmonic oscillators of different sizes.

The invention discloses a motion signal processing method and device of a metal resonator gyroscope. The method comprises the following steps: acquiring a capacitance change signal caused by vibration of a metal harmonic oscillator of the metal resonant gyroscope as a detection signal; the detection signal is demodulated through reference signals, a first component and a second component are obtained, and the reference signals are sine and cosine signals generated through the direct digital synthesis technology; performing low-pass filtering on the first component and the second component respectively, extracting a direct current component to obtain a first filtering signal, and performing dynamic suppression on a frequency component of a corresponding resonance interference frequency band in the first filtering signal by using an adaptive notch filter to obtain a second filtering signal; calculating the amplitude information of the detection signal based on the second filtering signal, and taking the amplitude information as the amplitude of the motion signal of the metal resonator gyroscope. According to the invention, the technical problem that the motion signal extraction precision of the metal resonator gyroscope is low is solved.

The invention discloses an electrostatic tuning optimization method and device for a metal resonator gyroscope. The method comprises the following steps: establishing a dynamic model based on structural symmetry disturbance and a coupling stiffness effect; based on the dynamic model, calculating modal frequency distribution of the metal resonator gyroscope under different azimuth angles to obtain modal frequency difference data, and based on the modal frequency difference data, constructing an equivalent stiffness distribution model, and quantifying stiffness nonuniformity of the resonant structure to obtain a stiffness matrix; based on the stiffness matrix, voltage control parameters corresponding to the azimuth angles are obtained, the voltage control parameters are applied to the multiple electrostatic tuning electrodes, and an optimized stiffness matrix is obtained; and recalculating the modal frequency of the metal harmonic oscillator based on the optimized stiffness matrix. The invention solves the technical problem that the prior art is mainly suitable for the inertial device before or after packaging but is difficult to effectively eliminate the frequency cracking after packaging.

The invention discloses a hemispherical harmonic oscillator grinding process optimization method based on a laser Doppler vibration meter, relates to the technical field of ultra-precision machining, and aims to solve the problems of difficulty in tool setting of a small-diameter ball head grinding wheel and a hemispherical harmonic oscillator blank and difficulty in real-time monitoring of the grinding condition in the machining process in an existing method. Comprising the steps that a hemispherical harmonic oscillator grinding machine tool is controlled to enable a small-diameter ball head grinding wheel to approach all key parts on the surface of the hemispherical harmonic oscillator to conduct tool setting operation, a laser Doppler vibration meter collects vibration signals of the hemispherical harmonic oscillator, tool setting position coordinates are determined according to the occurrence moment of the vibration signals, and a small-diameter ball head grinding wheel machining track of the hemispherical harmonic oscillator is constructed; the hemispherical harmonic oscillator is ground according to the grinding wheel machining track, the vibration signal of the hemispherical harmonic oscillator in the grinding process is collected through the laser Doppler vibration meter, the grinding state of the hemispherical harmonic oscillator is analyzed according to the specific frequency in the vibration signal, and the method is easy and convenient to implement and high in accuracy.

The invention belongs to the technical field of precision machining, and relates to a control method for optimizing and uniformly removing a hemispherical harmonic oscillator polishing flow channel tool head, which comprises the following steps of: 1, machining a flow channel base; step 2, establishing a model capable of uniformly removing a height runner on the surface of the workpiece; 3, analyzing and calculating the linear velocity of the hemispherical surface to obtain the linear velocity distribution of the surface of the workpiece in the polishing process; 4, constructing a stress distribution model influencing spherical polishing; 5, according to the linear velocity and pressure distribution modeling of the surface of the polished workpiece and the material removal height, a proper machining gap between the runner and the workpiece is obtained through calculation; according to the method, the wall surface geometrical shape of the polishing flow channel is accurately optimized, the flow field characteristics are actively regulated and controlled, cooperative matching of workpiece surface pressure distribution and a fluid velocity field is achieved, and therefore the uniformity of workpiece surface material removal by a polishing medium is remarkably improved.

The application discloses a rate integration hemispherical resonator gyro angular rate output method, and belongs to the technical field of inertial technology. The application is aimed at solving the problem of large measurement noise of standing wave azimuth angle and poor gyro output precision in the existing rate integration hemispherical resonator gyro control method. In the application, the inherent working frequency of the gyro is taken as the initial value of the forward traveling wave frequency and the reverse traveling wave frequency, and the reference signals of the forward traveling wave and the reverse traveling wave are calculated and obtained; the reference signals are used to demodulate the electrode detection signals by using a low-pass filter, and the secondary demodulation quantity of the gyro angular rate is obtained by using the primary demodulation quantity; the phase difference between the forward traveling wave and the reverse traveling wave of the two groups of electrode detection signals and the forward traveling wave and the reverse traveling wave reference signals is calculated; the forward traveling wave and the reverse traveling wave reference signals are used to calculate the closed-loop real-time tracking of the forward traveling wave and the reverse traveling wave of the hemispherical resonator, and the sensitive axis angular rate measurement value of the rate integration hemispherical resonator gyro is calculated. The application is used for the angular rate output control of the rate integration hemispherical resonator gyro.

The invention relates to a three-axis gyroscope, in particular to a full-decoupling nested wheel ring monolithic three-axis MEMS gyroscope chip, which comprises a harmonic oscillator part and an electrode part, the harmonic oscillator part comprises a wheel structure and a ring structure, the wheel structure comprises a circular anchor block, an annular frame A coaxially arranged on the outer side of the circular anchor block in a sleeving mode and an annular frame B coaxially arranged on the outer side of the annular frame A. Four arc-shaped frames are arranged between the annular frame B and the annular frame A. An arc-shaped mass block is arranged in each arc-shaped frame. The ring structure comprises N annular mass blocks, eight arc-shaped anchor blocks B and eight groups of straight suspension beams B, the N annular mass blocks are sequentially and coaxially arranged on the outer side of the annular frame B in a sleeving mode from inside to outside, the eight arc-shaped anchor blocks B are all connected to the inner side face of the annular mass block located on the innermost side, and each group of straight suspension beams B comprises N-1 straight suspension beams B. The three-axis gyroscope solves the problems that an existing three-axis gyroscope is poor in reliability and low in measurement precision, and is suitable for high-precision and advanced fields such as military navigation and automatic driving.

The application discloses a kind of based on CadencePspice software's hemispherical resonator gyro circuit model, is realized by calling the built-in element of CadencePspice software;Including: drive module, for providing an excitation signal;First conversion module, for converting excitation signal into the first signal f (x) representing x-axis electrostatic force;First simulation module, for simulating the second signal x representing the vibration displacement of x-axis and y-axis based on first signal f (x), third signal y;Second simulation module, for simulating the change of the capacitance value between resonator and detection electrode based on second signal x and third signal y, ninth signal v0, tenth signal v90, eleventh signal v45, twelfth signal v135;And second conversion module, for carrying out charge amplification processing based on ninth signal v0, tenth signal v90, eleventh signal v45, twelfth signal v135 and output corresponding detection signal.The application can improve the accuracy of simulation.

The invention provides a hemispherical resonator gyroscope error harmonic wave identification method and a hemispherical resonator gyroscope error harmonic wave identification device. The hemispherical resonator gyroscope comprises a hemispherical resonator and an electrode for vibration excitation and vibration displacement detection. The method comprises the following steps: applying electric excitation to the electrode of the hemispherical resonator gyroscope; detecting and resolving electric signals of different electrodes to obtain a displacement relationship between a working mode and a coupling mode of the standing wave shaft vibration of the hemispherical harmonic oscillator under a preset circumferential angle; enabling a standing wave axis of the hemispherical resonator to traverse the whole circumference by controlling the working mode of the hemispherical resonator gyroscope, so as to obtain a displacement relationship between a working mode and a coupling mode under different circumferential angles; the size of error harmonics and circumferential azimuth information of the hemispherical resonator gyroscope are extracted according to the displacement relation between the working mode and the coupling mode under different circumferential angles.

The invention relates to the technical field of pressure detection, in particular to a quartz pressure sensor with double harmonic oscillators orthogonal in crystal axis, which comprises two quartz end caps, and a positive partial harmonic oscillator, a quartz ring and a negative partial harmonic oscillator which are arranged between the two quartz end caps, the positive partial harmonic oscillator and the negative partial harmonic oscillator are respectively bonded with two ends of the quartz ring, and the internal force transmission beams of the positively biased harmonic oscillator and the negatively biased harmonic oscillator are in an orthogonal vertical relationship to form an orthogonal double harmonic oscillator. Compared with a quartz vibrating diaphragm type pressure sensing structure in the market, the pressure sensor adopts the design of the orthogonal double harmonic oscillators, and the sensitivity of the pressure sensor is effectively improved by utilizing the characteristic that the force frequency coefficients of the two harmonic oscillators are opposite.

The invention belongs to the technical field of precision machining, and relates to a hemispherical harmonic oscillator porous flow channel device for improving abrasive particle material flow field intensity, which comprises a profiling flow channel module, and the profiling flow channel module is composed of a Gyandroid minimal curved surface porous structure profiling flow channel main body and a flow channel nozzle base, the specific structure is as follows: a Gyandroid minimum curved surface porous structure is a profiling runner main body structure, the porous structure is formed by stacking and connecting Gyandroid minimum curved surface cell elements with uniform density layer by layer, and the porosity of the porous structure can be selected as 30%, 50% and 70% respectively; a flow channel base is machined, the exterior of the flow channel base is of a columnar structure, a conical through hole is formed in the columnar structure, the inner wall of the conical through hole is of a threaded structure, and a profiling module is fixed to the base; geometric parameters of a polishing channel are precisely adjusted, an internal fluid path is improved, stress on the surface of a workpiece is more uniform, and then the polishing efficiency of a polishing material on the surface layer of the workpiece is enhanced.

Provided are: a vibration portion having a base portion having a front end and a rear end facing the front end, and a plurality of vibration arms having fixed ends connected to the front end of the base portion and extending in a direction away from the front end, the plurality of vibration arms including at least one first vibration arm and a pair of second vibration arms on both sides of a first vibration arm group including the at least one first vibration arm in a direction crossing a long side direction; a holding portion provided at least partially around the vibration portion; and a holding arm having one end connected to the base portion and the other end connected to the holding portion, the plurality of vibration portions each having a piezoelectric film, and a lower electrode and an upper electrode facing each other with the piezoelectric film interposed therebetween, and a connection wiring connecting the upper electrodes of the pair of second vibration arms to each other is provided in a region of at least one of the base portion and the holding arm.

A kind of special adjusting frame for hemispherical resonator coating stress detection and its detection method, the adjusting frame includes three-jaw chuck, axial and transverse rotary table, two-dimensional and three-dimensional displacement table and spectral confocal probe, can firmly hold resonator and realize its accurate adjustment and rotation in multiple dimensions, ensure that resonator and rotating shaft are concentric;Detection method includes using spherical interferometer to detect the surface shape of uncoated and coated resonator, adjusting the position of resonator by seven-dimensional adjusting frame, reconstructing complete surface shape using splicing algorithm, comparing the surface shape data before and after coating, and then calculating the stress of resonator by deduced stress and strain formula.The present application can directly detect the coating thermal stress of resonator, without damaging the resonator and film, and has high detection efficiency, while ensuring the accuracy of detection.

There is provided a quantum processor comprising a plurality of qubits, wherein the qubits are arranged such that direct interactions between any two qubits are suppressed, a harmonic oscillator mode coupled transversally to the plurality of qubits, a plurality of adiabatic driving lines associated with said plurality of qubits, wherein each adiabatic driving line is configured for driving a respective qubit with an adiabatic driving signal and a control module configured to drive concurrently at least a first qubit and a second qubit by their respective adiabatic driving lines with a first and second adiabatic driving signals and adjust a first waveform of the first adiabatic driving signal and a second waveform of the second adiabatic driving signal to establish a ZZ gate between the at least first and second qubits.

The utility model relates to the technical field of spring stiffness coefficient detection, in particular to a spring stiffness coefficient measuring device. Comprising a mounting seat, a first suspension part, a harmonic oscillator, a first sliding seat in sliding connection with the mounting seat, an amplitude calibration block fixedly mounted on the first sliding seat, a sensing frame in sliding connection with the amplitude calibration block and a sensor mounted on the sensing frame, the first suspension part is fixedly mounted at the top of the mounting seat, and first scales are arranged on the mounting seat; the first sliding seat is provided with first vernier scales, the sensor is connected with the sensing frame in a sliding mode, the sensor is provided with a sensor sensing opening, and the top face of the amplitude calibration block can abut against the bottom face of the harmonic oscillator. According to the spring stiffness coefficient measuring device, the position of the sensor is moved upwards, so that the sensor can still detect the passing of the harmonic oscillator after the vibration amplitude of the spring is reduced, the measurement error of the vibration period is further reduced, and the calculation precision of the spring stiffness coefficient is improved.

A surgical instrument employs a mass-spring system to drive the periodic reversal of the rotational direction of a bone dissection head. The instrument comprises a housing, a harmonic oscillator contained in the housing, an output member at least partially received in the housing and configured to be driven by the harmonic oscillator to reversibly rotate about a longitudinal axis in alternating directions, a dissection head having an attachment portion configured to be selectively driven in alternating rotational directions by the output member to remove material from a target bone, and a controller operable to initiate and stop the harmonic oscillator.

This application discloses a method, apparatus, device, and medium for nonlinear drive gain compensation of a hemispherical resonator gyroscope, relating to the field of gyroscope attitude control technology. The method includes: exciting a resonator with different frequency drive voltages and obtaining a first amplitude control voltage and a second amplitude control voltage corresponding to the resonator maintaining a preset constant amplitude; determining target parameters based on the first and second amplitude control voltages; obtaining the real-time vibration state of the target hemispherical resonator gyroscope operating in full-angle mode; determining a target drive gain correction coefficient based on the real-time vibration state and target parameters; and compensating for the nonlinear drive gain of the hemispherical resonator gyroscope based on the target drive gain correction coefficient. By obtaining different voltages corresponding to the resonator maintaining a preset constant amplitude and obtaining parameters characterizing the nonlinearity of the gyroscope drive, interference from other error sources is avoided, and the problem of incomplete compensation is solved.

The invention relates to a special tool for testing and trimming mass distribution defects of an uncoated harmonic oscillator, and belongs to the field of testing and trimming of quartz hemispherical harmonic oscillators. The lower base and the upper base are each of a cylindrical structure which is vertically arranged in the axial direction. The upper base is coaxially arranged at the top of the lower base; the transmission shaft is axially and vertically arranged at the axis of the upper base and the lower base; the two groups of ball bearings sleeve the upper and lower ends of the transmission shaft respectively; the ball bearing located on the upper portion is arranged on the inner wall of the upper base. The ball bearing located on the lower portion is arranged on the inner wall of the lower base. Taper holes are formed in the top ends of the transmission shafts; the collet chuck is embedded into the taper hole; the locking nut is sleeved on the outer wall of the joint of the collet and the transmission shaft; the interdigital capacitor seat is coaxially arranged at the top end of the upper base; the interdigital capacitor is coaxially mounted at the top of the interdigital capacitor seat; the fixed stud is mounted at the top of the collet chuck; according to the invention, the uncoated harmonic oscillator and the interdigital capacitor can be fixed, the harmonic oscillator can rotate relative to the interdigital capacitor, and the gap between the harmonic oscillator and the interdigital capacitor is ensured.

The invention discloses a system and a method for testing a metal harmonic oscillator. The system comprises a vacuum environment unit which is used for providing a test environment, in which the air resistance is smaller than a resistance threshold value and the interference is smaller than an interference threshold value, for a metal harmonic oscillator; the signal excitation unit is used for generating, amplifying and transmitting an excitation signal applied to the metal harmonic oscillator; the detection unit is used for carrying out vibration measurement on the metal harmonic oscillator to obtain a vibration signal of the metal harmonic oscillator; and the data analyzing and processing unit is used for analyzing the vibration signal. According to the invention, the technical problem of inaccurate high-precision vibration test of the metal harmonic oscillator in a complex environment is solved.