2 results about "MEMS magnetic field sensor" patented technology

The application provides a packaging structure of a thermal matching micro-nano magnetic field sensor and a packaging method thereof. The packaging structure comprises a substrate, a magnetic field sensing element and a cover plate. The substrate is provided with a receiving groove on one side surface, and the receiving groove is provided with an outgoing electrode area. The magnetic field sensing element is fixed in the receiving groove, and the pin electrode of the magnetic field sensing element is electrically connected with the outgoing electrode area. The cover plate is sealingly connected with the substrate to encapsulate the magnetic field sensing element in the receiving groove. The substrate and the cover plate are both made of glass. Through such a setting, the thermal expansion coefficient of the substrate made of glass is close to the thermal expansion coefficient of the magnetic field sensing element, so that stress accumulation caused by the mismatch of the thermal expansion coefficients of the two is effectively prevented, thereby reducing the warping and deformation of the packaging structure. The packaging structure can withstand large temperature fluctuations, has a significant advantage in a scene with frequent temperature environment changes, and provides a guarantee for the stable operation of the MEMS magnetic field sensor in a wide temperature range.

The invention discloses an MEMS magnetic field sensor and a manufacturing method thereof, and relates to the technical field of MEMS magnetic field sensors, the MEMS magnetic field sensor comprises a substrate and a coupled resonator, the substrate is provided with a cavity, and a suspension plate is formed; the coupled resonator comprises an electrode assembly and a magnetoelectric composite film, the electrode assembly comprises a bottom electrode layer, the bottom electrode layer is attached to the substrate, anchor point beams are arranged at the two ends of the suspension plate, and the anchor point beams are connected with the bottom electrode layer so that the suspension plate can be suspended on the cavity; the magnetoelectric composite film is attached to the bottom electrode layer, and a stress release hole is formed in the coupled resonator and communicated with the cavity. After the stress is applied, the stress is redistributed, and the stress originally concentrated in a certain area is dispersed into surrounding materials, so that the local maximum stress value is reduced, the stress concentration phenomenon is reduced, the residual stress can be effectively released, the residual stress of the MEMS magnetic field sensor is easier to release, and the reliability of the MEMS magnetic field sensor is improved. And the coupling manufacturing yield of the MEMS magnetic field sensor is greatly improved.