1 results about "MEMS magnetic field sensor" patented technology

The application provides a packaging structure of a thermal matching micro-nano magnetic field sensor and a packaging method thereof. The packaging structure comprises a substrate, a magnetic field sensing element and a cover plate. The substrate is provided with a receiving groove on one side surface, and the receiving groove is provided with an outgoing electrode area. The magnetic field sensing element is fixed in the receiving groove, and the pin electrode of the magnetic field sensing element is electrically connected with the outgoing electrode area. The cover plate is sealingly connected with the substrate to encapsulate the magnetic field sensing element in the receiving groove. The substrate and the cover plate are both made of glass. Through such a setting, the thermal expansion coefficient of the substrate made of glass is close to the thermal expansion coefficient of the magnetic field sensing element, so that stress accumulation caused by the mismatch of the thermal expansion coefficients of the two is effectively prevented, thereby reducing the warping and deformation of the packaging structure. The packaging structure can withstand large temperature fluctuations, has a significant advantage in a scene with frequent temperature environment changes, and provides a guarantee for the stable operation of the MEMS magnetic field sensor in a wide temperature range.