A mems magnetic field sensor with a folded beam structure and its preparation method

A magnetic field sensor and beam structure technology, applied in the direction of the size/direction of the magnetic field, instruments, measuring magnetic variables, etc., can solve the problems of low sensitivity, poor stability, complicated manufacturing process, etc., and achieve the effect of high sensitivity and high applicability

Active Publication Date: 2019-11-01
HEFEI UNIV OF TECH
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Problems solved by technology

[0006] The purpose of the present invention is to provide a new MEMS magnetic field sensor structure for the defects of complex manufacturing process, poor stability, and low sensitivity existing in the existing magnetic field sensors, so as to achieve high resolution, low power consumption, high sensitivity, and long life. Magnetic field sensor

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  • A mems magnetic field sensor with a folded beam structure and its preparation method
  • A mems magnetic field sensor with a folded beam structure and its preparation method
  • A mems magnetic field sensor with a folded beam structure and its preparation method

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Embodiment Construction

[0049] The structural features and technical details of the present invention will now be described in detail in conjunction with the accompanying drawings.

[0050] see figure 1 , 3 And 4, a kind of MEMS magnetic field sensor of folded beam structure, is made up of folded beam structure and substrate; The electrodes of the beam structure and the electrodes on the substrate form a variable capacitance; an insulating layer is provided on the upper surface of the folded beam structure, and a metal coil is provided on the insulating layer; after the current is passed through the metal coil, it is subjected to Lorentz in the magnetic field. The force makes the folded beam structure bend and deform, thereby changing the electrode spacing between the folded beam structure and the substrate, and realizing the change of the capacitance value; the capacitance change trend at both ends of the folded beam structure is opposite, forming a differential capacitance; the magnetic field is o...

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Abstract

The invention relates to a MEMS magnetic field sensor with a folded beam structure and a preparation method thereof. The sensor includes a centrally fixed metal T-shaped folded beam processed on a substrate. The electrodes formed by the folded beams and the electrodes on the substrate form a variable capacitance. The principle of the invention is that the metal coil processed on the T-shaped folded beam structure is subjected to the Lorentz force after the current is applied to cause the beam to bend and deform, thereby changing the distance between the two electrodes and realizing the change of the capacitance value. The magnitude of the magnetic field can be measured by detecting the change in capacitance. The folded beam structure can effectively support the movable plate and provide a smaller equivalent elastic coefficient than the traditional structure. Compared with the traditional torsion beam structure, it can reduce various residual stresses in the sensor processing process and improve the sensor's performance. sensitivity, reducing its power consumption. Because the T-shaped folded beam structure of the sensor can release the stress, thereby increasing its service life.

Description

technical field [0001] The invention relates to a structure and a manufacturing method of a torsional high-sensitivity MEMS magnetic field sensor, and the invention belongs to the fields of MEMS sensors and micro-nano processing. Background technique [0002] Magnetic field sensor is one of many sensors. Magnetic field sensors play an important role in the fields of physics, machinery and military affairs. The magnetic field sensor is placed in the magnetic field, and the sensor can identify the direction and strength of the magnetic field. When combined with permanent magnets, non-contact measurement of changes in current, speed, angle, etc. can be realized; magnetic field sensors can be used in industrial production for real-time detection and control of the manufacturing process; at the same time, in the development of mineral resources and medical electronics It is also widely used in other fields. [0003] MEMS magnetic field sensor is a new type of magnetic field se...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R33/02
CPCG01R33/0286
Inventor 张鉴徐雪祥戚昊琛徐冬雨王建吴宗泽
Owner HEFEI UNIV OF TECH
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