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Preparation method of mems magnetic field sensor using folded beam structure

一种磁场传感器、梁结构的技术，应用在磁场的大小/方向、仪器、测量磁变量等方向，能够解决制作工艺复杂、灵敏度低、稳定性差等问题，达到提高灵敏度、不易材料疲劳断裂、好机械性能稳定性的效果

Active Publication Date: 2022-06-07
WENZHOU UNIV +1
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AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a new MEMS magnetic field sensor structure for the defects of complex manufacturing process, poor stability, and low sensitivity existing in the existing magnetic field sensors, so as to achieve high resolution, low power consumption, high sensitivity, and long life. Magnetic field sensor

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  • Preparation method of mems magnetic field sensor using folded beam structure
  • Preparation method of mems magnetic field sensor using folded beam structure
  • Preparation method of mems magnetic field sensor using folded beam structure

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Embodiment Construction

[0050] Presently combined with the accompanying drawings in detail the structural characteristics and technical details of the present invention.

[0051] See Figure 1 、 3and 4, using a mems magnetic field sensor with a folded beam structure, consisting of a folded beam structure and a substrate; The material of the folded beam structure is metal and is T-shaped; The folded beam structure itself becomes an electrode, and there is an electrode on the substrate; The electrodes of the folded beam structure form a variable capacitance with the electrodes on the substrate; An insulating layer is provided on the upper surface of the folded beam structure, and a metal coil is provided on the insulation layer; After the metal coil is introduced into the current, it is subjected to the Lorentz force in the magnetic field to bend and deform the folded beam structure, thereby changing the electrode spacing between the folding beam structure and the substrate, and realizing the change of the ...

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Abstract

The invention relates to a MEMS magnetic field sensor adopting a folded beam structure, a preparation process and an application. The sensor includes a centrally fixed metal T-shaped folded beam processed on a substrate. The electrodes formed by the folded beams and the electrodes on the substrate form a variable capacitance. The principle of the invention is that the metal coil processed on the T-shaped folded beam structure is subjected to the Lorentz force after the current is applied to cause the beam to bend and deform, thereby changing the distance between the two electrodes and realizing the change of the capacitance value. The magnitude of the magnetic field can be measured by detecting the change in capacitance. The folded beam structure can effectively support the movable plate and provide a smaller equivalent elastic coefficient than the traditional structure. Compared with the traditional torsion beam structure, it can reduce various residual stresses in the sensor processing process and improve the sensor's performance. sensitivity, reducing its power consumption. Because the T-shaped folded beam structure of the sensor can release the stress, thereby increasing its service life.

Description

Technical field [0001] The present invention relates to a torsional high sensitivity MEMS magnetic field sensor structure and production method, the present invention belongs to the meMS sensor field and micro-nano processing field, specifically: the use of a folded beam structure of MEMS magnetic field sensor, preparation process and use. Background [0002] Magnetic field sensors are one of many sensors. Magnetic field sensors play an important role in physical, mechanical, and military fields. By placing a magnetic field sensor in a magnetic field, the sensor is able to identify the direction and intensity of the magnetic field. When combined with a permanent magnet, non-contact measurement of changes in current, speed, angle and so on can be realized; Magnetic field sensors can be used for real-time detection and control of the manufacturing process in industrial production; At the same time, it is also widely used in the fields of mineral resource development and medical ele...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R33/028
CPCG01R33/0286
Inventor 戚昊琛张鉴徐雪祥王建
Owner WENZHOU UNIV
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