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LTCC (Low Temperature Co-fired Ceramic) lowpass filter

A low-pass filter and parallel technology, applied in the field of electronics, can solve the problems of not finding and reducing the size and area of ​​the device, and achieve the effects of low cost, reduced insertion loss, and good frequency selectivity

Inactive Publication Date: 2012-02-15
西安瓷芯光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, only relying on the traditional thick film, thin film and high temperature co-fired ceramic (HTCC) process technology still has not found a design method to effectively reduce the size of the device

Method used

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  • LTCC (Low Temperature Co-fired Ceramic) lowpass filter
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  • LTCC (Low Temperature Co-fired Ceramic) lowpass filter

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Embodiment Construction

[0028] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] Such as figure 1 and figure 2 As shown, the present invention is an elliptic low-pass filter with three transmission zeros, which is not removed when the equivalent circuit affected by the packaging structure is not considered figure 1 C1, but if considering the impact of the package structure on this low-pass filter, C1 must be removed to achieve three transmission zeros, and the out-of-band rejection can meet the requirements. The specific connection method has been described in detail in the summary of the invention, and only the specific three-dimensional implementation method is described here as follows:

[0030] Such as image 3 as shown, image 3 A total of 17 layers are drawn in the middle, and the bottom and top packaging layers are not drawn, and in order to facilitate the description of the connection relationship, the...

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Abstract

The invention discloses an LTCC (Low Temperature Co-fired Ceramic) lowpass filter which comprises an input end and an output end, wherein the input end is connected with input ends of the first pair of LC parallel harmonic oscillators (L2, C2), output ends of the first pair of LC parallel harmonic oscillators are connected with input ends of the second pair of LC parallel harmonic oscillators (L4, C4), output ends of the second pair of LC parallel harmonic oscillators are connected with input ends of the third pair of LC parallel harmonic oscillators (L6, C6), and output ends of the third pair of LC parallel harmonic oscillators are connected with the output end of the lowpass filter; parallel grounding capacitors C3 are arranged between connecting points of the first pair of LC parallel harmonic oscillators and the second pair of LC parallel harmonic oscillators and ground, parallel grounding capacitors C5 are arranged between connecting points of the second pair of LC parallel harmonic oscillators and the third pair of LC parallel harmonic oscillators and the ground, and parallel grounding capacitors C7 are arranged between connecting points of the third pair of LC parallel harmonic oscillators and the ground. The filter adopts a standard encapsulation structure, has the advantages of small volume, low cost, good frequency selecting property, good temperature stability and the like and is favorable to massive production.

Description

technical field [0001] The invention belongs to the field of electronic technology, and relates to a low-pass filter, in particular to a low-temperature co-fired ceramic (LTCC) low-pass filter considering the packaging structure. Background technique [0002] The low-pass filter is an important passive component in the RF front-end section. A good low-pass filter should not only have transmission characteristics of low in-band loss and high out-of-band rejection, but also have steep frequency cut-off characteristics and as small a volume as possible, especially with the miniaturization, Today, the direction of lightweight development. [0003] The traditional low-pass filter can only adopt a planar structure, which occupies too much chip area to meet the miniaturization requirements of the RF front-end. Moreover, the traditional low-pass filter does not consider the impact of the packaging structure. [0004] In order to meet the miniaturization needs of communication equi...

Claims

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Application Information

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IPC IPC(8): H01P1/20H03H7/01
Inventor 邢孟江李春宇李小珍邢孟道姚帅卢启军赵海忠
Owner 西安瓷芯光电科技有限公司
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