2results about How to "Increase steepness" patented technology

The application provides a stamping mold for manufacturing a printed circuit board based on a stamping technology and a preparation method thereof, the stamping mold is prepared based on an mSAP process in a PCB process, and the preparation method comprises the following steps: providing a substrate, preparing a to-be-stamped pattern layer on the substrate, preparing a preset metal plating layer on the to-be-stamped pattern layer, and preparing an anti-sticking treatment layer on the preset metal plating layer. The stamping mold is prepared by using an improved semi-additive process (mSAP), a preset metal plating layer is formed on the surface of the stamping mold, an anti-sticking treatment layer is formed by performing anti-sticking treatment on the preset metal plating layer, the stamping technology is applied to the manufacturing of the PCB, metal circuits are prepared through the PCB process, and the stamping mold is suitable for large-size PCBs. The uniformity of circuits with inconsistent complex feature sizes can be greatly improved, the steepness is high, the process stability is good, batch production can be ensured, and the requirements of hardness, tensile strength and the like of the mold in the PCB stamping process can be easily met.

The application provides a thick film positive photoresist composition, a preparation method and application thereof. The thick film positive photoresist composition comprises 70-90 parts of a base resin, 10-30 parts of a photosensitive compound and 100-150 parts of a solvent A; the base resin comprises a benzophenone modified phenolic resin and optionally an unmodified phenolic resin; the mass percentage of benzophenone groups in the base resin is 0.8-7.5% based on 100% of the mass percentage of the base resin; the photosensitive compound comprises a non-benzophenone photosensitive compound and optionally a benzophenone compound; the mass percentage of the benzophenone compound is less than or equal to 3.0% based on 100% of the mass percentage of the photosensitive compound. The application improves the uniformity of the benzophenone structure in the thick film positive photoresist composition by designing the specific composition of the thick film positive photoresist composition, thereby improving the steepness of the photoresist and realizing the development of the pattern.