The invention discloses a method for manufacturing a novel terahertz ultra-wide pass band filter. The method includes cleaning a substrate, coating a polyimide film on the substrate, coating a photoresist lift off resist (LOR) on the polyimide film and drying, coating a photoresist AZ1500 on the photoresist LOR and drying, exposing the photoresist, subjecting the exposed photoresist to development and drying, vaporizing a first layer of metal on the photoresist AZ1500 and the exposed polyimide film, soaking the substrate which is subjected to vaporizing the first layer of metal in an acetone solution for lift-off, coating the polyimide film on the substrate and curing, vaporizing a second layer of metal on the photoresist AZ1500 and the exposed polyimide film, soaking the substrate which is subjected to vaporizing the second layer of metal in the acetone solution for lift-off, coating the polyimide film on the substrate and curing, removing the substrate, and lifting off the substrate and the polyimide film. The method for manufacturing the novel terahertz ultra-wide pass band filter has the advantage that the expansion of frequency bands is achieved.