5 results about "Lift-off" patented technology

Lift-off process in microstructuring technology is a method of creating structures (patterning) of a target material on the surface of a substrate (e.g. wafer) using a sacrificial material (e.g., Photoresist). It is an additive technique as opposed to more traditional subtracting technique like etching. The scale of the structures can vary from the nanoscale up to the centimeter scale or further, but are typically of micrometric dimensions.