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1 results about "Lift-off" patented technology
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Lift-off process in microstructuring technology is a method of creating structures (patterning) of a target material on the surface of a substrate (e.g. wafer) using a sacrificial material (e.g., Photoresist). It is an additive technique as opposed to more traditional subtracting technique like etching. The scale of the structures can vary from the nanoscale up to the centimeter scale or further, but are typically of micrometric dimensions.
Process for lifting off a protective film of a screen glass based on the cooperation of the corner lifting and the rolling pressure
The present application discloses a kind of based on lifting angle and rolling cooperation formula screen glass protective film of display film stripping process, including steps: S1, lifting angle;S2, tear off;S3, film collection.The cooperation of film tearing clamp and roller in the present application, keep rolling and tearing position alignment gradually stripping, while based on the angle between the junction section and screen glass gradually increases based on the junction section under the stress of adhering section, not only greatly improve the success rate of forming inversion tearing angle, but also reduce the probability of protective film corner tearing or protective film tape separation;On the other hand, based on the relative motion of glass and film tearing clamp to improve the complete tearing rate of protective film, not only reduce the risk of protective film tearing, but also more energy-saving, more quickly diagonal tearing, while based on the pulling formed by film collection clamp and film tearing clamp, combined with the formed airflow blowing cooperation, not only improve the integrity of film collection, but also solve the problem of film tearing tape adhering film tearing clamp, and then improve the continuity of protective film stripping.
Owner:SUZHOU GUANGSAO OPTOELECTRONICS TECH CO LTD