8 results about "Lift-off" patented technology

The invention relates to a protective film uncovering process based on corner lifting and rolling cooperation type screen display glass. The protective film uncovering process comprises the following steps: S1, corner lifting; s2, tearing off; and S3, collecting the film. On one hand, through cooperation of the film tearing clamping jaw and the rolling wheel, step-by-step peeling with the rolling position and the peeling position aligned is kept, meanwhile, the angle between the connecting section and the screen display glass is gradually increased on the basis that the connecting section is turned inwards under the condition that the adhesion section is not stressed, the success rate of forming an inwards-turned peeling angle is greatly increased, and the production efficiency is improved. The probability that the film-tearing adhesive tape is separated from the protective film or the corner of the protective film is torn is reduced; on the other hand, the complete tearing rate of the protective film is increased based on the relative movement of the glass and the film tearing clamping jaw, the tearing risk of the protective film is reduced, more labor-saving and faster diagonal tearing is achieved, meanwhile, based on pulling formed by the film collecting clamping jaw and the film tearing clamping jaw and airflow blowing cooperation formed by the film collecting clamping jaw and the film tearing clamping jaw, the completeness of film collecting is improved, and the production efficiency is improved. And the problem that the film tearing adhesive tape is adhered to the film tearing clamping jaw is solved, so that the continuity of peeling off the protective film is improved.

The invention discloses a lifting turnover mechanism for wafer electroplating and an electroplating method, the lifting turnover mechanism adopts a lifting assembly, a rotating assembly and a turnover assembly which are independently driven, and a main shaft is driven to rotate through a hollow rotating motor which is coaxially arranged at a high position. The key design lies in that the mechanical structure ensures that when the wafer is overturned to be in a vertical state, the center of the wafer coincides with the rotating axis of the main shaft, and the rotating motor body is located above the wafer movement space to avoid interference. The method applying the mechanism is characterized in that the wafer is driven to be vertically immersed in and lifted away from the electroplating liquid in a mode of vertically rotating around the center line of the wafer, and the wafer is kept rotating in the whole electroplating process. Immersion bubbles can be thoroughly eliminated, extremely high coating uniformity is obtained, mechanism movement is decoupled, control is accurate, and reliability is high.

The present application discloses a kind of based on lifting angle and rolling cooperation formula screen glass protective film of display film stripping process, including steps: S1, lifting angle;S2, tear off;S3, film collection.The cooperation of film tearing clamp and roller in the present application, keep rolling and tearing position alignment gradually stripping, while based on the angle between the junction section and screen glass gradually increases based on the junction section under the stress of adhering section, not only greatly improve the success rate of forming inversion tearing angle, but also reduce the probability of protective film corner tearing or protective film tape separation;On the other hand, based on the relative motion of glass and film tearing clamp to improve the complete tearing rate of protective film, not only reduce the risk of protective film tearing, but also more energy-saving, more quickly diagonal tearing, while based on the pulling formed by film collection clamp and film tearing clamp, combined with the formed airflow blowing cooperation, not only improve the integrity of film collection, but also solve the problem of film tearing tape adhering film tearing clamp, and then improve the continuity of protective film stripping.

According to the device and method for continuously preparing the three-dimensional porous copper foil, on the basis of a copper foil roll-to-roll production structure, an annular porous template forms a transmission closed loop with tension based on a driving substrate and a template guide roller unit; a copper foil base material is continuously conveyed to the position between the annular porous template and the driving base plate through the copper foil multi-stage guide roller unit, the copper foil base material and the annular porous template can be tightly attached due to the tension effect of the annular porous template, etching liquid is sprayed to the surface of the attached annular porous template, and then the copper foil base material and the annular porous template are tightly attached. The annular porous template flows to the etching side of the copper foil base material for etching only through the through holes in the surface of the annular porous template, and under the guide action of the template guide roller unit and the copper foil multi-stage guide roller unit, the attachment and separation of the annular porous template and the copper foil base material can be controlled, and the transmission direction of the copper foil base material can be adjusted; the etching liquid is separated from the surface of the copper foil base material under the action of gravity, large-scale and continuous preparation of the three-dimensional porous copper foil can be achieved, and the industrial production requirement is met.

The invention relates to a method for laying wires (1) on a substrate (5), wherein a laying head is used for guiding, laying, and / or contacting the wires, wherein the substrate (5) is attached to a substrate holder, and wherein a substrate (5) is used which has a recess (4) at at least one intersection point of two or more wires (1), such that when laying a wire (1), the laying head is guided over at least one already laid wire (1) at the intersection point without lifting off and / or without moving out of a plane of the substrate (5) in a z-direction (Z) and / or without jumping, wherein the at least one already laid wire (1) is displaced into the recess (4). Alternatively, the recess (4) can be formed in the substrate holder.

The invention discloses an atomic gas chamber with a three-dimensional non-magnetic heating coil and a manufacturing method, and mainly relates to the field of MEMS microstructure manufacturing processes. The atomic gas chamber comprises a glass circular tube, a cover plate and a heating coil. The manufacturing method of the atomic gas chamber comprises the following steps: cleaning, cutting and polishing the end surface of a circular tube drawn by glass optical fibers, welding a cover plate by laser, and adding alkali metal; the heating coil is arranged on the outer side face of the glass round tube through the processes of Cr shading layer sputtering, photoresist coating, rotary exposure, Cr / Au sputtering and Lift off so as to achieve magnetic field self-shielding, the heating face is perpendicular to the light-transmitting face, and the heating coil is prevented from blocking light rays. According to the atomic gas chamber with the three-dimensional non-magnetic heating coil and the manufacturing method, the problems that the side wall of the atomic gas chamber is rough and the heating coil blocks light in the prior art are solved, and the problem that the coil generates an extra interference magnetic field in electric heating is solved through mutual shielding of magnetic fields of the heating coil.

The invention discloses a chip packaging method for reducing plastic package flash. The method comprises the following steps: forming a protective layer on the front surface of a wafer; cutting the wafer into a plurality of single chips; a plurality of single chips are installed on the surface of the first glass substrate to realize chip reconstruction; plastic packaging: the first glass substrate and the adhesion layer are peeled off; removing the protective layer; manufacturing a rewiring layer and an under bump metallization layer; carrying out ball mounting; and cutting a finished product into a plurality of independent packaging bodies. According to the invention, the protection layer is added when the wafer is fed, so that the EMC flash material of plastic package during Molding or the EMC foreign matter generated during demolding and the EMC foreign matter generated during Debonding fall on the protection layer, the photolysis or Lift process is carried out on the protection layer after Debonding, the protection layer is photolyzed or dissolved, the EMC flash material or the foreign matter adheres to the protection layer, and the EMC flash material or the foreign matter falls off along with the photolysis or lift off of the protection layer. Therefore, the purpose of removing EMC flash and foreign matters is achieved.