The invention discloses a high-reliability three-dimensional integrated direct sampling
software radio architecture
radio frequency microsystem, which is based on a direct sampling
software radio system architecture and a multi-layer glass-based TGV adapter plate
wafer-level bonded POP three-dimensional stacked packaging architecture. A high-performance glass antenna,
silicon-based
single core particle Fan-in and Fan-out packaging, mixed multi-
core particle integration of an embedded glass-based TGV adapter plate, mixed bonding integration of a
silicon-based digital TSV adapter plate and the glass-based TGV adapter plate are combined, and a glass antenna, a direct sampling
core particle, a
silicon-based computing power circuit, a silicon-based storage circuit and a silicon-based interface circuit are integrated. And the three-dimensional heterogeneous integration of the
microsystem is realized. According to the micro-
system, a glass substrate is used as a main body packaging material, a
radio frequency circuit and a digital-analog
hybrid circuit are fused, three-dimensional heterogeneous integration from a glass antenna to a
baseband storage and calculation
integrated processing circuit is realized, and a complete integrated airtight packaging micro-
system is formed and can cover a DC-20GHz
frequency band.