This invention discloses a
broadband multi-stage Gysel power divider based on IPD technology, comprising a
microstrip structure layer, first and second
dielectric substrates, and a grounding
metal layer. The
microstrip structure layer adopts a multi-layer nested structure, with each nested layer consisting of cascaded multi-stage Gysel power distribution units, disposed on the upper surface and inside the first
dielectric substrate, forming an integrated
layout based on IPD technology. This
layout integrates a planar spiral structure, air bridges,
parallel plate capacitors, thin-film resistors, and a layered grounding
unit structure. The planar spiral structure is equivalent to a specific
characteristic impedance transmission line; the
air bridge structure solves
crosstalk and suppresses
parasitic capacitance; the
parallel plate capacitor structure calibrates its equivalent
reactance parameters; the thin-film
resistor effectively improves port isolation and heat dissipation; and the layered grounding
unit structure enhances heat dissipation and grounding reliability. This invention can achieve stable power distribution over a wide
frequency band, adapting to the integration requirements of high-frequency, high-power, and miniaturized RF front-ends.